• Title/Summary/Keyword: Metal finish

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Glass to Metal Bonding by Electric Field (전장에 의한 유리와 금속의 접합)

  • 정우창;김종희
    • Journal of the Korean Ceramic Society
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    • v.20 no.1
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    • pp.70-78
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    • 1983
  • This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

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The Wetting Property of Sn-3.5Ag Eutectic Solder (Sn-3.5Ag 공정 솔더의 젖음특성)

  • 윤정원;이창배;서창제;정승부
    • Journal of Welding and Joining
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    • v.20 no.1
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    • pp.91-96
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    • 2002
  • Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

Design of a Magnetic Bearing System for a High Speed Grinding Spindle (연삭기용 자기베어링 주축계의 고속화에 관한 연구)

  • 박종권;노승국;안대균
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.11
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    • pp.233-243
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    • 1998
  • The demand of high speed machining is increasing due to the high speed cutting and grinding provides high efficiency of process, short process time, improved metal removal capacity and better surface finish. Active magnetic bearings allow much high surface speed than conventional ball bearings and therefore greatly suitable for high speed cutting or grinding. This paper describes a design process of an active magnetic bearing system for a high speed grinding spindle with power 5.5kW and maximum speed 60,000rpm. Magnetic actuators are designed by the magnetic circuit theory considering static load condition, and examined with FEM analysis. Dynamic characteristics are also considered, such as bandwidth, stiffness, natural frequency and static deflection. System characteristics are simulated with a rigid rotor model.

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Real-time Multi-sensing System for In-process monitoring of Chatter Vibration(l) (채터진동의 인프로세스 감시를 위한 실시간 복합계측 시스템(1))

  • Kim, Jeong-Suk;Kang, Myeong-Chang;Park, Cheol
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.10
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    • pp.50-56
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    • 1995
  • Chatter Vibration is an unwanted phenomenon in metal cutting and it always affects surface finish, tool life, machine life and the productivity of machining process. The real-time detection of the chatter vibration is is necessarily required to automation system. In this study, we constructed the multi-sensing system using Tool Dynamometer, Accelermeter and AE sensor. Especially, Acoustic Emission(AE) generated during turning was investigated the possibility for real-time detection of chatter vibration. Turning experiments were performed using carbide insert tip under realistic cutting conditions and tapered workpiece of SM45C. Consquently, the real-time detection using multi-sensing system can be used for Inprocess monitoring of chatter vibration.

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Practicality and prospect of full-zirconia restoration (풀지르코니아 수복물의 실용성과 전망)

  • Hwang, Jung-Won
    • Journal of the Korean Academy of Esthetic Dentistry
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    • v.24 no.2
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    • pp.101-121
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    • 2015
  • Zirconia polycrystalline (Y-TZP) showed better mechanical properties and superior resistance to fracture than other conventional dental ceramics. Zirconia-based ceramics have been successfully introduced into the clinic to fabricate fixed dental prostheses (FDPs), along with a dental computer-aided/computer-aided manufacturing (CAD/CAM) system. It has been clinically available as an alternative to the metal framework for fixed dental prostheses (FDPs). The most frequent clinical complication with zirconia-based FDPs was chipping of the veneering porcelain that was affected by many factors. Another option was full-contour zirconia FDPs using high translucent zirconia. Full-contour zirconia FDPs has many clinical advantages but it caused concern about the wear of antagonist enamel, because the hardness of Y-TZP was over double that of porcelain. However, many articles demonstrates that highly polished zirconia yielded lower antagonist wear compared with porcelains. In this article (1) advantages of full zirconia restorations, (2) clinical applications of zirconia restorations, (3) abutment preparation, (4) surface finish of zirconia restoration and antagonist enamel wear, (5) bond of zirconia with resin-based luting agents, (6) communication in clinical & lab.procedures for full zirconia restorations are reviewed.

AN ELECTROCHEMICAL STUDY ON SURFACE FINISH OF DENTAL AMALGAM (아말감의 표면연마에 관한 전기화학적 연구)

  • Suk, Chang-In;Um, Chung-Moon
    • Restorative Dentistry and Endodontics
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    • v.16 no.2
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    • pp.18-32
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    • 1991
  • The purpose of this study was to observe characteristic properties of amalgam through the polarization curves and SEM images from 4 type amalgams (Amalcap, Shofu spherical. Dispersalloy and Tytin) with 3 different surface finish procedures (polishing, burnishing and carving) by using the potentiostats (EG & GPARC) and SEM (Jeol JSM-35). After each amalgam alloy and Hg was triturated as the direction of the manufacturer by means of mechanical amalgamator (Samki), the triturated mass was inserted into the cylndrical metal mold which was 12 mm in diameter and 10 mm in height and was pressed with $100kg/cm^2$. 4 specimens of each type amalgam were burnished with egg burnisher and another 4 specimens of each type amalgam were carved with Hollenback carver. Above 8 specimens and remaining untreated 4 specimens were stored at room temperature for about 7 days. Untreated 4 specimens of each type amalgam were polished with abrasive papers (Deer) from #400 to #1200 and finally on the polishing cloth with $0.5{\mu}m$ and $0.06{\mu}m$ $Al_2O_3 $ powder suspended water. Anodic polarization measurements was employed to compare the corrosion behaviours of the amalgams in 0.9% saline solution at $37^{\circ}C$. The open circuit potential was determined after 30 minutes immersion of specimen in electrolyte. The scan rate was 1 mV/sec and the surface area of amalgam exposed to the solution was $0.64cm^2$ for each specimen. All the potentials reported are with respect to a saturated calomel electrode (SCE). SEM images of each specimen were taken after + 800 mV (SCE) polarization. The results were as follows: 1. The corrosion potential of high copper amalgam was more anodic than that of low copper amalgam. 2. The polished amalgam were more resistant to corrosion than any other burnished and carved amalgam. 3. In the case of polishing, current density of high copper amalgam was lower than that of low copper amalgam.

