• 한국신재생에너지학회:학술대회논문집
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• 2011.11a
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• pp.99.2-99.2
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• 2011

Transparent conducting oxides (TCOs) supported on glass are widely used as substrates in PEC studies for photovoltaic hydrogen generation applications However, high sheet resistane ($10{\sim}15{\Omega}/cm^2$) and fragileness of glass-supported TCO substrates are the obstacles to produce the large area PEC cells. Such internal sheet resistance is detrimental to efficient collection of photogenerated majority charge carriers at the photoactive material and electrolyte interface. Moreover, these TCO substrates are very expensive and consume about 40~60% cost of the devices. Hence, a low sheet resistance of the substrate is a key point in improving the performance of PEC devices. Metallic substrates coated with a photoactive material would be a good choice for efficient charge collection. Such metal substrates based photanodes are best candidate for large-scale phtoelectrochemical water splitting for hydrogen generation. In this study, we report the enhanced PEC performance of $WO_3$ film on metal(chemical etched, bare) substrate. It is proposed that interface between $WO_3$ and the metal substrate is responsible for efficient charge transfer and demonstrated significant improvement in the photoelectrochmical performance. X-ray diffration and FESEM suduies reveled that $WO_3$ films are monoclinic, porous, polycrystalline with average grain size of ~50nm. Photocurrent of $WO_3$ prepared on metal substrates was measured in 0.5M $H_2SO_4$ electroyte under simulated $100mW/cm^2$ illumination.

• Resources Recycling
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• v.13 no.2
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• pp.3-8
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• 2004

A basic study on the recovery of heavy metals such as Zn, Ni, Cu and Fe ions from wastewater was carried out with the spent iron oxide catalyst, which was used in the Styrene Monomer(SM) production company. The heavy metals could be recovered more than 98％ with the spent iron oxide catalyst. The alkaline components of the spent catalyst could be precipitated the metal ions of the wastewater as metal hydroxides at the higher pH 10.6 in Ni, pH 8.0 in Cu, pH 6.5 in Fe, pH 8.5 in Zn. But the metal ions are adsorbed physically on the surface of the spent catalyst in the range of the pH of the metal hydroxides and pH 3.0, which is the isoelectric point of the iron oxide catalyst.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• Journal of Powder Materials
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• v.26 no.3
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• pp.201-207
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• 2019

Tungsten heavy alloys (W-Ni-Fe) play an important role in various industries because of their excellent mechanical properties, such as the excellent hardness of tungsten, low thermal expansion, corrosion resistance of nickel, and ductility of iron. In tungsten heavy alloys, tungsten nanoparticles allow the relatively low-temperature molding of high-melting-point tungsten and can improve densification. In this study, to improve the densification of tungsten heavy alloy, nanoparticles are manufactured by ultrasonic milling of metal oxide. The physical properties of the metal oxide and the solvent viscosity are selected as the main parameters. When the density is low and the Mohs hardness is high, the particle size distribution is relatively high. When the density is high and the Mohs hardness is low, the particle size distribution is relatively low. Additionally, the average particle size tends to decrease with increasing viscosity. Metal oxides prepared by ultrasonic milling in high-viscosity solvent show an average particle size of less than 300 nm based on the dynamic light scattering and scanning electron microscopy analysis. The effects of the physical properties of the metal oxide and the solvent viscosity on the pulverization are analyzed experimentally.

• Imaging Science in Dentistry
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• v.54 no.1
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• pp.49-56
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• 2024

Purpose: This study evaluated the impact of artifacts generated by metal crowns on the detection of proximal caries lesions in teeth at various distances using cone-beam computed tomography (CBCT). Additionally, the diagnostic impacts of tube current and metal artifact reduction (MAR) were investigated. Materials and Methods: Thirty teeth were arranged within 10 phantoms, each containing 1 first premolar, 1 second premolar, and 1 second molar. A sound first molar (for the control group) or a tooth with a metal crown was placed. Of the 60 proximal surfaces evaluated, 15 were sound and 45 exhibited enamel caries. CBCT scans were acquired using an OP300 Maxio unit (Instrumentarium, Tuusula, Finland), while varying the tube current (4, 8, or 12.5 mA) and enabling or disabling MAR. Five observers assessed mesial and distal surfaces using a 5-point scale. Multi-way analysis of variance was employed for data comparison, with P<0.05 indicating statistical significance. Results: The area under the curve (AUC) varied from 0.40 to 0.60 (sensitivity: 0.28-0.45, specificity: 0.44-0.80). The diagnostic accuracy was not significantly affected by the presence of a metal crown, milliamperage, or MAR(P>0.05). However, the overall AUC and specificity were significantly lower for surfaces near a crown (P<0.05). Conclusion: CBCT-based caries detection was not influenced by the presence of a metal crown, variations in milliamperage, or MAR activation. However, the diagnostic accuracy was low and was further diminished for surfaces near a crown. Consequently, CBCT is not recommended for the detection of incipient caries lesions.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.2 no.4
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• pp.643-652
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• 1998

This paper presents the characteristics of a relay station antenna with the newly designed back-plate structure which is composed of the U-shaped metal plate for suppression of the back lobe by edge diffraction. The back lobe level of the conventional type was about -20 dB in the -z direction ( 180 ) . In order to improve the characteristics, the U-shaped mesh type metal plate is considered, where the design condition of the model antenna satisfies the wide null point angle range with the back lobe level of -30 dB below in the -z direction. The design parameters with the minimum back lobe level such as the dipole length, the distance between dipole elements and the back plate size have been found by using the released NEC Win Pro code. The calculated and measured back lobe Bevel of model antenna have been obtained 48.48 dB and -45 dB at 325 MHz, respectively.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.88-94
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• 2002

Recently, the life cycle and the lead-time of a product are to be shortened in order to satisfy consumer's demand. It is thus important to reduce the time and cost in manufacturing trial products. Several technique have been developed and successfully commercialized in the market of RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome these problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP(High-Speed RP) process. HisRP is a new RP process that is combined high-speed machining with automatic filling. In filling process, Bi58-Sn alloy is chosen as filling material because of the properties of low-melting point, low coefficient of thermal expansion and no harm to environment. Also the use of filling wire it if advantage since it needs simple and flexible mechanism. Then the rapid product, for example a skull, is manufactured for aluminum material by HisRP process with an automatic set-up device thor 4-faces machining.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STD structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters. we studied the correlation between CMP thickness of STI using high selectivity slurry. DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased. the N-poly foot is deteriorated. and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point,, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by $100\AA$. 3.2 $u\AA$ of IDSN is getting better in base 1 condition. In POE 50% condition. 1.7 $u\AA$ is improved. and 0.7 $u\AA$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• Journal of Powder Materials
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• v.11 no.5
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• pp.412-420
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• 2004

The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.