• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.550-557
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• 2021

With the advent of the fourth industrial revolution, the interest in the internet of things (IoT) in manufacturing is growing, even at foundries. There are several types of process data that can be automatically collected at a foundry, but considerable amounts of process data are still managed based on handwriting for reasons such as the limited functions of outdated production facilities and process design based on operator know-how. In particular, despite recognizing the importance of converting process data into big data, many companies have difficulty adopting these steps willingly due to the burden of system construction costs. In this study, the field applicability of IoT-based devices was examined by manufacturing devices and applying them directly to the site of a centrifugal foundry. For the centrifugal casting process, the temperature and humidity of the working site, the molten metal temperature, and mold rotation speed were selected as process parameters to be collected. The sensors were selected in consideration of the detailed product specifications and cost required for each process parameter, and the circuit was configured using a NodeMCU board capable of wireless communication for IoT-based devices. After designing the circuit, PCB boards were prepared for each parameter, and each device was installed on site considering the working environment. After the on-site installation process, it was confirmed that the level of satisfaction with the safety of the workers and the efficiency of process management increased. Also, it is expected that it will be possible to link process data and quality data in the future, if process parameters are continuously collected. The IoT-based device designed in this study has adequate reliability at a low cast, meaning that the application of this technique can be considered as a cornerstone of data collecting at foundries.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.5
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• pp.615-622
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• 2015

As the development of high efficiency and high flux density LEDs, the trend of illumination lamp industry transfers from conventional-lamps to the LED-lamps. For energy efficiencies, LED lamps are superior to the conventional lamps, but they have heat problems. Especially, the heat problems are severe for the high luminance lamps. They degrade the soldering point of the metal PCB, and shorten the life cycle of LEDs. So, the solution of the heat sinking is very important to develop high luminance LED lamps. This study suggested a new method to solve the heat problems for high luminance LED lamps, and developed a LED lamp which has 1200W power. In this study, a water jacket is installed to the LED lamp, and the cooing water is circulated by a water pump.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.50 no.2
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• pp.130-138
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• 2017

This study examined chemical characterization in commercial dark-fleshed fish (mackerel Scomber japonicus, Japanese Spanish mackerel Scomberomorus niphonius, and Pacific herring Clupea pallasii) to determine their suitability for use as raw materials for seafood products. The volatile basic nitrogen (VBN), heavy metal, radioactivity, polychlorinated biphenyl (PCBs), benzo[a]pyrene, and histamine concentrations were measured. The VBN in all of the dark-fleshed fish was less than 20 mg/100 g, which is the limit for raw materials for seafood processing. Except for mackerel based on the lead (Pb) standards of the European Union (EU), Taiwan, and CODEX, and all fish based on the cadmium (Cd) standards for China and the EU, the commercial dark-fleshed fish were free from total mercury (Hg), Pb, and Cd based on domestic and foreign standards. The radioactivity, polychlorinated biphenyl (PCB), benzo[a]pyrene, and histamine concentrations of the commercial dark-fleshed fish all adhered to the domestic and foreign standards. The commercial dark-fleshed fish tested could all be used as raw materials for seafood products, except for some exported products.

• Journal of computational fluids engineering
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• v.18 no.1
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• pp.63-68
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• 2013

The purpose of this study is to investigate the cooling performance of radial heat sink used for high power LED lightings by natural convection cooling with surrounding air. Experimental and numerical analyses are carried out together. Parametric studies are performed to compare the effects of geometric parameters in radial heat sink such as the number of fins, fin height, fin length, and thickness of fin base as well as the surface coatings of radial heat sink. In this study, the cooling of 60 W LED lamp is examined with radiative heat transfer considered as well as natural convection. Numerical results show the optimum condition when the number of fin is 40, heat sink height is 120 mm, fin length is 15 mm, and fin base thickness is 3 mm. The difference in temperature of the LED metal PCB is within $1^{\circ}C$ between numerical analyses and experimental results. Also, the CNT coating on the heat sink surface is found to increase the cooling performance significantly.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Journal of Environmental Science International
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• v.20 no.11
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• pp.1499-1507
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• 2011

