Journal of Korean Institute of Industrial Engineers (대한산업공학회지)

Korean Institute of Industrial Engineers (대한산업공학회)
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Optimum Parameter Values for A Metal Plating Process

금속도금공정에서의 최적 모수 값 결정

  • Kim, Young-Jin (Department of Systems Management and Engineering, Pukyong National University) ;
  • Hong, Sung-Hoon (Department of Industrial and Information Systems Engineering, Research Center of Industrial Technology, Chonbuk National University) ;
  • Lee, Min-Koo (Department of Information and Statistics, Chungnam National University) ;
  • Kwon, Hyuck-Moo (Department of Systems Management and Engineering, Pukyong National University)
  • 김영진 (부경대학교 시스템경영공학과) ;
  • 홍성훈 (전북대학교 산업정보시스템공학과 공업기술연구센터) ;
  • 이민구 (충남대학교 정보통계학과) ;
  • 권혁무 (부경대학교 시스템경영공학과)
  • Received : 2008.01.16
  • Accepted : 2008.05.07
  • Published : 2008.09.30
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Abstract

The problem of determining the optimum metal plating thicknesses on the plane and curved surfaces of an electronic part is considered. A lower specification limit for the plating thickness is usually pre-specified. In most applications, the plating thickness on the curved surface is proportional to that on the plane surface. The proportion can be adjusted by adding chemical catalysts to the plating fluid. From the economic point of view, nonconforming items with a thickness smaller than the lower specification limit incur rejection costs, such as rework and scrap costs, while a thicker plating may incur an excessive material costs. In this article, an economic model is proposed for simultaneously determining the target plating thickness and the ratio of the plating thickness on the plane surface to that on the curved surface. An illustrative example demonstrates the applicability of the proposed model.

Keywords

Acknowledgement

Supported by : Pukyong National University

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