• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1605_1606
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• 2009

본 논문은 LED조명기구 방열설계의 열해석에 관한 것으로서 메탈 PCB에 Chip LED를 배치하여 COMSOL Multiphysics로 시뮬레이션한 결과 LED와 PCB의 경계면 온도는 약 $80^{\circ}C$이며, PCB의 바닥면까지는 약 $50^{\circ}C$까지 변화함을 검증 하였으며, 결과적으로 실 제작의 근사치에 가까운 방열설계가 가능함이 확인되었다.

• 자원리싸이클링
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• 제28권6호
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• pp.87-95
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• 2019

본 연구에서는 인쇄회로기판(PCB) 제조 공정 중 발생한 슬러지 내 구리를 회수하기 위한 건식야금 공정 변수에 대해 조사하였다. 에칭 및 도금 공정에서 발생한 슬러지는 전처리 공정을 통해 수분과 유기물을 제거하였다. 열역학 상평형 계산을 통해 평형상과 슬래그 시스템을 선정하였으며, 유가금속 회수율에 미치는 건식야금 공정 변수에 대하여 조사하였다.

• 자원리싸이클링
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• 제20권4호
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• pp.58-64
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• 2011

고온에서 PCB 처리를 통한 Au, Ag와 같은 귀금속뿐 아니라 Ni과 같은 주요 회유금속을 회수하기 위한 기초연구로서 CaO-$Al_2O_3$(-$SiO_2$) 및 CaO-$SiO_2$-$CaF_2$ 슬래그를 이용하여 Au, Ag, Ni의 회수거동올 관찰하였다. 슬래그 투입 없이 PCB만으로 용융실험을 수행한 결과 PCB는 거의 용융되지 않았으며, 이로부터 유도전류를 이용한 용융을 촉진할 뿐 아니라 유가금속의 회수를 위해서는 Cu와 갇은 적절한 base metal이 필요함을 확인하였다. 본 연구결과, PCB/Cu ratio는 1 이하가 바람직할 것으로 생각된다. CaO-$Al_2O_3$(-$SiO_2$) 및 CaO-$SiO_2$-$CaF_2$ 슬래그를 투입한 결과, $CaF_2$를 함유하는 fluorosilicate계 슬래그가 calcium aluminate계 슬래그보다 융점과 점도가 낮게 제어되었으며, 이로부터 Au, Ag, Ni의 높은 분배비를 얻을 수 있었다. 점도가 낮은 $CaF_2$ 함유 슬래그 적용 시 높은 유가금속 회수율은 슬래그 내에서 각 금속입자의 등속침강속도가 상승하기 때문인 것으로 평가되었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.515-516
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• 2010

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 학술대회 논문집 정보 및 제어부문
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• pp.273-275
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• 2005

Active thermography is being used since several years for remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements were performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.386-387
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• 2006

This study is about the recycling technology of scrap a PCB(printed circuit board) produced in home appliances or automobile industry. And we develop the recycling technology of cooper (Cu)which is contained to leaching solution. In stead of electrolytic collecting in existing sulphuric atmosphere, we apply process using the ammonia solution which is used in economizing energy. So m the process of electrolyzing scrap a PCB through the leaching and separation, we examine the effect of the nickel contained to the solution and the cooper degree of purity which is changed according to current density.

• 한국태양에너지학회 논문집
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• 제31권4호
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• pp.95-102
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• 2011

In this paper, the thermal performance of a heat spreader module for CPV(Concentrating Photovoltaic) cooling is experimentally investigated. In order to evaluate the thermal performance of the heat spreader module which consists of a Metal PCB and an aluminum alloy heat spreader, experiments are conducted with varying the type of the metal PCB, the thickness of the heat spreader, the inclination angle, and the applied heat flux. To validate the experimental data, three dimensional numerical simulations are performed using the commercial simulation tool in the present work. The experimental results are compared with the corresponding numerical results and are in close agreement with the numerical results. From the experimental results, the temperature difference between the maximum temperature and the ambient temperature increases with decreasing the thickness of the heat spreader and with increasing the applied heat flux. Also, it is found that the inclination angle significantly affects the thermal performance of the heat spreader. the maximum temperature difference of the heat spreader with the horizontal orientation is much larger than that with the vertical orientation.

• 한국전기전자재료학회논문지
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• 제26권11호
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• pp.846-851
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• 2013

Recently, energy harvesting technologies are considered as the great alternatives to reduce the dependency on secondary batteries. In this paper, we proposed PCB type energy harvester which can be directly integrated with other electronic components on same board. To form the three dimensional coil structure, two PCBs with patterned metal lines are solder bonded. For magnetic induction, inside of coil structure was filled with magnetic substance and rotary motioned external magnets are applied to near the harvester. The effects of metal wire width on PCB, thickness of magnetic substance, and frequency of rotary motion on energy harvesting performance are analyzed by computer simulation and experiments. Experimental results showed 29.89 ${\mu}W$ of power generation performance at the frequency of 5.2 Hz and it is shown that designed harvester can be effectively applied on vibration environment with very limited frequency.

• 조명전기설비학회논문지
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• 제24권12호
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• pp.57-63
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• 2010

The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.