• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.509-510
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• 2006

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1805-1810
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• 2010

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.157-161
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• 1999

We investigated the effect of mechanical back side damage in Czochralski silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductance decay ($\mu$-PCD) technique, wet oxidation/preferential etching methods, near surface micro defect (NSMD) analysis, and X-ray section topography. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and NSMD density increased proportionally, also correlated to the oxidation induced stacking fault (OISF) density. Thus, NSMD technique can be used separately from conventional etching method in OISF measurement.

• KSTLE International Journal
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• v.3 no.2
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• pp.101-109
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• 2002

This paper presents the fabrication and performance inspection of a peristaltic micropump by flow simulation. The valve-less micropump using the diffuser/nozzle is consists of base plate, mid plate, top plate and connection tubes fur inlet and outlet. In detail, the base plate is composed of two diffuser nozzles and three chambers, the mid plate consists of a glass diaphragm for the volumetric change of the pumping chamber. The inlet and outlet tubes are connected at the top plate and the actuator fur pressing the diaphragm is located beneath the top plate. The micropump is fabricated on the silicon wafer by DRIE (Deep Reactive ion Etching) process. The pumping performances are tested by the pneumatic test rig and compared with the simulated results fur various dimensions of diffuser nozzles. The pumping characteristics of the micropump by the volumetric change at the pumping chamber is modeled and simulated by the commercial software of FLOW-3D. The simulated results shows that reverse flow is the inherent phenomena in the diffuser nozzle type micropump, but it can be reduced at the dual pumping chamber model.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.410-414
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• 2013

We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.4
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.9
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• pp.1020-1025
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• 2012

In this study, we fabricated the superhydrophobic and super-water-repellent surface with the micro/nano scale structures using simple conventional silicon wet-etching technique and the black silicon method by deep reactive ion etching. These fabrication methods are simple but very effective. Also we reported the droplet impact experimental results on the micro/nano-scaled surface. There are two representative impact behaviors as "rebound" and "fragmentation". We found the transition Weber number between "rebound" and "fragmentation" statements, experimentally. Additionally, we concerned about the dimensionless spreading diameters for our super-water-repellent surface. The novel characterization method was introduced for analysis including the "fragmentation" region. As a result, our super-water-repellent surface with the micro/nano-scaled structures shows the different impact behaviors compared with a reference smooth surface, by some meaningful experiments.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.4
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• pp.581-592
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• 2003

The aim of this study was to evaluate the effect of chemo-mechanical caries removal system($Carisolv^{TM}$, Medi Team, Sweden) for resin adhesion to carious primary and permanent dentin compared with conventional drilling method. The buccal surface of 92 primary molars and 92 permanent molars were used. Exposed dentins were occurred artificial caries. 32 tooth of primary molars and 32 tooth of permanent molars were prepared to observe treated dentin surface with $Carisolv^{TM}$ and conventional drilling method by SEM. Other tooth were prepared to measure resin-dentin shear bonding strength according to caries removal methods and dentin adhesive system. Two adhesive systems and a composite resin were used; single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and self-etching bonding system(Prompt L-pop, 3M ESPE), and a composite resin (Z-250, 3M). The results were as follows : 1. The removal effect of carious dentin on $Carisolv^{TM}$ was stronger on the primary dentin than that to permanent dentin, and dentin surface became rougher with treated $Carisolv^{TM}$ than drilling method. 2. Acid-etched dentin surfaces were showed smoothening without smear layer. 3. In specimen applied single bonding system hybrid layer and adhesive layer were $2-4{\mu}m$ and $10-15{\mu}m$ in thickness, whereas self-etching bonding system were showed only thin hybrid layer($1-2{\mu}m$). 4. The shear bonding strength of group applied single bonding agent was higher than that applied self-etching priming system(P<0.05). 5. The shear bonding strength of group applied $Carisolv^{TM}$ and self-etching priming system were slightly higher than that applied conventional drilling method and self-etching priming system(P>0.05).

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1277-1281
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• 2007

A Nano-tip as a cold field emitter for inducing a field emission current has manufactured in many ways. In the paper, the electrochemical etching method is used. Thus, in order to optimize the final shape as the field emitter, the reliable fabrication system for electrochemical etching was constructed. In addition, the effective parameters such as applied voltage, submerged length, meniscus height, electrolyte concentration and environmental condition(vibration, humidity, cut-off time) have investigated in detail. By controlling the parameters, reliable tungsten tip for field emitter was fabricated. And the fabricated tungsten tip was evaluated optically. Finally, the very sharp apex of the tungsten tip was observed with scanning electron microscope.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.111-118
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• 2001

Tungsten probe is the most important part of a probe card, which is widely used for the performance test of wafer chips. Electro chemical etching becomes an exclusive choice for mass production of the tungsten probes. In the mass production, not only the shape of the probe but also the shape distribution of machined probes is important. A new method is proposed for the mass production of the tungsten probes. Tungsten wires are separated by a distance, and dipped into electrolyte. The dipping rate is controlled to shape the probes. Several experimental tests are performed to study the machining characteristics. From the test results, machining parameters including electrical conditions and anode position showed significant influences on the shape, repeatability, precision and quality of sharp tips.