• Bulletin of the Korean Chemical Society
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• v.16 no.2
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• pp.149-153
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• 1995

We have grown GaAs epilayers by chemical beam epitaxy(CBE) using unprecracked hydrides and metal organic compounds via a surface decomposition process. This result shows that unprecracked arsine (AsH3) or monoethylarsine (MEAs) can be used in chemical beam epitaxy(CBE) as a replacement of a precracked AsH3 source in CBE. It was also found that the uptake of carbon impurity in epilayers grown using trimethylgallium(TMG) with unprecracked AsH3 or MEAs was significantly reduced compared to that in epilayers grown by CBE process employing TMG and arsenics produced from precracked hydrides. We propose a surface structural model suggesting that the hydrogen atoms play an important role in the reduction of carbon content in GaAs epilayer. Intermediates like dihydrides from hydride sources were also considered to hinder carbon atoms from being incorporated into the epilayers or to remove other carbon containing species on the surface.

• Analytical Science and Technology
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• v.32 no.6
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• pp.233-242
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• 2019

Substance identification is the first step of the REACH registration. It is essential in terms of Classification, Labelling and Packaging (CLP) regulation and because even trace amounts of impurities or additives can affect the classification. In this study, a scheme for the screening, quantification, and interpretation of trace amounts of hazardous inorganic substances is proposed to detect the presence of more than 0.1% hazardous inorganic substances that have been affecting the hazard classification. An exemplary list of hazardous inorganic substances was created from the substances of very high concern (SVHCs) in REACH. Among 201 SVHCs, there were 67 inorganic SVHCs containing at least one or ~2-3 heavy metals, such as As, Cd, Co, Cr, Pb, Sb, and Sn, in their molecular formula. The inorganic SVHCs are listed in excel format with a search function for these heavy metals so that the hazardous inorganic substances, including each heavy metal and the calculated ratio of its atomic weight to molecular weight of the hazardous inorganic substance containing it, can be searched. The case study was conducted to confirm the validity of the established scheme with zinc oxide (ZnO). In a substance that is made of ZnO, Pb was screened by XRF analysis and measured to be 0.04% (w/w) by ICP-OES analysis. After referring to the list, the presence of Pb was interpreted just as an impurity, but not as an impurity relevant for the classification. Future studies are needed to expand on this exemplary list of hazardous inorganic substances using proper regulatory data sources.

• Polymer(Korea)
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• v.26 no.3
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• pp.410-414
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• 2002

The late transition Pd catalyst of low oxophilicity that has ferrocene -based diimine ligand for stabilization of center metal had been synthesized and applied for the polymerization of methyl methacrylate (MMA). In the presence of triisobutylaluminium (TIBA) for impurity scavenger, the effects of polymerization temperature and [TIBA]/[Pd] mole ratio on the yield and glass transition temperature ($T_g$) of PMMA had been examined. For 40~$50^{\circ}C$ of polymerization temperature and 2000~3000 of [TIBA]/[Pd] mole ratio, higher polymer yields were obtained. It was observed that ($T_g$) of PMMA is almost independent to the polymerization temperature but influenced by the [TIBA]/[Pd] mole ratio. With the examination of($T_g$) of PMMA with the structure of polymer, it had been found that T$_{g}$ of PMMA exhibits a linear relationship with the isotacticity of polymer.r.

• Journal of Welding and Joining
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• v.34 no.5
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• pp.61-69
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• 2016

A numerical simulation of the solid/liquid coexistence temperature range, using solidification segregation model linked with the Kurz-Giovanola-Trivedi model, explained the mechanism of the BTR shrinkage (with an increase in welding speed) in type 310 stainless steel welds by reduction of the solid/liquid coexistence temperature range of the weld metal due to the inhibited solidification segregation of solute elements and promoted dendrite tip supercooling attributed to rapid solidification of laser beam welding. The reason why the BTR enlarged in type 316 series stainless welds could be clarified by the enhanced solidification segregation of impurity elements (S and P), corresponding to the decrement in ${\delta}-ferrite$ crystallization amount at the solidification completion stage in the laser welds. Furthermore, the greater increase in BTR with type 316-B steel was determined to be due to a larger decrease in ${\delta}-ferrite$ amount during welding solidification than with type 316-A steel. This, in turn, greatly increases the segregation of impurities, which is responsible for the greater temperature range of solid/liquid coexistence when using type 316-B steel.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.163-163
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• 1999

