• Korean Journal of Child Studies
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• v.30 no.5
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• pp.225-243
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• 2009

This study analyzed the effects of dynamic assessment in terms of scaffolding group types and young children's measurement ability levels. Participants were five-year-old children in Busan divided into 2 experimental groups and control groups. The Assessment Tools for Young Children's Measurement Ability (Ko & Hwang, 2008) consisted of 4 sub tests for ‘length', 'width', and 'weight' concepts. Data were analyzed by t-test and ANOVA. Results showed significant differences between experimental and control groups in post-test scores, but no significant differences between individual and peer collaboration groups in amount of scaffolding. Significant improvements showed in all of the measurement ability level groups : individual higher, individual lower, peer collaboration higher and peer collaboration lower level scaffolding groups.

• Journal of Information Technology Services
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• v.11 no.1
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• pp.239-246
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• 2012

The user increases around the WiBro and in which the mobile broad band service is the wireless internet base technology HSDPA, that is the cellular phone foundation technique, and moreover the issue about the user effective quality guarantee emerges but the quality control of the wireless network is the incomplete actual condition. Therefore, the reliability verification according to the development of the system for the performance measure for the continued wireless data service and it and evaluation are needed for the quality control. In this paper, the wireless data service quality measurement system was implemented with the design. The same test environment as the existing network performance measurement program was built for the reliability verification of the embodied device for measuring quality and evaluation and the cost performance was performed. It could confirm that design and embodied wireless data service quality measurement system operated accurately in this paper through the quality measure result value analysis.

• Proceedings of the KIEE Conference
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• 2000.07a
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• pp.85-87
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• 2000

In real-time power system control, it is essential to measure the power system variables which are voltage. current, real and reactive power, power factor, system frequency and etc. this variables can be estimated or calculated by the synchronized phasor informations of voltage and current. Therefore, the synchronized phasor measurement of voltage and current is very important to real-time power system control. So, we develop SPMD(Synchronized Phasor Measurement Device) for synchronized phasor measurement of voltage and current. In this paper, we present the design and implementation of SPMD for real-time phasor measurement and prove its performance by the test results.

• 제어로봇시스템학회:학술대회논문집
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• 1993.10b
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• pp.541-544
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• 1993

This paper attempts to propose new procedures to evaluate roughness of ground metallic surface in the range of 1-10.mu.m from data gained by an optical, in-process measurement of the surfaces. Studies are made to process the data of reflected lights pointed at the surface to be measured. Results obtained are compared with those of measurement by stylus roughness meter. Correlations between the two types of roughness measurement are well. The proposed method can be used as a sensor for a polishing robot.

• Journal of Astronomy and Space Sciences
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• v.32 no.4
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• pp.387-393
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• 2015

This study presents a precise relative navigation algorithm using both laser and Global Positioning System (GPS) measurements in real time. The measurement model of the navigation algorithm between two spacecraft is comprised of relative distances measured by laser instruments and single differences of GPS pseudo-range measurements in spherical coordinates. Based on the measurement model, the Extended Kalman Filter (EKF) is applied to smooth the pseudo-range measurements and to obtain the relative navigation solution. While the navigation algorithm using only laser measurements might become inaccurate because of the limited accuracy of spacecraft attitude estimation when the distance between spacecraft is rather large, the proposed approach is able to provide an accurate solution even in such cases by employing the smoothed GPS pseudo-range measurements. Numerical simulations demonstrate that the errors of the proposed algorithm are reduced by more than about 12% compared to those of an algorithm using only laser measurements, as the accuracy of angular measurements is greater than $0.001^{\circ}$ at relative distances greater than 30 km.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1844-1849
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• 2014

Existing measurement methods using microscopes or surface roughness measurement instruments for surface control in manufacturing die are low in their efficiency when they are applied in industrial fields due to structural problems. Therefore, it is very important to develop a measurement and analysis system which can enhance efficiency in the measurement of different-sized manufacturing dies and provide quality control regardless of location. This study aimed at the development of a portable surface measurement system to satisfy this need. This measurement system was designed and manufactured in such a way as to divide it into three parts: the Base, the Body, and the Optical system. As a result of testing the system, the surface roughness was measured with an accuracy between 94.9 and 99.9%, and the deviation in the measurement value of a circle was within $2{\mu}m$.

• ETRI Journal
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• v.38 no.5
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• pp.1019-1029
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• 2016

The probability hypothesis density (PHD) filter is an effective means to track multiple targets in that it avoids explicit data associations between the measurements and targets. However, the target birth intensity as a prior is assumed to be known before tracking in a traditional target-tracking algorithm; otherwise, the performance of a conventional PHD filter will decline sharply. Aiming at this problem, a novel target birth intensity scheme and an improved measurement-driven scheme are incorporated into the PHD filter. The target birth intensity estimation scheme, composed of both PHD pre-filter technology and a target velocity extent method, is introduced to recursively estimate the target birth intensity by using the latest measurements at each time step. Second, based on the improved measurement-driven scheme, the measurement set at each time step is divided into the survival target measurement set, birth target measurement set, and clutter set, and meanwhile, the survival and birth target measurement sets are used to update the survival and birth targets, respectively. Lastly, a Gaussian mixture implementation of the PHD filter is presented under a linear Gaussian model assumption. The results of numerical experiments demonstrate that the proposed approach can achieve a better performance in tracking systems with an unknown newborn target intensity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of the Korea institute for structural maintenance and inspection
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• v.18 no.6
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• pp.105-113
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• 2014

Most operating civil structures measure response data continuously by various types of sensors and evaluate their health conditions. Measurement control criteria for such civil structures are usually defined in the first operating stage by experts working at a construction or engineering company. However, a few studies have been carried to examine the adequacy of these measurement control criteria based on the actual measured data. The paper introduces a systematic way of resetting the measurement control criteria for the measured monitoring data based on the statistical aspects of the measured data. The proposed statistical approach has been examined with actually measured time-history data from a bridge structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.