• Journal of Ocean Engineering and Technology
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• v.1 no.1
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• pp.111-119
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• 1987

The corrosion fatigue crack propagation characteristics of SS41 steel in 3.5% NaCl solution have been evaluated for loading frequencies of 1Hz and 0.2Hz. A sine wave loading profile was used for fatigue testing. Each test was carried out at a constant stress ratio, R(0.1). The main results are summarized as follows; 1. Fatigue crack propagation rate was higher in 3.5% NaCl solution than in air, higher in the base metal than in the weld metal, and higher at f =0.2Hz than at f =1Hz. 2. The crack closure level of the base metal was not influenced by cyclic frequencies, but that of the weld metal was much influenced. 3. When the crack closure effect was eliminated in the evaluation of crack propagation characteristics by using $\Delta K_{eff}$, the envirommental influence was distinctly observed. At the base metal, crack propagation rate was enhanced by the hydrogen embrittlement, and the weld metal was reduced by the crac closure. 4. There was clearly observed hydrogen embrittlement and severely corroded aspect at fracture surface of lower frequency than that of higher frequency, and at that of base metal than that of the weld metal.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.552-556
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• 1997

The Direct Metal Prototyping(DMP), one of the rapid prototyping technologies, allows the manufacturing of three-dimensional metallic parts using metal powders directly from the CAD data. Laser power and scanning speed are the most important variables of the process. The objective of this study is to obtain the design data for laser power and scanning speed to bond metal powders effectively using the finite element method. To obtain the design values, a numerical analysis considering two-dimensional heat transfer during the sintering of metal powder layers of the process was performed. The laser beam has been modeled to have directionality in its heat flux distribution, i. e., in the scanning direction a Gaussian beam mode distribution has been assumed and in the thickness direction a square beam mode distribution. The three-dimensional irregular distribution of metal powders of the powder layer is idealized as two-dimensional distribution in which metal powders are located regularly and periodically on the plate. In this study the design values of laser power vs scanning speed have been obtained. Temperature distribution and temperature variation of the powder layers with respect to time have been predicted. The commputed dsign data will be useful in determining the initial conditions of the process.

• The Journal of Korean Academy of Prosthodontics
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• v.24 no.1
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• pp.151-164
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• 1986

The purpose of this study was to evaluate the marginal fit of metal ceramic crowns made by different techniques. The techniques were metal butt margin technique, platinum foil technique, shoulder powder techniques and wax technique. The latter three techniques were for the fabrication of collarless metal ceramic crowns. Ten crowns were made of each techniques, and marginal fit was evaluated using scanning electron microscope under X200 magnification. The results were as follows. 1. The marginal fit in the descending order were wax technique shoulder powder technique, platinum foil technique and metal butt margin, before cementation, and wax technique, shoulder powder technique, metal butt margin, and platinum foil technique, after cementation. 2. The fit of collarless metal ceramic crowns was comparable to metal ceramic crowns with metal butt margins. 3. There were no statistically significant differences between marginal fit of metal ceramic crowns made by different techniques.

• Steel and Composite Structures
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• v.47 no.2
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• pp.239-251
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• 2023

The stiffness evaluation of cracked base metal is of great guidance to fatigue crack reinforcement. By carrying out fatigue tests and numerical simulation of typical cracking details in steel box girder, the strain-degradation law of cracked base metal was analyzed and the relationship between base metal stress and its displacement (stiffness) was explored. The feasibility of evaluating the stress of cracked base metal based on the stress field at the crack tip was verified. The results demonstrate that the stiffness of cracked base metal shows the fast-to-slow degradation trend with fatigue cracking and the base metal at 50mm or more behind the crack tip basically lose its bearing capacity. Drilling will further accelerate stiffness degradation with the increase of hole diameters. The base metal stress has a negative linear relation with its displacement (stiffness), The stress of cracked base metal is also related to stress intensity factor and its relative position (distance, included angle) to the crack tip, through which the local stiffness can be effectively evaluated. Since the stiffness is not uniformly distributed along the cracked base metal, the reinforcement patch is suggested to be designed according to the stiffness to avoid excessive reinforcement for the areas incompletely unloaded.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.294.2-294.2
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• 2016

