• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.423-429
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• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.573-573
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• 2012

High quality $VO_2$ thin films were successfully grown on GaN substrate by optimizing oxygen partial pressure during the growth using RF sputtering technique. The $VO_2$ thin film grown on GaN substrate exhibited an unusual metal insulator transition behavior, which was known to be observed only either in doped sample or under uniaxial stress. Raman spectra also confirmed that metal insulator transition occurred from monoclinic M1 to rutile R phase via monoclinic M2 phase with increasing temperature. We believe that large lattice mismatch between $VO_2$ and GaN substrate may cause M2 phase to be thermodynamically stable. Optical transmittance and its electrical switching behavior were carefully investigated to elucidate the underlying physics of its metal insulator transition behavior. This study may lead to a unique opportunity to better understand the growth mechanism of M2 phase dominant $VO_2$ thin films.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1119-1120
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• 2007

Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by 'artial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.24-25
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• 2007

Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by "partial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.59-63
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• 2013

In this paper, the impact of the copper densities of substrate layers on IC package warpage is studied experimentally and numerically. The substrate strips used in this study contained two metal layers, with the metal densities and patterns of these two layers varied to determine their impacts. Eight legs of substrate strips were prepared. Leg 1 to leg 5 were prepared with a HD (high density) type of strip and leg 6 to leg 8 were prepared with UHD (ultra high density) type of strip. The top copper metal layer was designed to feature meshed patterns and the bottom copper layer was designed to feature circular patterns. In order to consider the process factors, the warpage of the substrate bottom was measured step by step with the following manufacturing process: (a) bare substrate, (b) die attach, (c) applying mold compound (d) and post reflow. Furthermore, after the post reflow step, the substrate strips were diced to obtain unit packages and the warpage of the unit packages was measured to check the warpage trends and differences. The experimental results showed that the warpage trend is related to the copper densities. In addition to the experiments, a Finite Element Modeling (FEM) was used to simulate the warpage. The nonlinear material properties of mold compound, die attach, solder mask, and substrate core were included in the simulation. Through experiment and simulation, some observations were concluded.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.9
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• pp.1081-1092
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• 2004

The synthesis of Ni-catalyzed multi-walled carbon nanotubes and nanofibers on a catalytic metal substrate, using an ethylene fueled inverse diffusion flame as a heat source, was investigated. When the gas temperature was varied from 1,400K to 900K, approximately, carbon nanotubes with diameters of 20∼60nm were formed on the substrate. In the regions where the gas temperature was higher than 1,400K or lower than 900K, iron nanorods or carbon nanofibers were synthesized, respectively. Based on the quantitative analyses of large amount of SEM and TEM images, the nanotubes formed closer to the flame had a tendency of having larger diameters. HR-TEM images and Raman spectra revealed that carbon nanotubes synthesized had multi-walled structures with some defective graphite layers at the wall. Based on the graphite mode of the Raman spectra, it was believed that the optimal synthesis could be obtained as the substrate was positioned at between 5.5mm and 5.0mm, from the flame axis.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1378-1383
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• 2003

Synthesis of carbon nanofibers on a metal substrate by an ethylene fueled inverse diffusion flame was illustrated. Stainless steel plates were used for the catalytic metal substrate. The effects of radial distance and residence time of the substrate were investigated. The role of hydrocarbon composition in the fuel was also viewed. Nanofibers with a diameter range of 30-70 nm were found on the substrate. The carbon nanofibers were formed and grown in the region from 4 to 5.5 mm from the central axis of a flame outside of the visible flame front in the radial direction. The minimum residence time required for the formation of carbon nanofibers were about 20 seconds, and over 60 seconds were required for the full-scale growth. The characteristic time of the formation of carbon nanofibers was much shorter than that of the substrate temperature growth. In this study, the variation in hydrocarbon composition had no significant effect on the formation and growth of the carbon nanofibers.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• Journal of Powder Materials
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• v.21 no.1
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• pp.28-33
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• 2014

This paper describes the surface modification effect of a Ti substrate for improved dispersibility of the catalytic metal. Etching of a pure titanium substrate was conducted in 50% $H_2SO_4$, $50^{\circ}C$ for 1 h-12 h to observe the surface roughness as a function of the etching time. At 1 h, the grain boundaries were obvious and the crystal grains were distinguishable. The grain surface showed micro-porosities owing to the formation of micro-pits less than $1{\mu}m$ in diameter. The depths of the grain boundary and micro-pits appear to increase with etching time. After synthesizing the catalytic metal and growing the carbon nano tube (CNT) on Ti substrate with varying surface roughness, the distribution trends of the catalytic metal and grown CNT on Ti substrate are discussed from a micro-structural perspective.