• 대한기계학회논문집A
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• 제20권10호
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• pp.3113-3125
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• 1996

The objective of this study is to develop novel method named mechanical and chemical machining technique, which is capable of producing three dimensional patterns of few micrometers in dimension on a silicon wafer without the use of a mask. The strategy is to impart mechanical energy along the path of the pattern to be fabricated on a single crystal silicon by way on introdusing frictional interaction under controlled conditions. Then, the surface is preferentially etched to reveal the areas that have been mechanically energized. Upon completion of the etching process, the three dimensional pattern is produced on the silicon surface. Experiments have been conducted to identify the optimal tool material, geometery, as well as fabrication condition. The new technique introduced in this paper is significantly simpler than the conventional method which require sophisticated equipment and much time.

• 대한기계학회논문집A
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• 제33권2호
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• pp.108-113
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• 2009

The mixing of two dissimilar aluminum alloys in friction stir welding (FSW) was investigated using etching. The results show that the materials from the retreating side mixed into the advancing side in rather narrow and elongated bands whereas the materials from the advancing side mixed into the retreating side in the form of thick bands and lobes. A computational method using smoothed particle hydrodynamics (SPH) is introduced as a way to properly describe the complex mixing behavior in FSW.

• 대한기계학회논문집
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• 제15권3호
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• pp.898-906
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• 1991

본 연구에서는 입경부식법에 의한 재질열화 평가법의 표준화에 연구목적을 두 고, 고온부재의 열화에 따른 조직의 특성변화를 관찰하였다.

• Transactions on Electrical and Electronic Materials
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• 제16권4호
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• pp.212-220
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• 2015

We investigated nanotextured Si solar cells using the silver-assisted chemical etching process. The nanotexturing process is very sensitive to the concentration of chemical etching solution. The high concentration process results in a nanowire formation for the nanosurfaces and causes severe surface damage to the top region of the micropyramids. These nanowires show excellent light absorption in photoreflectance spectra and radiative light emission in photoluminescence spectra. However, the low concentration process forms a nano-roughened surface and provides high minority carrier lifetimes. The nano-roughened surfaces of the samples show the improved electrical cell properties of quantum efficiency, conversion efficiency, and cell fill factor due to the reduction in the formation of the over-doped dead layer.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.519-524
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• 2005

A numerical process to simulate SiO2 dry etching with inductively coupled C2F6 plasmas has been constructed using a commercial CFD code as a first step to design a run-to-run control system. The simulator was tuned to reasonably predict the reactive ion etching behavior and used to investigate the effects of plasma operating variables on the etch rate and uniformity. The relationship between the operating variables and the etching characteristics was mathematically modeled through linear regression for future run-to-run control system design.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1344-1348
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• 2003

It is generally known to be difficult to etch a surface of a transparent material such as fused silica by conventional laser ablation in which the surface is simply irradiated with a laser beam. A lot of studies have been done to provide a method capable of efficiently etching transparent materials without defects such as cracks. One of the promising methods or the micro-machining of optically transparent materials is laser induced etching. In this study, micro-drilling of fused silica by laser induced wet etching was conducted. KrF excimer and YAG laser were used as light sources. Acetone solution pyrene and ethanol solution of rhodamine were used as etchant.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1068-1071
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• 2001

Recently, the minimum line width shows a tendancy to decrease and the multi-level to increase in semiconductor. Therefore, a planarization technique is needed, which chemical polishing(CMP) is considered as one of the most important process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as microscratches, abrasive contaminations, and non-uniformity of polished wafer edges. Spin Etching can improve the defects of CMP. It uses abrasive-free chemical solution instead of slurry. Wafer rotates and chemical solution is simultaneously dispensed on a whole surface of the wafer. Thereby chemical reaction is occurred on the surface of wafer, material is removed. On this study, TEOS film is removed by CMP and Spin Etching, the results are estimated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU).

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.182-185
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• 2005

Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권1호
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• pp.52-57
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• 2005

This paper describes a fabrication method of a circular diaphragm using boron etching stop method. It will be applied to acoustic transducers such as microphones or microspeakers and so on. The sensitivity is expected to be increased with the circular diaphragm through the simulation results to compare with a general rectangular diaphragm. The borondoped layer which is doped with solid source is sufficient for achieving an etching stop in 20 wt% TMAH, and the thickness is about $7.4{\mu}m$. The diameter of the circular silicon nitride diaphragm was measured to be 2 mm with $1{\mu}m$ thickness. The fabrication of piezoelectric acoustic devices was completed.

• Design & Manufacturing
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• 제2권4호
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• pp.1-4
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• 2008

Micro pattern is applied to the light guiding plate(LGP) to enhance the uniformity of the brightness of the LCD. The micro cones are molded in intaglio on the surface of the LGP. The surface roughness of each cone was 40nm and 38nm in negative and positive die for laser ablation. In chemical etching, the surface roughness was 25nm, 24nm in negative and positive. And the surface roughness of negative and positive dies were 4nm and 5nm for LIGA-reflow process.