• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.400-404
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• 2018

A metal 3D printer has been developed on its own to electrodeposit the localized area. Nozzles were used to selectively laminate the electrolytic plating method. To analyze the factors affecting the deposition, the stack height, thickness and surface roughness were experimentally analyzed according to the current density and the temperature of the electrolyte. Electrolytic temperature and current are electrodeposited when the deposition conditions are dominant over the etching conditions, but the thickness is kept constant. On the contrary, when the etching conditions are dominant, the electrodeposited shape is rather the etched. As a result, the uniformity of surface quality and electrodeposition rate could be improved by conducting experiments under constant conditions of electrolyte temperature and current density.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Journal of the Korean Electrochemical Society
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• v.5 no.2
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• pp.57-61
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• 2002

In this study, the effect of ammonium chloride on the electrodeposition of CoP magnetic alloy film was investigated. The correlation between the electrodeposition condition and the magnetic properties was tried to elucidate by the electro- analytical tests such as cyclic voltammetry. It was observed that the magnetic properties of the films were varied extensively with the ammonium chloride contents in the solution. The reason why the magnetic properties of the films were varied with the addition of ammonium chloride was thought that the addition of ammonium chloride controlled the electrocrystallization of CoP kinetically by charge transfer and increased the grain size and the orientation factor. This may cause the variation of the magnetic properties of CoP films.

• Journal of the Korean institute of surface engineering
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• v.52 no.2
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• pp.103-110
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• 2019

As an anti-corrosion method in seawater, cathodic protection is widely recognized as the most effective and technically appropriate corrosion prevention methodology for marine structures against harsh corrosive environment. When applying the cathodic protection in seawater, the surface of the metal facilities the formation of compounds of $CaCO_3$ and $Mg(OH)_2$. These mixed compounds are generally called 'calcareous deposits'. This layer functions as a barrier against the corrosive environment and functions to further inhibit the corrosion process and then leading to a decrease in current demand for cathodic protection. However, calcareous deposit films are partially formed on the surface of the cathode and there are some difficulties to maintain both a corrosion resistance for a long period of time and a strong adhesion between deposits and base metal. In this study, the pulse electrodeposition process was applied to improve adhesion and corrosion resistance of the calcareous deposit films, and to solve the problem of hydrogen embrittlement at high current density. The uniform and compact calcareous deposit films were prepared by pulse electrodeposition process, and their properties were characterized using various surface analytical techniques together with electrochemical methods.

• Journal of Electrochemical Science and Technology
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• v.10 no.3
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• pp.284-293
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• 2019

Herein, we report an electrode surface with a hierarchical assembly of wild-type M13 virus nanofibers (M13) to nucleate the AuPt alloy nanostructures by electrodeposition. M13 was pulled on the electrode surface to produce a virus film, and then a layer of sol-gel matrix (SSG) was wrapped over the surface to protect the film, thereby a bio-template was constructed. Blending of metal binding domains of M13 and amine groups of the SSG of the bio-template were effectively nucleate and directed the growth of nanostructures (NSs) such as Au, Pt and AuPt alloy onto the modified electrode surface by electrodeposition. An electrocatalytic activity of the modified electrode toward methanol oxidation in alkaline medium was investigated and found an enhanced mass activity ($534mA/mg_{Pt}$) relative to its controlled experiments. This bio-templated growth of NSs with precise composition could expedite the intention of new alloy materials with tuneable properties and will have efficacy in green energy, catalytic, and energy storage applications.

• Journal of Institute of Convergence Technology
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• v.5 no.2
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• pp.21-25
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• 2015

This paper proposes a fabrication process of deposited layer with micro patterns that uses a combination of a pulsed laser beam machining and an electrodeposition. This process consists of the electrodeposition and the laser beam machining. The deposited layer on metal can be selectively eliminated by laser ablation. As a result, the deposited layer with micro patterns can be fabricated without a mask. The characteristics of the deposited layer on stainless steel were investigated according to the average power and marking speed in the pulsed laser beam machining. The optimal laser beam conditions for precise micro patterning of the deposited layer were determined. Finally, the deposited copper layer with micro text was successfully fabricated by the pulsed laser beam machining.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Journal of the Korean institute of surface engineering
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• v.37 no.5
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• pp.253-262
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• 2004

Calcareous deposits are the consequence of pH increase of the electrolyte adjacent to metal surface affected by cathodic current in seawater. It obviously has several advantages over conventional coatings, since the calcareous deposit coating is formed from coating (Mg$^{2+}$, $Ca^{2+}$) naturally existing in seawater. In consideration of this respect, environment friendly calcareous deposit films were formed by an electro deposition technique on steel substrates submerged in 48$^{\circ}C$ natural seawater. And the influence of current density, coating time and attachment of steel mesh on composition ratio, structure and morphology of the electrodeposited films were investigated by Scanning Electron Microscopy(SEM), Energy Dispersive Spectroscopy(EDS) and X-Ray Diffractor(XRD), respectively. Accordingly, this study provides a better understanding of the composition between the growth of $Mg(OH)_2$ and $CaCO_3$ during the formation of electro deposit films on steel substrate under cathodically electrodeposition in $48^{\circ}C$ natural seawater. The Mg compositions, in general, are getting decreased regardless of current density but Ca compositions are getting increased as electrodeposition time runs. That is, $Mg(OH)_2$ compounds of brucite structure shaped as flat type is formed at the initial stage of electrodeposition, but CaCO$_3$ compounds of aragonite structure shaped as flower type is formed in large scale. Besides, $Mg(OH)_2$ compounds were much formed at 5 A/$\m^2$ environment condition compared to the 3 A/$\m^2$ and 4 A/$\m^2$ environment conditions. This is because that OH- which was comparatively largely generated at the metal surface is preferably combined with $Mg^{2+}$TEX>.

• Proceedings of the Korean Nuclear Society Conference
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• 2001.10a
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• pp.293.1-293
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• 2001

• Carbon letters
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• v.21
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• pp.68-73
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• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.