• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.228-231
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• 2002

In this paper, we estimated the insulation properties of cross-linked polyethylene (XLPE) for ultra-high voltage cable. we have studied the dielectric characteristics of XLPE due to frequency and temperature variation. The dielectric characteristics were measured in the temperature range from $25[^{\circ}C]$ to $120[{^{\circ}C]}$. Also we measured in the voltage range of 1[V] to 20[V] according to the step voltage application method. From FT-IR spectrum as an analysis of physical properties, a strong absorption in wavenumbers 700 to $730[cm^{-1}]$, $1456[cm^{-1}]$ and 2700 to $3000[cm^{-1}]$ observed by the methyl groups$(CH_{2})$. From the analysis of DSC, the crystalline melting points of the specimen observed in the temperature $60[^{\circ}C]$ and $106.58[^{\circ}C]$.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.786-791
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• 2001

$\alpha$,$\omega$-Bis(4-glycidyloxybenzylidene-4-aminophenyl)methane (BGBAM) was synthesized from the initial materials, 4-hydroxylbenzaldehyde (HBA), 4,4'-methylenedianiline (MDA) and epichlorohydrin. The DSC trace for BGBAM shows two endotherms associated with the liquid crystalline phase transition around $104.2^{\circ}C$ and the isotropic transition around $171.2^{\circ}C$, and it also has a broad exotherm in the range of $178~300^{\circ}C$ due to the anionic homopolymerization of BGBAM. DSC curve for the curing of BGBAM with hexamethylene diamine (HMD) shows an endothermic peak around $93^{\circ}C$ attributed to the melting of BGBAM. It also has three exothermic peaks around $128.4^{\circ}C$ and $180.2^{\circ}C$ associated with the epoxide-amine reaction and weak peak in the range of $200~263^{\circ}C$ related to the anionic homopolymerization between the unreacted epoxide groups. The activation energy values of cure reaction by Kissinger method are 66.5, 67.3 and 90.6 kJ/mol for $T_{pl},\; T_{p2}\; and \;T_{p3},\; respectively$. The kinetic parameters by isoconverional method are similar value to those from Kissinger method.

• Journal of Magnetics
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• v.16 no.2
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• pp.173-176
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• 2011

Fe-Cr alloys with different Cr contents were prepared by an arc melting technique. The alloys were isochronally aged in the range from $400^{\circ}C$ to $900^{\circ}C$ with $50^{\circ}C$ steps with a holding time of 100 hours. The ageing produced embrittlement in the alloys due to either the formation of a Cr-rich ${\alpha}'$ phase or a $\sigma$ phase at high temperatures. Magnetic Hysteresis Loop (MHL) and Micro-Vickers hardness were measured at each step to correlate the magnetic and mechanical properties. Coercivity and hardness of the alloys were increased and remanence decreased up to 500-$550^{\circ}C$ due to formation of a Cr-rich ${\alpha}'$ phase. Beyond 500-$550^{\circ}C$ range, the coercivity and hardness decreased and remanence increased due to the coarsening or dissolution of the Cr-rich ${\alpha}'$ phase. In the Fe-48% Cr alloy, formation of the $\sigma$ phase at $700^{\circ}C$ reduced the maximum induction of the alloy significantly.

• Journal of Welding and Joining
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• v.16 no.1
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• pp.52-62
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• 1998

Laser beam welding of zinc-coated steel, especially lap joints, has a problem of zinc vapor produced during welding which has a low vaporization temperature of 906.deg. C. It is lower than the melting temperature of steel (1500.deg. C). The high pressure formed by vaporization of zinc during laser welding splatters the molten pool and creates porosities in weld. During laser lap welds of zinc-coated steel sheets with CW CO$_{2}$ laser the gap size has been analyzed and simulated using a FEM. The simulation has been carried out in the range of gap aetween 0 and 0.16 mm. The vaporized zinc gas has effected to prevent heat from conducting toward the bottom of sheets. In vaporized zinc gas has effected to prevent heat from conducting toward the bottom of sheets. In the case of too small gap size, zinc gas has not ejected and existed between two sheets. Therefore heat was difficult to conduct from the upper sheet to lower sheet and the upper sheet could over-melted. In the case of large gap size the zinc gas has been prefectly ejected but only a part of lower sheet has melted. The optimum range of gap size in the lap welds of zinc-coated steel sheets has been calculated to be between 0.08 and 0.12 mm. According to the comparison of experiment, the simulation is proved to be acceptable and applicable to laser lap welds.