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A Study of the Interfacial Reactions between Various Sn-Ag-Cu Solder Balls and ENIG (Electroless Ni Immersion Gold) and Cu-OSP (Organic Solderability Preservative) Metal Pad Finish (다양한 조성의 Sn-Ag-Cu 합금계 무연 솔더볼과 ENIG(Electroless Ni Immersion Gold), Cu-OSP(Oraganic Solderability Preservertive) 금속 패드와의 계면 반응 연구)

  • Park, Yong-Sung;Kwon, Yong-Min;Son, Ho-Young;Moon, Jeong-Tak;Jeong, Byung-Wook;Kang, Kyung-In;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.4
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    • pp.27-36
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    • 2007
  • In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.

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A STUDY ON THE MARGINAL FIDELITIES AND FRACTURE STRENGTH OF IPS EMPRESS $2^(R)$ CERAMIC CROWNS (IPS Empress $2^(R)$를 이용한 전부도재관의 변연적합성과 파절강도에 관한 연구)

  • Yu, Ji-Hyoung;Kim, Yong-Cheol;Kang, Dong-Wan
    • The Journal of Korean Academy of Prosthodontics
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    • v.38 no.5
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    • pp.606-617
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    • 2000
  • The purpose of this study was to measure the marginal fidelities and the fracture strength of IPS Empress $2^{(R)}\;and\;In-Ceram^{(R)}$ ceramic crowns. After constructed of 12 experimental dies for each group, ceramic crowns were fabricated on the metal master dies prepared on the maxillary right premolar Marginal gaps were measured on the specimen between the margin of each crown and finish-ing line of the metal master die by using stereo-microscope($SZ-ST^{(R)}$ Olympus, Japan) and all specimens were cemented on the metal master die with Bistite $II^{(R)}$ (Tokuyama soda Co, LTD., Japan) resin cement. Finally marginal gaps were measured again. To measure of the fracture strength, buccal incline on the functional cusp of specimens were loaded until the catastrophic failure occurred by using the AGS-1000 $D^{(R)}$(Shimadzu, Japan). The result of marginal fidelities and fracture strength were statistically analyzed with the SPSS version 8.0 programs. The results of this study were as follows : 1. No significant difference was found in the mean marginal fidelities and fracture strength between the IPS Empress $2^{(R)}\;and\;In-Ceram^{(R)}$. 2. In comparison of marginal fidelities between before and after cementation, there was significant difference(P<0.05). The IPS Empress 2 system was shown in this study that had good marginal fidelities and fracture strength compared to In-Ceram ceramics. Although this system was acceptable to clinical applications, the system still has to be considered long-term researches about marginal fidelities and fracture strength due to the lack of data about the clinical researches.

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Suppression of Machine Tool Spindle Vibration by using TiC-SKH51 Metal Matrix Composite (TiC-SKH51 금속 복합재를 이용한 공작기계 주축 진동 억제에 관한 연구)

  • Bae, Wonjun;Kim, Sungtae;Kim, Yangjin;Lee, Sang-Kwan
    • Composites Research
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    • v.33 no.5
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    • pp.262-267
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    • 2020
  • With increasing demands for high-speed machining and lightweight design of machine tools, increasing likeliness of generation of machine tool spindle vibrations has become an important issue. Spindle vibration has a significant impact on the surface finish of the workpiece in ultra-precision machining. It is necessary to resolve the machine tool spindle vibration in various machining processes to improve machining accuracy. In this paper, a TiC-SKH51 metal-matrix composite was used to suppress the vibration of the machine tool spindle. To confirm the dynamic characteristic of the TiC-SKH51 composite, impact hammer tests were conducted. After verifying the reliability of a finite element analysis (FEA) by comparing the results of the impact hammer test with the modal analysis using FEA, the analysis of the machine tool spindle model was performed. The FEA results show that the TiC-SKH51 composite applied machine tool spindle can be utilized to suppress the vibration generation.

Multi-functional Finish of Polypropylene Nonwoven by Photo-induced Graft Polymerization (II) - Grafting of Styrene and Its Ammonia Adsorption Behavior - (광그라프팅에 의한 폴리프로필렌 부직포의 복합기능화 가공(II) -스티렌의 그라프트 반응 및 암모니아 흡착거동 -)

  • 김상률;최창남
    • Polymer(Korea)
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    • v.25 no.5
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    • pp.642-648
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    • 2001
  • An attempt was made to synthesize an ammonia adsorbent by the photo-induced grafting of styrene (St) onto polypropylene (PP) nonwoven using benzoin ethyl ether (BEE) as a photosensitizer with urea and trimethylol propane triacrylate in methanol medium. As styrene concentration was increased, the graft yield was increased. It was also found that the graft yield increased with reaction time. The polypropylene grafted with styrene (PP-g-St) was sulfonated by chlorosulfonic acid in dichloroethane and complexed with several metal ion, such as $cO^{+2}$, $nI^{+2}$, $cU^{+2}$, $Zn^{+2}$. The amount of ammonia gas adsorbed by these sample was dependent on the degree of sulfonation, adsorption time, and ammonia gas pressure. The adsorption capacity of ammonia gas by the sulfonated PP-g-St(SPP-g-St) nonwoven with 4. 25 mmol $H^+$/g was 6.61 mmol/g. Metal ion complexed SPP-g-St nonwovens had higher adsorption capacity than SPP-g-St nonwoven and the $Co^{+2}$ complexed SPP-g-St showed 9.90 mmol $NH_3$/g, which was much higher than that of active carbon or silica gel.

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