• Title/Summary/Keyword: Mechanical cooling method

Search Result 541, Processing Time 0.025 seconds

Measurement of liquid film thickness distribution on sprayed surfaces (스프레이가 분사되는 표면에서의 액막 두께 분포 측정)

  • Tae Ho Kim;Myung Ho Kim;Hyoung Kyu Cho;Byoung Jae Kim
    • Journal of the Korean Society of Visualization
    • /
    • v.21 no.3
    • /
    • pp.33-38
    • /
    • 2023
  • Spray cooling is a method of cooling high-temperature heating elements by spraying droplets. Recently, spray cooling has been proposed for use in next-generation nuclear reactors. When droplets are sprayed onto the outer wall of a heat exchanger tube, a film boiling occurs on the outer wall. Over time, the outer wall temperature decreases, and a liquid film forms on the outer wall, and the heat exchanger outer wall is subsequently cooled by the liquid film. In this case, the liquid film thickness has a great influence on the heat removal performance. In this study, an experimental study was conducted to measure the liquid film thickness distribution in a droplet spray environment. For this purpose, a method using the electrical conductivity of the liquid was adopted.

Stress Analysis in Cooling Process for Thermal Nanoimprint Lithography with Imprinting Temperature and Residual Layer Thickness of Polymer Resist

  • Kim, Nam Woong;Kim, Kug Weon
    • Journal of the Semiconductor & Display Technology
    • /
    • v.16 no.4
    • /
    • pp.68-74
    • /
    • 2017
  • Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

  • PDF

Evaluation of Microstructure and Mechanical Properties according to Cooling Method after Hot Forging of High Manganese Steel Flange (고망간강 플랜지의 열간 단조 후 냉각방법에 따른 미세조직 및 기계적 특성 평가)

  • Minha Park;Gang Ho Lee;Byung Jun Kim;Byoungkoo Kim
    • Korean Journal of Materials Research
    • /
    • v.34 no.1
    • /
    • pp.44-54
    • /
    • 2024
  • High-Manganese (Mn) austenitic steel, with over 24 wt% Mn content, offers outstanding mechanical properties in cryogenic settings, making it a potential replacement for existing cryogenic materials. This high manganese steel exhibits high strength, ductility, and wear resistance, making it promising for applications like LNG tanks, flanges, and valves. To operate in cryogenic environments, hot forging and heat treatment processes are vital, especially in flange production. The cooling rate during high-temperature cooling after hot forging plays a critical role in influencing the microstructure and mechanical properties of high manganese steel. The rate at which cooling occurs during this process influences the size of the grains and the distribution of manganese and consequently has an impact on mechanical properties. This study assessed the microstructure and mechanical properties based on different cooling rates during the hot forging of High-Mn steel flanges. Comparing air and water cooling after hot forging, followed by heat treatment, revealed notable differences in grain size. These differences directly impacted mechanical properties such as tensile strength, hardness, and Charpy impact property. Understanding these effects is crucial for optimizing the performance and reliability of High-Mn steel in cryogenic applications.

Microstructure and Mechanical Properties of Hot-Stamped 3.2t Boron Steels according to Water Flow Rate in Direct Water Quenching Process (3.2t 보론강 판재 직수냉각 핫스탬핑시 냉각수 유량에 따른 미세조직 및 기계적 특성)

  • Park, Hyeon Tae;Kwon, Eui Pyo;Im, Ik Tae
    • Korean Journal of Materials Research
    • /
    • v.30 no.12
    • /
    • pp.693-700
    • /
    • 2020
  • Direct water quenching technique can be used in hot stamping process to obtain higher cooling rate compared to that of the normal die cooling method. In the direct water quenching process, setting proper water flow rate in consideration of material thickness and the size of the area directly cooled in the component is important to ensure uniform microstructure and mechanical properties. In this study, to derive proper water flow rate conditions that can achieve uniform microstructure and mechanical properties, microstructure and hardness distribution in various water flow rate conditions are measured for 3.2 mm thick boron steel sheet. Hardness distribution is uniform under the flow condition of 1.5 L/min or higher. However, due to the lower cooling rate in that area, the lower flow conditions result in a drastic decrease in hardness in some areas in the hot-stamped part, resulting in low martensite fraction. From these results, it is found that the selection of proper water flow rate is an important factor in hot stamping with direct water quenching process to ensure uniform mechanical properties.