MOSFET, MESFET 그리고 MODFET는 Logic ULSIs, high speed ICs, RF MMICs 등에서 중요한 역할을 하고 있으며, 그것의 gate electrode, contact, interconnect 등의 물질로는 refractory metal을 이용한 CoSi2, MoSi2, TaSi2, PtSi2, TiSi2 등의 효과를 얻어내고 있다. 그중 TiSi2는 비저항이 가장 낮고, 열적 안정도가 좋으며 SAG process가 가능하므로 simpler alignment process, higher transconductance, lower source resistance 등의 장점을 동시에 만족시키고 있다. 최근 소자차원이 scale down 됨에 따라 TiSi2의 silicidation 과정에서 C49 TiSi2 phase(high resistivity, thermally unstable phase, larger grain size, base centered orthorhombic structure)의 출현과 그것을 제거하기 위한 노력이 큰 issue로 떠오르고 있다. 여러 연구 결과에 따르면 PAI(Pre-amorphization zimplantation), HTS(High Temperature Sputtering) process, Mo(Molybedenum) implasntation 등이 C49를 bypass시키고 C54 TiSi2 phase(lowest resistivity, thermally stable phase, smaller grain size, face centered orthorhombic structure)로의 transformation temperature를 줄일 수 있는 가장 효과적인 방법으로 제안되고 있지만, 아직 그 문제가 완전히 해결되지 않은 상태이며 C54 nucleation에 대한 physical mechanism을 밝히진 못하고 있다. 본 연구에서는 증착 시 기판온도의 변화(400~75$0^{\circ}C$)에 따라 silicon 위에 DC/RF magnetron sputtering 방식으로 Ti/Si film을 각각 제작하였다. 제작된 시료는 N2 분위기에서 30~120초 동안 500~85$0^{\circ}C$의 온도변화에 따라 RTA법으로 각각 one step annealing 하였다. 또한 Al을 cosputtering함으로써 Al impurity의 존재에 따른 영향을 동시에 고려해 보았다. 제작된 시료의 분석을 위해 phase transformation을 XRD로, microstructure를 TEM으로, surface topography는 SEM으로, surface microroughness는 AFM으로 측정하였으며 sheet resistance는 4-point probe로 측정하였다. 분석된 결과를 보면, 고온에서 제작된 박막에서의 C54 phase transformation temperature가 감소하는 것이 관측되었으며, Al impuritydmlwhswork 낮은온도에서의 C54 TiSi2 형성을 돕는다는 것을 알 수 있었다. 본 연구에서는 결론적으로, 고온에서 증착된 박막으로부터 열적으로 안정된 phase의 낮은 resistivity를 갖는 C54 TiSi2 형성을 보다 낮은 온도에서 one-step RTA를 통해 얻을 수 있다는 결과와 Al impurity가 존재함으로써 얻어지는 thermal budget의 효과, 그리고 그로부터 기대할 수 있는 여러 장점들을 보고하고자 한다.

• Journal of the Korean Vacuum Society
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• v.8 no.1
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• pp.13-19
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• 1999

Total reflection X-ray fluorescence spectroscopy using synchrotron radiation source called as TRSFA was explored to achieve high sensitivities to impurity metals on Si wafer surface. It consists of monochromating part to select a specific wavelength, slit part to shield direct beam and to control monochromated beam, and main chamber to dectect fluorescent X-ray counts of impurities on si wafer. Monochromated X-ray of 10.90 KeV was selected and the optimum total reflection condition on silicon wafer was obtained through tuning the dead time and fluorescent X-ray count of Si and Fe. TRSFA system could increase the sensitivity as high as 50 times in comparision with TRXFA using normal X-ray source. But the trend was varied since the surface conditions of Si wafers and, therefore, the reflectivities were different. Furthemore, there seems to be a promising path to reaching a detection limit useful to the next generation metal impurities control, because Fe impurity below to the $5\times10^{9}\textrm{atomas/cm}^2$ can be detectable through the developed TRSFA system.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.232-232
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• 2010