Practical disposal of transformer insulation oil laden with PCBs (polychlorinated biphenyls) by a chemical treatment has been studied in field work. The transformer insulation oil containing PCBs was treated by the required amounts of PEG (polyethylene glycol) and KOH, along with different reaction conditions such as temperatures and times. The reaction of PEG with PCBs under basic condition produces arylpolyglycols, the products of nucleophilic aromatic substitution. Removal efficiencies of PCBs in insulation oil before and after chemical treatment were examined. The removal efficiency of PCBs was very low at lower temperatures of 25 and $50^{\circ}C$. Under the reaction condition of PEG 600/KOH/$100^{\circ}C$/2hr, removal efficiency of PCBs was approximately 70%, showing completely removal of PCBs containing 7~9 chlorines on biphenyl frame which appear later than PCB IUPAC Number 183 (2,2',3,4,4',5',6-heptaCB) in retention time of GC/ECD. However, when increasing the reaction temperature and time to $150^{\circ}C$ and 4 hours, removal efficiency of PCBs reached 99.99% without any formation of PCDDS/PCDFs during the process. Such reaction conditions were verified by several official analytical institutions. In studying the reaction of PEG with PCBs, it confirmed that the process of chemical treatment led to less chlorinated PCBs through a stepwise process with the successive elimination of chlorines.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.105-105
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• 2006

IT 산업 및 반도체 산업이 발전함에 따라 초소형, 고집적화 시스템의 요구에 대응하기 위해서 고해상도 및 고정밀의 패턴 구현에 관한 많은 연구가 진행되고 있다. 이러한 연구는 각종 산업제품의 PCB(Printed Circuit Board) 및 디스플레이 장치인 PDP(Plasma Display Panel), LCD(Liquid Crystal Display) 등에 적용되어 널리 응용되고 있다. 현재 널리 사용되는 인쇄 회로 기판은 마스킹 후 선택적 에칭 방식을 적용하여 금속 배선을 형성하는 방식을 적용하고 있다. 이러한 방식은 설계가 변경될 경우 마스크를 다시 제작해야 하는 번거로움이 있어 설계 변경이 용이하지 않고 더욱 길어진 생산시간의 증가로 인하여 생산성 및 집적도가 떨어지게 된다. 따라서 최근에는 이러한 한계를 극복하기 위한 방안이 여러 가지 측면에서 시도되고 있으며, 그 중에서도 Inkjet Printing 기술에 대한 관심이 증가하고 있다. 본 연구에서는 Inkjet Printing 방식을 적용하여 금속 배선을 형성하고 선폭과 두께의 오차를 줄여 배선의 Tolerance 를 개선할 수 있는 방안을 제안하였다. Inkjet Printing 방식을 이용한 기존의 금속 배선 형성은 고해상도의 DPI(Dot Per Inch)에서 잉크 액적이 뭉치는 Bulge 현상이 발생되어 원하는 형상 및 배선의 폭을 구현하는데 어려움이 있었다. Bulge 현상은 배선의 불균일성을 야기할 뿐만 아니라 근접한 배선의 간섭에도 영향을 미처 금속 배선의 기능을 할 수 없는 단점을 발생시킨다. 따라서 본 연구에서는 이러한 Bulge 현상을 줄이고 배선간의 간섭을 방지하여 원하는 배선을 용이하게 형성할 수 있는 순차적 인쇄 방식을 적용하였다. 본 연구에서는 노즐직경 35um 의 Inkjet Head 와 나노 Ag 입자 잉크를 사용하여 Glass 표면 위에 배선을 형성하고 배선의 폭과 두께를 측정하였다. 또한 순차적 인쇄 방식을 적용하여 700DPI 이상의 고해상도에서 나타날 수 있는 Bulge 현상이 감소하였음을 관찰하였으며 금속 배선의 Tolerance를 10%내외로 유지할 수 있음을 확인하였다.