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http://dx.doi.org/10.5762/KAIS.2015.16.8.5074

A Study on the Warpage of Injection Molded Parts for the rapid Cooling and Heating Device  

Lee, Min (Graduate School of Mechanical Engineering, Pukyong National University)
Kim, Tae-Wan (Dept. of Mechanical Engineering, Pukyong National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.16, no.8, 2015 , pp. 5074-5081 More about this Journal
Abstract
A method for improving the warpage of the plastic part is a method of removing residual stress of the plastic product. that a non-uniform cooling are appeared in the injection molding process make uniform cooling. this study was developed the Rapid heating and cooling device used peltier module for uniform cooling. Make the Rapid heating and cooling device(RCHD), for Traditional water cooling device(TWCD) method and the Rapid heating and cooling method warpage were compared and were analyzed and the materials used amorphous ABS polymer. various warpage were compared for the process parameters such as packing pressure, packing time, resin temperature, mold temperature, In the amorphous ABS polymer, TWCD method has higher warpage than RCHD method and show the result to be a bit more uniform cooling. The distribution state of the ABS polymer was confirmed Through the Scanning electron microscope. In the TWCD method the distribution state of the polymer be densely distributed, and RCHS method be distributed wider than TWCD method. this is that injection molded parts be seen that cooling was made uniformly, As the temperature of the mold is gradually progress, Particles of the polymer is increased this is that internal stress was reduced.
Keywords
acrylonitrile butadiene styrene resin; cooling; Injection molding; peltier module; warpage;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
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