• 한국세라믹학회지
• /
• 제49권2호
• /
• pp.155-160
• /
• 2012

This paper reported a simple deposition-precipitation method, introducing the metal (Ni, Ag and Sn) and $Na_2S{\cdot}5H_2O$ to preparedispersion metal sulfide nanoparticles on the surface of the Multi-walled carbon nanotube for synthesis of CNT-$M_xS_y$ ($NiS_2$, $Ag_2S$, SnS) composite photocatalysts. The characterization of the prepared CNT-$M_xS_y$ ($NiS_2$, $Ag_2S$, SnS) composites was performed by X-ray diffraction, scanning electron microscopy with energy dispersive X-ray analysis and BET analysis. Furthermore, the MB degradation rate constant for CNT-SnS composite was $5.68{\times}10^{-3}$ under visible light irradiation, which was much higher than the corresponding values for other samples. The detailed formation and photocatalytic mechanism are also provided here.

• Bulletin of the Korean Chemical Society
• /
• 제29권4호
• /
• pp.782-784
• /
• 2008

Ag/Ni bimetallic cluster loading on porous carbon fibers was accomplished in order to enhance the HCl removal efficiency of the carbons. The surface properties of the Ag/Ni/carbons were determined by XRD and SEM. N2/77 K adsorption isotherms were investigated using BET and Boers t-plot methods. The HCl removal efficiency was confirmed by a gas chromatography technique, and it was found that that efficiency was predominantly improved in the presence of Ag/Ni clusters compared with the efficiencies of the as-received and single-metal-plated carbons. This indicates that synergetic reactions exist between Ag/Ni and HCl gas, resulting in advanced HCl removal capacity of porous carbons.

• 한국전기전자재료학회논문지
• /
• 제27권5호
• /
• pp.276-281
• /
• 2014

A high-responsive Schottky device has been achieved by forming a thin metal deposition on a Si substrate. Two-different metals of Ni and Ag were used as a Schottky metal contact with a thickness about 10 nm. The barrier height formation between metal and Si determines the rectifying current profiles. Ag-embedding Schottky device gave an extremely high response of 17,881 at a wavelength of 900 nm. An efficient design of Schottky device may applied for photoelectric devices, including photodetectors and solar cells.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2015년도 추계학술대회 논문집
• /
• pp.231-231
• /
• 2015

무전해 Ni의 Metal turnover (MTO)가 증가함에 따라, Ni과 Sn-Ag-Cu솔더간 계면 금속간화합물층의 두꺼워지고, Ni-Sn-P층에 형성된 Nano void의 수가 많아지게 되어 취성파괴가 증가한다.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
• /
• pp.225-229
• /
• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• 한국전기전자재료학회논문지
• /
• 제37권5호
• /
• pp.500-506
• /
• 2024

The transparent electrode characteristics of the SnO₂/AgNi/SnO₂ (OMO) multilayer structures prepared by sputtering were investigated according to the annealing temperature. Ni-doped Ag of various compositions was selected as the metal layer and heat treatment was performed at 100~300℃ to evaluate the thermal stability of the metals. The manufactured OMO multilayer structures were heat treated for 6 hours at 400~600℃ in an N₂ atmosphere. The structural, electrical, and optical properties of the OMO structures before and after annealing were evaluated and analyzed using a UV-VIS spectrophotometer, 4-point probe, XPS, FE-SEM, etc. OMO with Ni-doped Ag shows improved performance due to the reduction of structural defects of Ag during annealing, but OMO structure with pure Ag shows degradation characteristics due to Ag diffusion into the oxide layer during high-temperature annealing. The figure of merit (FOM) of SnO₂/Ag/SnO₂ was highest at room temperature and gradually decreased as the heat treatment temperature increased. On the other hand, the FOM value of SnO₂/AgNi/SnO₂ mostly showed its maximum value at high temperature(~550℃). In particular, the FOM value of SnO₂/Ag-Ni (3.2 at%)/SnO₂ was estimated to be approximately 2.38×10^-2 Ω^-1. Compared to transparent electrodes made of other similar materials, the FOM value of the SnO₂/Ag-Ni (3.2 at%)/SnO₂ multilayer structure is competitive and is expected to be used as an alternative transparent conductive electrode in various devices.

• 공업화학
• /
• 제10권2호
• /
• pp.218-224
• /
• 1999

원자로 정지시 혼상 탈염기의 최적 운전방법을 제안할 목적으로 산성-산화성 분위기에서 저농도의 Ni, Co 및 Ag 이온이 함유된 모의 냉각재 용액의 연속식 이온교환특성을 연구하였다. 금속 이온의 제거 용량에 미치는 양이온 교환수지 형태의 효과로서 $H^+$형 수지의 성능은 $Li^+$형 수지의 성능보다 약 6% 정도 높은 것으로 나타났다. 혼합층 이온교환 방법인 양이온과 음이온 수지의 혼합은 비혼합시와 비교하여 금속 이온들의 제거 용량에는 영향을 미치지 않았으나 금속 이온들의 파과곡선의 기울기를 매우 조금 증가시켰다. 냉각재의 산성-산화성 분위기와 관계된 영향으로서 붕산의 첨가는 금속 이온들의 파과곡선의 기울기를 매우 작게 감소시킨 반면, 과산화수소의 첨가는 금속이온들의 제거 용량을 약간 감소시켰다.

• Journal of Welding and Joining
• /
• 제35권3호
• /
• pp.1-6
• /
• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• 해양환경안전학회지
• /
• 제18권2호
• /
• pp.67-83
• /
• 2012

양식활동이 활발한 반폐쇄적인 내만에서 퇴적물의 지화학적 특성을 파악하기 위하여 2010년 4월 가막만 전역의 19개 정점에서 표층 퇴적물을 채취하여 퇴적물 중의 금속(V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ag, Cd, Hg, Pb, As), 비금속(P, Se) 및 악티늄족 중 U원소의 분포특성을 파악하였다. 또한, 퇴적물기준 및 농축계수를 이용하여 금속원소의 오염도를 평가하였다. V, Cr, Fe, Co 및 Ni 등은 석영희석 효과, Cd 및 U은 유기물 희석효과, Mn, Ag, As 및 Se는 만의 북부 및 남부해역 정점들에서 표층퇴적물의 강한 환원환경경하에서 이산화망간 및 황산염이 유기물 분해의 산화제로 이용되면서 화학적 재분배에 의해 농도분포가 결정되어지는 것으로 보여진다. 미국 퇴적물 오염 기준(SQGs)에 의한 오염평가는 As의 경우 만의 중앙부를 제외한 대부분의 정점, Ni은 전 조사정점에서 ERL을 초과하였다. 농축계수(EF)를 이용한 평가는 Ni, Ag, Cd 및 As가 평균 EF가 1을 약간 초과하는 단계를 보였으며, 이외의 성분은 1과 유사하거나 혹은 그 이하 양호한 수준을 나타내었다.

• 한국재료학회지
• /
• 제12권9호
• /
• pp.750-760
• /
• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.