• Korean Journal of Materials Research
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• v.34 no.7
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• pp.355-362
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• 2024

AR (alkali resistant)-glass fibers were developed to provide better alkali resistance, but there is currently no research on AR-glass fiber manufacturing. In this study, we fabricated glass fiber from AR-glass using a continuous spinning process with 40 wt% refused coal ore. To confirm the melting properties of the marble glass, raw material was put into a (platinum) Pt crucible and melted at temperatures up to 1,650 ℃ for 2 h and then annealed. To confirm the transparent clear marble glass, visible transmittance was measured and the fiber spinning condition was investigated by high temperature viscosity measurement. A change in diameter was observed according to winding speed in the range of 100 to 700 rpm. We also checked the change in diameter as a function of fiberizing temperature in the range of 1,240 to 1,340 ℃. As winding speed increased at constant temperature, fiber diameter tended to decrease. However, at fiberizing temperature at constant winding speed, fiber diameter tended to increase. The properties of the prepared spinning fibers were confirmed by optical microscope, tensile strength, modulus and alkali-resistance tests.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Ceramic Society
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• v.26 no.5
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• pp.705-711
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• 1989

The glass-ceramics was prepared with the scoria(CaO-MgO-Al2O3-SiO2 system) of the locally occurring volcanic ejecta containing 10-13w/o of (FeO＋Fe2O3) by melting at 140$0^{\circ}C$ for 4 hours and thermally treated for nucleation and crystallization. The sucrose was added to the scoria to adjust the Fe2+/Fe3+ ratio during the melting process. The addition of 1-2w/o of sucrose showed the glass-ceramics body with the finest particle developed and dispersed over the entire range. It is concluded that the impurity content of iron oxide and titanium oxide play the most-influencial effect on the crystallization. When 1-2w/o of sucrose was added to the scoria, the value of Fe2+/Fe3+ ratio was 0.93-1.32 and showed the best result of crystallization. The nucleation temperature and time were calculated by the measurements of exothermic peak temperatures of DTA for quenched and thermally treated glasses. The nucleation temperature of scoria glass without the addition of sucrose was estimated as 75$0^{\circ}C$, but the addition of sucrose by 2w/o showed the nucleation temperature 6$25^{\circ}C$. The nucleation time was calculated with the same DTA curves. The nucleation times estimated were about 150min. for both of glasses without and with sucrose added. Finally, the activation energies for crystallization were calculated with the DTA data. The calculated activation energies were 143 Kcal/mole for the glass without addition of sucrose and 90Kcal/mole, 87Kcal/mole, 85Kcal/mole and 71Kcal/mole for the glasses of 1w/o, 2w/o, 3w/o and 4w/o addition respectively.

• Food Science of Animal Resources
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• v.29 no.4
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• pp.415-422
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• 2009

In this study, several factors were analyzed in an effort to determine the effects of transglutaminase (TGase) treatment on sodium caseinate (NaCN), ${\alpha}--lactalbumin$ (${\alpha}-La$), and ${\beta}-lactoglobulin$ (${\beta}-Lg$) polymerization reactions. The results of SDSPAGE showed that NaCN was slightly hydrolyzed to molecular weights of 50-400 kDa according to activation time. ${\alpha}-La$ formed high-molecular polymers of 30-300 kDa, whereas ${\beta}-Lg$ remained almost completely unhydrolyzed. Melting temperatures of NaCN, ${\alpha}-La$ with and without TGase were all in the range of $100{\pm}10^{\circ}C$ under the endothermic curve, and the melting temperature of ${\beta}-Lg$ with TGase was lower than that with TGase. When the proteins were incubated for 3 h with TGase, the micrographic structures showed a small quantity of sediment and broad layers. The final ${\alpha}-La$ residues remained at a level of 21.38%, and the TGase-treated ${\alpha}-La$ was confirmed to have undergone a profound loss of mass, to 18.25%. The DPPH-radical scavenging activity of NaCN and ${\beta}-Lg$ with TGase treatment was higher than that observed in the untreated sample, while those of ${\alpha}-La$ increased with concentration.

• Atmosphere
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• v.29 no.4
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• pp.367-380
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• 2019

Global warming causes various problems such as the increase of the sea surface temperature, the change of coastlines, ocean acidification and sea level rise. Sea level rise is an especially critical threat to coastal regions where massive population and infrastructure reside. Sea level change is affected by thermal expansion and mass increase. This study projected future sea level changes in the 21st century using the HadGEM2-AO with RCP8.5 scenario. In particular, sea level change due to water mass input from ice-sheets and glaciers melting is studied. Sea level based on surface mass balance of Greenland ice-sheet and Antarctica ice-sheet rose 0.045 m and -0.053 m over the period 1986~2005 to 2081~2100. During the same period, sea level owing to dynamical change on Greenland ice-sheet and Antarctica ice-sheet rose 0.055 m and 0.03 m, respectively. Additionally, glaciers melting results in 0.145 m sea level rise. Although most of the projected sea level changes from HadGEM2-AO are slightly smaller than those from 21 ensemble data of CMIP5, both results are significantly consistent each other within 90% uncertainty range of CMIP5.