• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.809-810
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.348-349
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.360-361
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• 2005

• Smart Structures and Systems
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• v.22 no.2
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• pp.133-137
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• 2018

Increasing interest in prognostics and health management has heightened the need for wireless sensor networks (WSN) with efficient power sources. Piezoelectric energy harvesters using Pb(Zr,Ti)O3 (PZT) are one of the candidate power sources for WSNs as they efficiently convert mechanical vibration energy into electrical energy. These types of devices are resonated at a specific frequency, which has a significant impact on the amount of energy harvested, by external vibration. Hence, precise prediction of mechanical deformation including modal analysis of piezoelectric devices is crucial for estimating the energy generated under specific conditions. In this study, an experimental vibrational system capable of controlling a wide range of frequencies and accelerations was designed to generate mechanical vibration for piezoelectric energy harvesters. In conjunction with MATLAB, the system automatically finds the resonance frequency of harvesters. A small accelerometer and non-contact laser displacement sensor are employed to investigate the mechanical deformation of harvesters. Mechanical deformation under various frequencies and accelerations were investigated and analyzed based on data from two types of sensors. The results verify that the proposed system can be employed to carry out vibration experiments for piezoelectric harvesters and measurement of their mechanical deformation.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.7
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• pp.703-708
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• 2013

Conventional total hip joint replacement(THR) surgery requires a long incision and long rehabilitation time. The stem used in THR is inserted into the cancellous bone of the femur where it plays the role of the artificial joint. Minimally invasive surgery(MIS) has been devised to reduce muscle damage to patients. In this study, a mechanical stem was developed on the basis of MISto reduce the incision length through the principle of the gear. The mechanical stem consists of six components. A prototypical model for a mechanical stem was fabricated using an acryl-based polymer, and its workability was confirmed. To actualize the mechanical stem, a three-dimensional Bio-CAD modeling technique was applied. The hip joint area based on computed tomography(CT) was reconstructed. The safety of the mechanical stem by applying more load than the weight of a man under virtual surgery environment conditions was confirmed by finite element analysis.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.19-26
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• 2020

Flexible displays have been evolved into curved, foldable, and rollable as the degree of bending increases. Due to the presence of brittle electrodes (e.g. indium-tin oxide (ITO)) that easily cracked and delaminated under severe bending deformation, lowering mechanical stress of the electrodes has been critical issue. Because of this, mechanical stress of brittle electrode in flexible displays has been analyzed mostly in terms of bending radius. On the other hand, in order to make rollable display, various mechanical components such as roller and spring are needed to roll-up or extend the screen for the rollable display apparatus. By these mechanical components, brittle electrode in the rollable display is subjected to the excessive tensile stress due to the retracting force as well as the bending stress by the roller. In this study, mechanical deformation of rollable OLED display was modeled considering boundary conditions of the apparatus. An analytical modeling based on the classical beam theory was introduced in order to investigate the mechanical behavior of the rollable display. In addition, finite element analysis (FEA) was used to analyze the effect of mechanical components in the apparatus on the brittle electrode. Furthermore, a strategy for improving the mechanical reliability of the rollable display was suggested through controlling the stiffness of adhesives in the display panel.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.4
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• pp.266-270
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• 2016

We present a useful and practical manufacturing technique that enables the structural conversion of delicate as-grown nanostructures to more beneficial and robust thin-film frameworks through controlled mechanical rolling. Functional nanostructures such as carbon nanotubes grown through chemical vapor deposition in a vertically aligned and very loosely packed manner, and thus difficult to manipulate for subsequent uses, can be prepared in an array of thin blades by patterning the growth catalyst layer. They can then be toppled as dominos through precisely controlled mechanical rolling. The nanostructures formulated to horizontally aligned thin films are much more favorable for device applications typically based on thin-film configuration. The proposed technique may broaden the functionality and applicability of as-grown nanostructures by converting them into thin-film frameworks that are easier to handle and more durable and favorable for fabricating thin-film devices for electronics, sensors, and other applications.

• Journal of Mechanical Science and Technology
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• v.20 no.9
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• pp.1361-1370
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• 2006

An electronic beam mis-landing phenomenon on the RGB (red/green/blue) -fluorescent surface has been considered as one of serious problems to be solved in cathode-ray tube (CRT), which is generally caused by mechanical shock and vibration. In this work, structural design concepts on the major parts of the CRT, such as a frame, a shadow mask, and a spring, are studied to improve the mechanical shockproof character of a CRT by FEM-analyses and experimental approaches ; a frame is newly designed to have strength employing the double-corner-beads which reduces considerably the distortion of the frame and the shadow mask : the edge-bead of a shadow-mask is redesigned to maintain the wide curved surface of a shadow-mask after mechanical shock : finally, a spring supporting the frame and the shadow-mask is designed to have enough flexibility along drop-direction. As an example, a conventional type of a 15inch CRT was utilized to demonstrate the feasibility and usefulness of this work. Overall, some favorable information on the structural design of the CRT is achieved, and the mechanical shockproof character of a 15-inch CRT is improved in the degree of 3G $(1G=9.81m/s^2)$ as an average-value.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.441-442
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• 2002

Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.435-437
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• 2002

Polishing of copper, a process called copper chemical mechanical polishing, is a critical, intermediate step in the planarization of silicon wafers. During polishing, the electrodeposited copper films are removed by slurries: and the differential polishing rates between copper and the surrounding silicon dioxide leads to a greater removal of the copper. The differential polishing develops dimples and furrows; and the process is called dishing and erosion. In this work, we present the results of experiments on dishing and erosion of copper-CMP, using patterned silicon wafers. Results are analyzed for the pattern factors and properties of the copper layers. Three types of pads - plain, perforated, and grooved - were used for polishing. The effect of slurry chemistries and pad soaking is also reported.