Heat/Mass Transfer and Flow Characteristics Within a Film Cooling Hole of Square Cross Sections (I) - Effects of Blowing Ratio and Reynolds Number - (정사각 막냉각홀 내부에서의 열/물질전달 및 유동 특성 (I) - 분사비 및 레이놀즈 수 효과 -)

  • Kang, Seung-Goo;Rhee, Dong-Ho;Cho, Hyung-Hee
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.26 no.7
    • /
    • pp.927-936
    • /
    • 2002
  • An experimental study has been conducted to investigate the heat/mass transfer characteristics within a film cooling hole of square cross-section for various blowing ratios and Reynolds numbers. The experiments have been performed using a naphthalene sublimation method and the flow field has been analyzed by numerical calculation using a commercial code. A duct flow enters into a film cooling hole in a cross-direction. For the film cooling hole with square cross-section, it is observed that the reattachment of separated flow and the vortices within the hole enhance considerably the heat/mass transfer around the hole entrance region. The heat/mass transfer on the leading edge side of hole exit region increases as the blowing ratios decrease because the main flow induces a secondary vortex. Heat/mass transfer patterns within the square film cooling hole are changed little with the various Reynolds numbers.

Optimization of Evaporator for a Vapor Compression Cooling System for High Heat Flux CPU (고발열 CPU 냉각용 증기 압축식 냉각 시스템의 증발기 최적화)

  • Kim, Seon-Chang;Jeon, Dong-Soon;Kim, Young-Lyoul
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.32 no.4
    • /
    • pp.255-265
    • /
    • 2008
  • This paper presents the optimization process of evaporator for a vapor compression cooling system for high heat flux CPU. The CPU thermal capacity was given by 300W. Evaporating temperature and mass flow rate were $18^{\circ}C$ and 0.00182kg/s respectively. R134a was used as a working fluid. Channel width(CW) and height(CH) were selected as design factors. And thermal resistance, surface temperature of CPU, degree of superheat, and pressure drop were taken as objective responses. Fractional factorial DOE was used in screening phase and RSM(Response Surface Method) was used in optimization phase. As a result, CW of 2.5mm, CH of 2.5mm, and CL of 484mm were taken as an optimum geometry. Surface temperature of CPU and thermal resistance were $33^{\circ}C\;and\;0.0502^{\circ}C/W$ respectively. Thermal resistance of evaporator designed in this study was significantly lower than that of other cooling systems such as water cooling system and thermosyphon system. It was found that the evaporator considered in this work can be a excellent candidate for a high heat flux CPU cooling system.

Multi-objective Optimization of an Injection Mold Cooling Circuit for Uniform Cooling (사출금형의 균일 냉각을 위한 냉각회로의 다중목적함수 최적설계)

  • Park, Chang-Hyun;Park, Jung-Min;Choi, Jae-Hyuk;Rhee, Byung-Ohk;Choi, Dong-Hoon
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.20 no.1
    • /
    • pp.124-130
    • /
    • 2012
  • An injection mold cooling circuit for an automotive front bumper was optimally designed in order to simultaneously minimize the average of the standard deviations of the temperature and the difference in mean temperatures of the upper and lower molds for uniform cooling. The temperature distribution for a specified design was evaluated by Moldflow Insight 2010, a commercial injection molding analysis tool. For efficient design, PIAnO (Process Integration, Automation and Optimization), a commercial PIDO tool, was used to integrate and automate injection molding analysis procedure. The weighted-sum method was used to handle the multi-objective optimization problem and PQRSM, a function-based sequential approximate optimizer equipped in PIAnO, to handle numerically noisy responses with respect to the variation of design variables. The optimal average of the standard deviations and difference in mean temperatures were found to be reduced by 9.2% and 56.52%, respectively, compared to the initial ones.