Graphene, a sigle atomic layered structure of graphite, has drawn many scientific interests for attractive future electronics and optoelectronics beyond silicon-based technology because of its robust physical, optical, and electrical properties. But high metal-graphene contact resistance prevents the successful integration of high speed graphene devices and circuits, although pristine graphene is known to have a novel carrier transport property. Meanwhile, in the recently reported metal-graphene contact studies, there are many attempts to reduce the metal-graphene contact resistance, such as doping and one-dimensional edge contact. However, there is a lack of quantitative analysis of the edge contact scheme through variously designed patterns with different metal contact. We first investigate the effets of edge contact (metal-graphene interface) on the contact resistance in terms of edge pattern design through patterning (photolithography + plasma etching) and electral measurements. Where the contact resistance is determined using the transfer length method (TLM). Finally, we research the role of metal-kind (Palladium, Copper, and Tianium) on the contact resistance through the edge-contacted devices, eventually minimizing contact resistance down to approximately $23{\Omega}{\cdot}{\mu}m$ at room temperature (approximately $19{\Omega}{\cdot}{\mu}m$ at 100 K).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.276-283
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• 2017

A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about $400^{\circ}C$, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around $900^{\circ}C$ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.

• Fashion & Textile Research Journal
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• v.8 no.4
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• pp.458-464
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• 2006

The adsorption ability of heavy metal ions from the aqueous solution by chitosan, which it is well known natural biopolymer, has been investigated. The fundamental study in this research is focusing on the physicochemical adsorption utilizing the chitosan as a organic chelating adsorbent, adsorb especially heavy metal ions from the waste liquid solution. The adsorption ability of the chitosan between metal ions, having different characteristics with Mw of 188,600, 297,200, and 504,200 g/mol and degree of deacetylation (DD) of 86.92% and 100% were investigated targeting on the $Ni^{2+}$, $Co^{2+}$, $Zn^{2+}$, and $Pb^{2+}$ ions, respectively. The uptake of heavy metal ions with chitosan was performed by atomic absorption flame emission spectrophotometer (AAS) as conducted residual metal ions. It was found that chitosan has an strong adsorption capacity for some metals under certain conditions. Chitosan, which have 100% degree of deacetylation showed high adsorption recovery ratio and have an affinity for all kinds of heavy metals. In contrast, the molecular weight of chitosan was not completely affected on metal ion adsorption.

• Journal of Korea Foundry Society
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• v.31 no.6
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• pp.354-361
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• 2011

The liquid metal shearing device was constructed and assembled with a commercial high-pressure die-caster in order to induce intensive turbulent shearing force on molten aluminum alloys. The effect of the liquid metal shearing on the microstructure and tensile properties of A356 alloys was investigated with the variation of iron content. The experimental results show that dendritic primary ${\alpha}$-Al phase was effectively modified into a equiaxed form by the liquid metal shearing. It was also found that the needle-like ${\beta}$-AlFeSi phase in a Fe containing A356 alloy was changed into a blocky shape resulting in the improved mechanical properties. Based on the mechanical properties, it was suggested that the iron content in A356 alloy could be more widely tolerated by utilizing the liquid metal shearing HPDC process.

• Journal of electromagnetic engineering and science
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• v.12 no.2
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• pp.176-184
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• 2012

In this paper, the effects of a metal plane on the performance of a meandered slot RFID antenna are evaluated in a real environment, and 3 metal plane cases are considered (the most likely scenarios in which metal conductive materials are placed near the tag antenna). The metal plane effects can be categorized as matching degradation and antenna gain variation. First, matching degradation due to the antenna's induced mutual impedance is experimentally investigated. In addition, the gain variation is investigated to figure out the change in the radiation characteristics. With the derived antenna parameters, the read range is calculated with the Friis transmission equation and measured to analyze the effects of a metal plane on RFID system performance. The calculated and measured read range varies from 9.3 m to 19.1 m as the distance between the RFID antenna and the metal plane changes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.