Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지
DOI QR코드

DOI QR Code

The Characteristics of Electrolyte Temperature and Current Density on Selective Jet Electrodeposition

선택적 금속 전착에 대한 전해질 온도 및 전류밀도 영향분석

  • Received : 2018.11.13
  • Accepted : 2018.12.31
  • Published : 2018.12.31
Download PDF
⟨ Previous Next ⟩

Abstract

A metal 3D printer has been developed on its own to electrodeposit the localized area. Nozzles were used to selectively laminate the electrolytic plating method. To analyze the factors affecting the deposition, the stack height, thickness and surface roughness were experimentally analyzed according to the current density and the temperature of the electrolyte. Electrolytic temperature and current are electrodeposited when the deposition conditions are dominant over the etching conditions, but the thickness is kept constant. On the contrary, when the etching conditions are dominant, the electrodeposited shape is rather the etched. As a result, the uniformity of surface quality and electrodeposition rate could be improved by conducting experiments under constant conditions of electrolyte temperature and current density.

Keywords

PMGHBJ_2018_v51n6_400_f0001.png 이미지

Fig. 1. Schematic diagram of the electrochemical Nozzle system.

PMGHBJ_2018_v51n6_400_f0002.png 이미지

Fig. 2. Influence of electrolyte temperature on distribution of deposited layer: (Left) Surface shape(a) 25℃ (b) 35℃, (c) 45℃, (d) 55℃, (Right) deposited layer height comparison.

PMGHBJ_2018_v51n6_400_f0003.png 이미지

Fig. 3. Influence of applied current on distribution of deposited layer: (a) deposited layer width (b) height.

PMGHBJ_2018_v51n6_400_f0004.png 이미지

Fig. 4. Thickness aspect ratio with (a) temperature and (b) current density variation

PMGHBJ_2018_v51n6_400_f0005.png 이미지

Fig. 5. SEM Images of manufactured surface texture by electrolyte temperature (a) 6 mA, (b) 12 mA, (c) 18 mA, (d) 24 mA.

Table 1. Electrochemical bath compositions and physical characteristics

PMGHBJ_2018_v51n6_400_t0001.png 이미지

References

  1. Berman, B. 3-D Printing: The New Industrial Revolution. Bus. Horiz. (2012), 155-162.
  2. Nandwana, P.; Elliott, A. M.; Siddel, D.; etc. Powder bed binder jet 3D printing of Inconel 718: Densification, microstructural evolution and challenges. Curr. Opin. Solid State and Mater. Sci., (2017), 207-218.
  3. Fletcher, J. C.; Oliver, G. D. Scanning Nozzle Plating System. U.S Patent 3,810,829, May 14, (1974).
  4. S.K. Seol, D.H. Kim, S.H. Lee, J.H. Kim, W.S. Chang and J.T Kim, Electrodeposition-based 3D printing of metallic microacrchitectures with controlled interanl structure, nano micro small, vol. 11, issue 32, 3896-3902.
  5. J.U. Park, M. Hardy, S.J. Kang, K. Barton, K. Adair, D. K. Nukhopadyay, C.Y. Lee, M. S. Strano, A. G. alleyne, J. G. Georgiadis, P. M. Ferreia & J. A. Rogers, High-resolution electrohydrodynamic jet printing, nature materials 6, (2007), 782-789. https://doi.org/10.1038/nmat1974
  6. Frederick, C. S. Faraday's Laws in One Equation. j. Chem. Educ. (1961) 38,98. https://doi.org/10.1021/ed038p98
  7. Physical Chemistry Division commission on electrochemistry. Nomenclature for Transport Phenomena in Electrolytic Systems; Pergamon Press Ltd: New York, (1981), pp 1836-1839.
  8. Matula, R. A. Electrical Resistivity of Copper, Gold, Palladium, and Silver. J. Phys. Chem. Ref. Data. (1979) 1147-1298.