Prediction of Reentering Ratio of Individual Cooling Towers Scattered on a Building Roof (다수의 냉각탑이 설치된 옥상에서 냉각탑별 재유입률 예측)

  • Lee, Tae-Gu;Moon, Sun-Ae;Yoo, Ho-Seon;Lee, Jae-Heon
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.18 no.11
    • /
    • pp.923-932
    • /
    • 2006
  • In this paper, reentering ratio and cooling capacity of individual cooling towers arrayed on a building roof were studied by a numerical method. The number of 16 cooling towers were divided into 4 banks. It was considered the summer prevailing wind characteristics as west wind and south wind of 5 m/s. It was also considered the roofwall types as the curtainwall and the louverwall that had the outdoor air intake louver in the curtainwall. In this case, the louver was suggested as the solution that could prevent reentering phenomenon due to recirculation and interference of the discharge air. In the case of the curtainwall, the averaged reentering ratio are predicted 13.3% and 24.4% for the west and south wind of 5 m/s, respectively. In the case of the louverwall, the averaged reentering ratio are predicted 2.5% and 9.7% for the west and south wind of 5 m/s, respectively. Therefore, the louverwall is a appropriate solution for reducing the reentering phenomenon.

A Study on the Warpage of Injection Molded Parts for the rapid Cooling and Heating Device (급속냉각·가열장치에 따른 사출성형품의 휨에 관한 연구)

  • Lee, Min;Kim, Tae-Wan
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.16 no.8
    • /
    • pp.5074-5081
    • /
    • 2015
  • A method for improving the warpage of the plastic part is a method of removing residual stress of the plastic product. that a non-uniform cooling are appeared in the injection molding process make uniform cooling. this study was developed the Rapid heating and cooling device used peltier module for uniform cooling. Make the Rapid heating and cooling device(RCHD), for Traditional water cooling device(TWCD) method and the Rapid heating and cooling method warpage were compared and were analyzed and the materials used amorphous ABS polymer. various warpage were compared for the process parameters such as packing pressure, packing time, resin temperature, mold temperature, In the amorphous ABS polymer, TWCD method has higher warpage than RCHD method and show the result to be a bit more uniform cooling. The distribution state of the ABS polymer was confirmed Through the Scanning electron microscope. In the TWCD method the distribution state of the polymer be densely distributed, and RCHS method be distributed wider than TWCD method. this is that injection molded parts be seen that cooling was made uniformly, As the temperature of the mold is gradually progress, Particles of the polymer is increased this is that internal stress was reduced.

Thermal Analysis of a Film Cooling System with Normal Injection Holes Using Experimental Data

  • Kim, Kyung-Min;Lee, Dong-Hyun;Cho, Hyung-Hee;Kim, Moon-Young
    • International Journal of Fluid Machinery and Systems
    • /
    • v.2 no.1
    • /
    • pp.55-60
    • /
    • 2009
  • The present study investigated temperature and thermal stress distributions in a film cooling system with normal injection cooling flow. 3D-numerical simulations using the FEM commercial code ANSYS were conducted to calculate distributions of temperature and thermal stresses. In the simulations, the surface boundary conditions used the surface heat transfer coefficients and adiabatic wall temperature which were converted from the Sherwood numbers and impermeable wall effectiveness obtained from previous mass transfer experiments. As a result, the temperature gradients, in contrast to the adiabatic wall temperature, were generated by conduction between the hot and cold regions in the film cooling system. The gradient magnitudes were about 10~20K in the y-axis (spanwise) direction and about 50~60K in the x-axis (streamwise) direction. The high thermal stresses resulting from this temperature distribution appeared in the side regions of holes. These locations were similar to those of thermal cracks in actual gas turbines. Thus, this thermal analysis can apply to a thermal design of film cooling holes to prevent or reduce thermal stresses.