• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• Journal of Korean Institute of Industrial Engineers
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• v.34 no.3
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• pp.337-343
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• 2008

The problem of determining the optimum metal plating thicknesses on the plane and curved surfaces of an electronic part is considered. A lower specification limit for the plating thickness is usually pre-specified. In most applications, the plating thickness on the curved surface is proportional to that on the plane surface. The proportion can be adjusted by adding chemical catalysts to the plating fluid. From the economic point of view, nonconforming items with a thickness smaller than the lower specification limit incur rejection costs, such as rework and scrap costs, while a thicker plating may incur an excessive material costs. In this article, an economic model is proposed for simultaneously determining the target plating thickness and the ratio of the plating thickness on the plane surface to that on the curved surface. An illustrative example demonstrates the applicability of the proposed model.

• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• Korean Journal of Environmental Biology
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• v.34 no.2
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• pp.116-123
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• 2016

The ecotoxicity tests for metal plating wastewater were conducted using Daphnia magna (D. magna) and Euglena agilis (E. agilis). Evaluation for sources of toxicity was performed by 1) Correlation analysis between the concentration of individual metals in the metal plating wastewater and the toxic effects on D. magna, 2) Toxicant identification evaluation methods including graduated pH method, EDTA procedure and sodium thiosulfate procedure, 3) Comparison of toxic effect value ($EC_{50}$ or $LC_{50}$) of individual metal on D. magna and it's concentration in the metal plating wastewater. To evaluate the possibility of E. agilis, a Korean domestic organism, as a test model organism for metal plating waste water, E. agilis toxicity test was also assessed using on-line euglena ecotoxicity system (E-Tox system). Based on toxicant characterization test using D. magna, it was expected that SS, oxidants and heavy metals are responsible for toxicity of metal plating waste water. Especially Cu, Hg, and Ag were the major cationic metals that caused toxicity. E. agilis is less sensitive than D. magna based on the $EC_{50}$ value however it shows prompt response to toxic test substances. E. agilis shows even a significant effect on the cell swimming velocity within 2 min to toxic metal plating wastewater. Our study demonstrates that E. agilis test can be a putative ecotoxicity test for assessing the quality of metal plating waste water.

• Membrane and Water Treatment
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• v.11 no.3
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• pp.179-187
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• 2020

Electrodialysis has been applied for treatment of industrial wastewater including metal electroplating. The wastewater from metal plating industries contains high concentrations of inorganics such as copper, nickel, and sodium. The ions in the feed were separated due to the electrical forces in the electrodialysis. The concentrate compartment is exposed to the elevated concentrations of the ions and yielded inorganic precipitations on the cation exchange membranes. The presence of organic matter in the metal plating wastewater affects complex interfacial reactions, which determines characteristics of inorganic scale fouling. The wastewater from a metal plating industry in practice was collected and the inorganic and organic compositions of the wastewater were analyzed. The performance of electrodialysis of the raw wastewater was evaluated and the effects of adjusting pH of the raw water were also measured. The integrated processes with neutralization and electrodialysis showed great removal of heavy metals sufficient to discharge to aquatic ecosystem. The organic matter in the raw water was also reduced by the neutralization, which might enhance removal performance and alleviate organic fouling in the integrated system.

• Journal of Surface Science and Engineering
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• v.19 no.3
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• pp.121-127
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• 1986

There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

• Environmental Engineering Research
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• v.12 no.1
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• pp.16-20
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• 2007

Toxicity of metal plating wastewater was evaluated by using acute toxicity tests on Daphnia magna. To identify toxicants of metal plating wastewater, several manipulations such as solid phase extraction (SPE), ion exchange and graduated pH adjustment were used. The SPE test had no significant effect on baseline toxicity, suggesting absence of toxic non-polar organics in metal plating wastewater. However, anion exchange largely decreased the baseline toxicity by 88%, indicating the causative toxicants were inorganic anions. Considering high concentration of chromium in metal plating wastewater, it is thought the anion is Cr(VI) species. Graduated pH test showing independence of the toxicity on pH change strongly supports this assumption. However, as revealed by toxicity confirmation experiment, the initial toxicity of metal plating wastewater (24-h TU=435) was not explained only by Cr(VI) (24-h TU = 725 at $280\;mg\;L^{-1}$). Addition of nickel($29.5\;mg\;L^{-1}$) and copper ($26.5\;mg\;L^{-1}$) largely decreased the chromium toxicity up to 417 TU, indicating antagonistic interaction between heavy metals. This heavy metal interaction was successfully predicted by an equation of 24-h $TU\;=\;3.67\;{\times}\;\ln([Cu]\;+\;[Ni])\;+\;79.44$ at a fixed concentration of chromium.

• Journal of Surface Science and Engineering
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• v.42 no.6
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• pp.301-310
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• 2009

Recently, it has been increasing for the eco-environment plating and surface treatment of eco-environment to decrease hazardous materials. Particular eco-environment can be applied to electronics or automotive parts of industry. In the case of mobile phone, if there were fired, the products bearing dye may be contaminated with the hazardous and wasted. we can obtain the original metal color by electro coloring by metal salt, get rid of hazardous gas, decrease the wasted sludges. Now, the industrial patent number is increasing in Korea, we can accomplish the development of green industry by supporting technical trend of the plating and surface treatment in eco-environment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• Carbon letters
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• v.9 no.2
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• pp.105-107
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• 2008

In this work, we employed an electroless nickel plating on glass fibers in order to enhance the electric conductivity of fibers. And the effects of metal content and plating time on the conductivity of fibers were investigated. From the results, island-like metal clusters were found on the fiber surfaces in initial plating state, and perfect metallic layers were observed after 10 min of plating time. The thickness of metallic layers on fiber surfaces was proportion to plating time, and the electric conductivity showed similar trends. The nickel cluster sizes on fibers decreased with increasing plating time, indicating that surface energetics of the fibers could become more homogeneous and make well-packed metallic layers, resulting in the high conductivity of Ni/glass fibers.