• Design & Manufacturing
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• v.13 no.1
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• pp.13-18
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• 2019

The size and prospects of the domestic semiconductor equipment market are increasing every year. In the case of various parts used inside semiconductor equipments, high durability such as high strength and abrasion resistance is demanded. Particularly, the gases used in semiconductor production processes are toxic. In order to prevent such toxic gas leakage, a precision processing technique and a surface treatment technique for preventing corrosion are required. Electro-polishing is an electro-chemical method of polishing a metal surface to make it smooth and polished. Electro-polishing is mainly used in the finishing process of metal surface. Unlike mechanical polishing, electro-polishing is used in many fields, such as fine chemical etching equipment, since no damaged layer or burr, fine polishing groove and particles are generated. However, in order to withstand the gas used in the semiconductor equipment, the parts must have high corrosion resistance. However, the surface hardness generally become lowered through electro-polishing. Therefore, in this study, surface hardness were experimentally observed before and after electro-polishing. Then, a method of improving hardness by preparing a nitrided layer by plasma ion nitriding treatment.

• Journal of the Korean institute of surface engineering
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• v.47 no.4
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• pp.147-154
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• 2014

Formation behavior of PEO (Plasma Electrolytic Oxidation) films on AZ31 Mg alloy was studied in aqueous solutions containing various concentrations of hydroxide ion ($OH^-$) and silicate ion ($SiO_3{^{2-}}$) by voltage-time curves, and corrosion resistance of the PEO film-covered specimen was investigated by immersion test in 0.5 M NaCl solution. From the analyses of the voltage-time curves, it is suggested that two different types of anions are essentially needed for the formation of PEO films on AZ31 Mg alloy: film formation agent and local film breakdown agent. $SiO_3{^{2-}}$ ion acts only as a film formation agent but $OH^-$ ion acts not only as a film formation agent but also film breakdown agent. The PEO films prepared on AZ31 Mg alloy in alkaline silicate solution showed very good corrosion resistance without any pitting or filiform corrosions up to 480 h of immersion in 0.5 M NaCl.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.9
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• pp.727-732
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• 1998

Ag-deposited graphite powder was prepared by a chemical reduction method of metal particles onto graphite powder. X-ray diffraction observation of Ag-deposited graphite powder revealed that silver existed in a metallic state, but not in an oxidized one. From SEM measurement, ultrafine silver particles were highly dispersed on the surface of graphite particles. Cylindrical lithium ion secondary battery was manufactured using Ag-deposited graphite anodes and $LiCoO_2$ cathodes. The cycleability of lithium ion secondary battery using Ag-deposited graphite anodes was superior to that of original graphite powder. The improved cycleability may be due to both the reduction of electric resistance between electrodes and the highly durable Ag-graphite anode.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.163-169
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• 1995

Ion beam assisted deposition(IBAD) technique was used to synthesize hard coatings including diamond-like carbon(DLC), carbon nitride(CN) and metal-ceramic multilayered films. It was found that DLC films formed at low energy ion bombardment possess more $Sp^3$ bonds and much higher hardness. The films exhibited an excellent wear resistance. Nanometer multialyered Fe/TiC films was deposited by ion beam sputtering. The structure and properties were strongly dependent on the thickness of the individual layers and modulation wave length. It was disclosed that both hardness and toughness of the films could be enhanced by adjusting the deposition parameters. The CN films synthesized by IBAD method consisted of tiny crystallites dispersed in amorphous matrix, which were identified by electron diffraction pattern to be $\beta -C_3N_4$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.279-282
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• 2001

The IBE(ion beam etching)-induced Schottky barrier variation which depends on various etching history related with ion energy, incident angle and etching time has been investigated using voltage-current, capacitance-voltage characteristics of metal-etched silicon contact and morphology of etched surface were studied using AFM(atomic force microscope). For ion beam etched n-type silicons, Schottky barrier is reduced according to ion beam energy. It can be seen that amount of donor-like positive charge created in the damaged layer is proportional to the ion energy. By contrary, for ion beam etched p-type silicons, the Schottky barrier and specific contact resistance are both increased. Not only etching time but also incident angle of ion beam has an effect on barrier height. Taping-mode AFM analysis shows increased roughness RMS(Root-Mean-Square) and depth distribution due to ion bombardment. Annealing in an N$_2$ ambient for 30 min was found to be effective in improving the diode characteristics of the etched samples and minimum annealing temperatures to recover IBE-induced barrier variation were related to ion beam energy.

• Journal of the Korean institute of surface engineering
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• v.19 no.3
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• pp.121-127
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• 1986

There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.122-126
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• 1997

the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.

• Korean Journal of Food Science and Technology
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• v.24 no.4
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• pp.371-375
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• 1992

The ${\alpha}-amylase$ from Bacillus licheniformis was purified and its thermostability in the presence of substrate and metal was ions investigated. Comparing D-values of the enzyme obtained in the presence of $Ca^{++}$, $B^{+++}$ and both $Ca^{++}$ and $B^{+++}$, the thermostability of the enzyme was markedly enhanced by the addition of metal ions. $Ca^{++}$ and $B^{+++}$ exhibited a protective action, the former ion being more effective, and both ions showed a synergistic effect. The enthalpy of activation for the thermal inactivation in the presence of metal ion was 320.2 kJ/mole for $Ca^{2+}$ ion, 212.9 kJ/mole for $B^{+++}$, while it was 183.9 kJ/mole in the absence of metal ions. In the thermal inactivation for 30 min at $96^{\circ}C$, the residual activity in the presence of 30% (w/w) starch was 51.0%, whereas the presence of $Ca^{++}$ ion additionally provided a remarkable thermo-resistance.

• The korean journal of orthodontics
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• v.28 no.1 s.66
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• pp.123-133
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• 1998

The effectiveness of TiN ion-plating was examined with TiN ion-plated Co-Cr wires(.016“, .016”x.022“) on three different types of bracket(TiN ion-plated metal bracket ceramic bracket and plastic bracket). Maximum static frictional forces and characteristic curves obtained from the frictional characteristic graph, were compared and surface roughness of wires and bracket slots before and after friction experiment was observed by SEM. The obtained results were as follows $\cdot$The frictional forces of TiN ion-plated wires were significantly lower than those of non ion-plated wires(p<0.05). $\cdot$On the effect of wire shape, the frictional forces of round wires were significantly lower than those of rectangular wires(p<0.05) $\cdot$As the result of the SEM observation on the wires and bracket slots after the friction experiment the surface of non ion-plated wires was rougher than that of TiN ion-plated ones. $\cdot$The difference between the static frictional forces and the kinetic frictional forces was not significant in case of the TiN ion-plated round ins, but the static frictional forces were a little higher than the kinetic frictional forces in the TiN ion-plated rectangular wires. $\cdot$The static frictional forces were much higher than the kinetic frictional forces in the case of non ion-plated wires.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.281-286
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• 2021

Arc ion plating (AIP), laser cladding, and nitriding are methods that can prevent mold damage or repair and create cracks and breakages on the die surface. The dissolution and soldering behavior of coated SKD61 by using arc ion plating, laser cladding, and nitriding was investigated. The structure of the coating was investigated as a function of deposition conditions by X-ray diffraction and the crystallographic orientation was determined using the texture factor. The TiAlN film deposited with AIP showed excellent corrosion resistance in the molten aluminum alloy at 680℃. In this paper, we have detailed the corrosion and mass loss phenomena associated with these steel-cast metal interactions.