Recently light emitting diodes (LEDs) have been expected as the new generation light sources because of their advantages such as small size, long lifetime and energy-saving. GaN, as a wide band gap material, is widely used as a material of LEDs and GaN nanorods are the one of the most widely investigated nanostructure which has advantages for the light extraction of LEDs and increasing the active area by making the cylindrical core-shell structure. Lately GaN nanorods are fabricated by various techniques, such as selective area growth, vapor-liquid-solid (VLS) technique. But these techniques have some disadvantages. Selective area growth technique is too complicated and expensive to grow the rods. And in the case of VLS technique, GaN nanorods are not vertically aligned well and the metal catalyst may act as the impurity. So we just tried to grow the GaN nanorods on Si substrate without catalyst to get the vertically well aligned nanorods without impurity. First we deposited the AlN buffer layer on Si substrate which shows more vertical growth mode than sapphire substrate. After the buffer growth, we flew trimethylgallium (TMGa) as the III group source and ammonia as the V group source. And during the GaN growth, we kept the ammonia flow stable and periodically changed the flow rate of TMGa to change the growth mode of the nanorods. Finally, as the optimization, we changed the various growth conditions such as the growth temperature, the working pressure, V/III ratio and the doping level. And we are still in the process to reduce the diameter of the nanorods and to extend the length of the nanorods simultaneously. In this study, we focused on the shape changing of GaN nanorods with different growth conditions. So we confirmed the shape of the nanorods by scanning electron microscope (SEM) and carried out the Photoluminescence (PL) measurement and x-ray diffraction (XRD) to examine the crystal quality difference between samples. Detailed results will be discussed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.196-208
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• 2007

An analytical model is proposed for an optically controlled Metal Semiconductor Field Effect Transistor (MESFET), known as Optical Field Effect Transistor (OPFET) considering the diffusion fabrication process. The electrical parameters such as threshold voltage, drain-source current, gate capacitances and switching response have been determined for the dark and various illuminated conditions. The Photovoltaic effect due to photogenerated carriers under illumination is shown to modulate the channel cross-section, which in turn significantly changes the threshold voltage, drainsource current, the gate capacitances and the device switching speed. The threshold voltage $V_T$ is reduced under optical illumination condition, which leads the device to change the device property from enhancement mode to depletion mode depending on photon impurity flux density. The resulting I-V characteristics show that the drain-source current IDS for different gate-source voltage $V_{gs}$ is significantly increased with optical illumination for photon flux densities of ${\Phi}=10^{15}\;and\;10^{17}/cm^2s$ compared to the dark condition. Further more, the drain-source current as a function of drain-source voltage $V_{DS}$ is evaluated to find the I-V characteristics for various pinch-off voltages $V_P$ for optimization of impurity flux density $Q_{Diff}$ by diffusion process. The resulting I-V characteristics also show that the diffusion process introduces less process-induced damage compared to ion implantation, which suffers from current reduction due to a large number of defects introduced by the ion implantation process. Further the results show significant increase in gate-source capacitance $C_{gs}$ and gate-drain capacitance $C_{gd}$ for optical illuminations, where the photo-induced voltage has a significant role on gate capacitances. The switching time ${\tau}$ of the OPFET device is computed for dark and illumination conditions. The switching time ${\tau}$ is greatly reduced by optical illumination and is also a function of device active layer thickness and corresponding impurity flux density $Q_{Diff}$. Thus it is shown that the diffusion process shows great potential for improvement of optoelectronic devices in quantum efficiency and other performance areas.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.440-440
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• 2009

Semiconductor nanowires offer exciting possibilities as components of solar cells and have already found applications as active elements in organic, dye-sensitized, quantum-dot sensitized, liquid-junction, and inorganic solid-state devices. Among many semiconductors, silicon is by far the dominant material used for worldwide photovoltaic energy conversion and solar cell manufacture. For silicon wire to be used for solar device, well aligned wire arrays need to be fabricated vertically or horizontally. Macroscopic silicon wire arrays suitable for photovoltaic applications have been commonly grown by the vapor-liquid-solid (VLS) process using metal catalysts such as Au, Ni, Pt, Cu. In the case, the impurity issues inside wire originated from metal catalyst are inevitable, leading to lowering the efficiency of solar cell. To escape from the problem, the wires of purity of wafer are the best for high efficiency of photovoltaic device. The fabrication of wire arrays by the electrochemical etching of silicon wafer with photolithography can solve the contamination of metal catalyst. In this presentation, we introduce silicon wire arrays by electrochemical etching method and then fabrication methods of radial p-n junction wire array solar cell and the various merits compared with conventional silicon solar cells.

• Resources Recycling
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• v.30 no.6
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• pp.76-82
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• 2021

The separation of palladium from crude metal, which is obtained from electronic waste using pyrometallurgy was achieved through electrolysis. This was done to recover high-purity copper. The oxidation potentials of these metals are a fundamental part of the analysis of electrolytic separation of palladium and impurity metals. To achieve this, copper, iron, and nickel were dissolved in the electrolyte, and palladium and aluminum were found to be recoverable from anode slime. During the electrolysis for palladium separation, palladium was present in the anode slime and was obtained with a recovery of 97.46 % indicating almost no loss. 4N-grade copper was recovered from the electrodeposition layer at the cathode.