• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• Resources Recycling
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• v.5 no.3
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• pp.37-43
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• 1996

The recovery of metals from printed circuit board(PCBs) scraps was investigated by utilizing a shape sorting method.After all electronic parts mounted on the board were removed. PCBs were pulverized to particles smaller than 1 mm by aswing hammer type impact mill in order to liberate metal components. Metals were separated from nonmetalliccomponents by an inclined vibrating plate (IVP). The metal separation efficiency was measured as a function of vihrationintensity and inclined angle. The maximum efficiency was obtained when IVP was operated at the vibration intensity(Kv)of 1.40 and the inclined angle of 10". The grade of the metal components was recovered from PCBs exceeding 90% byusing IVP.0% by using IVP.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.102-107
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• 2012

The purpose of thesis is to improve output of solar cell module by enhancing transmission efficiency. To improve transmission efficiency, transmission interconnection ribbon which is used to connect solar cells and busbar which contacts with it has been improved. To secure reliability, comparison research on output of solar cell modules has been conducted by manufacturing PCB module formed by laminated metal with the same output. The result of this research is based on a output efficiency test of modules by comparing electric conductivity of soldering busbar and laminated PCV type of busbar.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.291-294
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• 2003

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

• Applied Biological Chemistry
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• v.29 no.3
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• pp.273-278
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• 1986

PCBs was degraded by bacterium, which was classified as a strain of Alcaligenes aquamarinus. Its PCB-42 degradation was maximized when grown on mineral salts medium containing 0.1% of PCB-42 as a sole carbon source at $25^{\circ}C$ and initial pH $7.0{\sim}8.0$, and also shaking culture was effective for it. The addition of glucose and peptone were effective for the degradation of PCB-42, but metal ions were not effective.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.4
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• pp.319-327
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• 2020

In this study a methodology to evaluate fatigue life of the electronic parts for the fighter radar unit under random vibration loading is presented. To do this, one parameter for the 3-σ RMS quation of Steinberg fatigue model is modified to come up with a printed circuit board(PCB) with multiple electronic parts, while fundamental frequency and dynamic deflection of the PCB are calculated from a MATLAB based finite element computer code. For the RIFA structure selected in this study, the 3-σ RMS fatigue limit displacement is reduced to 0.741 times as much as the Steinberg model. This investigation allows to assess the life of multiple electronic parts mounted on the PCB with reinforced metal cover/body showing non-sinusoidal deflection patterns.

• Analytical Science and Technology
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• v.25 no.6
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• pp.421-428
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• 2012

In this study, PCDD/PCDFs, PAHs and PCBs in wastes from metal, plastic and wastewater treatment facilities were analyzed. The concentrations of PCDD/PCDFs ranged from 7.37~432.20 ng-TEQ/kg in fly ash, 0.51~855.01 ng-TEQ/kg in incinerated ash and 0.37~385.81 ng-TEQ/kg in dust. Dioxin content was lower, compared to data in foreign countries. PAHs concentration was in the range of 0.0075~2.9225 mg/kg for process sludge and 0.0035~1.6716 mg/kg for wastewater sludge, which satisfied all of the two standards (Nap, Ant, B(a)F:4/0.8, Phen, B(a)A:5/1, Flt:10/2.5, B(a)P:4.5/0.9) of the Marine Environment Management Act. PAHs concentration in process sludge and wastewater sludge were slightly lower than those abroad. According to the analysis of seven types of PCBs (in comparison with the first standard, 0.15 mg/kg), concentration was found in the range of 0.0~0.65 mg/kg, while PCB-52, PCB-101, PCB-138, PCB-153 and PCB-180 isomers were detected in excessive value in some machine oil and hydraulic fluid.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Resources Recycling
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• v.27 no.6
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• pp.23-29
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• 2018

Recently rapid economic growth and technological development have led to an increase in the generation of waste electrical and electronic equipment (WEEE). As the amount of electric and electronic waste generated increases, the importance of processing waste printed circuit boards (PCB) is also increasing. Various studies have been conducted to recycle various valuable metals contained in a waste PCB in an environmentally friendly and economical manner. To get anode slime containing Ag and Au, Anode copper prepared from PCB scraps was used by means of electro-refining. Ag and Au recovery was conducted by leaching, direct reduction, and ion exchange method. In the case of silver, the anode slime was leached at 3 M $HNO_3$, 100 g/L, $70^{\circ}C$, and Ag was recovered by precipitation, alkali dissolution, and reduction method. In the case of gold, the nitrate leaching residues of the anode slime was leached at 25% aqua regia, 200 g/L, $70^{\circ}C$, and Au was recovered by pH adjustment, ion exchange resin adsorption, desorption and reduction method. The purity of the obtained Au and Ag were confirmed to be 99.99%.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.9
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• pp.769-776
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• 2015

In this paper, a broadband MIMO antenna using the metal cover that is one of the antenna radiators is designed and implemented on the PCB. The proposed antenna consists of a monopole and an IFA fed by the coupling structure and a metal cover radiator. Therefore, a monopole and an IFA with a metal cover radiator operate simultaneously through a hybrid form of operation. The antenna satisfies VSWR 3:1 at the bands of LTE class 13, class 14, CDMA, GSM900, DCS, PCS, WCDMA, LTE class 40 and WiFi. The maximum ECC of diagonally fed MIMO antenna is 0.186. The measured average gain and efficiency were -5.14~-1.28 dBi and 30.87~74.48 % over the desire bands, respectively.