• Title/Summary/Keyword: Material Removal rate

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Biofiltration of Air Streams Contaminated Hydrogen Sulfide : Performance Evaluation of Different Carriers

  • Jeong, Gwi-Taek;Lee, Gwang-Yeon;Lee, Kyoung-Min;Cha, Jin-Myoung;Joe, Yong-Il;Park, Don-Hee
    • 한국생물공학회:학술대회논문집
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    • 2005.10a
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    • pp.456-462
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    • 2005
  • The objective of this study was to develop a removal process by which $H_2S$ could be biologically removed from the odoriferous gases generated in the waste food recycling process. In order to develop this process we were first required to select a proper biofilter support protocol. When the selected biofilter equipment was then tested suing a synthetic odoriferous gas containing 600 ppm of $H_2S$, we noted a maximal removal rate of 658 $g-H_2S/m^3{\cdot}hr$, using polypropylene fibrils as supporting materials. Under identical experimental conditions, we obtained a value of 411.2 $g-H_2S/m^3{\cdot}hr$, using polyurethane as a support material. We also conducted a trial in which volcanic stone was utilized as a support material, and in this trial, we logged a maximal 105.1 $g-H_2S/m^3{\cdot}hr$ removal rate. As the result of our experiments, we concluded that polypropylene fibrils constituted the ideal material for the removal of $H_2S$ gas via biological treatment.

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Effect of Sliding Distance and Temperature on Material Non-uniformity in Oxide CMP (Oxide CMP에서 Sliding Distance와 온도가 재료제거와 연마 불균일도에 주는 영향)

  • Kim, Young-Jin;Park, Boum-Young;Cho, Han-Chul;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.555-556
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    • 2007
  • Through the single head kinematics, sliding distance is a movement of a pad within wafer. The sliding distance is very important to frictional heat, material removal, and so on. A Temperature distribution is similar to sliding distance. But is not same. Because of complex process factor in CMP. A platen velocity is a dominant factor in a temperature and material removal. WIWNU is low in head faster condition.

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Development of Tungsten CMP (Chemical Mechanical Planarization) Slurry using New Abrasive Particle (새로운 연마입자를 이용한 텅스텐 슬러리 개발)

  • Yu, Young-Sam;Kang, Young-Jae;Kim, In-Kwon;Hong, Yi-Koan;Park, Jin-Goo;Jung, Seok-Jo;Byun, Jung-Hwan;Kim, Moon-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.571-572
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    • 2006
  • Tungsten CMP needs interconnect of semiconductor device ULSI chip and metal plug formation, CMP technology is essential indispensable method for local planarization. This Slurry development also for tungsten CMP is important, slurry of metal wiring material that is used present is depending real condition abroad. It is target that this research makes slurry of efficiency that overmatch slurry that is such than existing because focus and use colloidal silica by abrasive particle to internal production technology development. Compared selectivity of slurry that is developed with competitor slurry using 8" tungsten wafer and 8" oxide wafer in this experiment. And removal rate measures about density change of $H_2O_2$ and Fe particle. Also, corrosion potential and current density measure about Fe ion and Fe particle. As a result, selectivity find 83:1, and expressed similar removal rate and corrosion potential and current density value comparing with competitor slurry.

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An Experimental Study on the Ultrasonic Machining Characteristics of Engineering Ceramics

  • Kang Ik Soo;Kim Jeong Suk;Seo Yong Wie;Kim Jeon Ha
    • Journal of Mechanical Science and Technology
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    • v.20 no.2
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    • pp.227-233
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    • 2006
  • Engineering ceramics have many unique characteristics both in mechanical and physical properties such as high temperature hardness, high thermal, chemical and electrical resistance. However, its machinability is very poor in conventional machining due to its high hardness and severe tool wear. In the current experimental study, alumina $(Al_2O_3)$ was ultrasonically machined using SiC abrasives under various machining conditions to investigate the material removal rate and surface quality of the machined samples. Under the applied amplitude of 0.02mm, 27kHz frequency, three slurry ratios of 1:1, 1:3 and 1:5 with different tool shapes and applied static pressure levels, the machining was conducted. Using the mesh number of 240 abrasive, slurry ratio of 1:1 and static pressure of $2.5kg/cm^2$, maximum material removal rate of $18.97mm^3/min$ was achieved. With mesh number of 600 SiC abrasives and static pressure of $3.0kg/cm^2$, best surface roughness of $0.76{\mu}m$ Ra was obtained.

The effect of Pellet about $DeNO_x$ for Packed-bed type reactor (Packed-bed type 반응기에서 $NO_x$제거에 대한 Pellet의 영향)

  • Park, Jae-Yoon;Lee, Kyunh-Ho;Lee, Dong-Hoon;Kim, Jung-Dal;Park, Sang-Hyun;Koh, Hee-Suk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.05b
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    • pp.203-206
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    • 2000
  • In this experiment, an attempt to use pellets($BaTiO_3$, $TiO_2$, ${\gamma}-Al_2O_3$, sludge) for $NO_x$ removal was conducted The effect of pellets on NO removal from simulated flue gas was experimentally investigated for packed-bed reactor of plate-plate geometry. An experimental investigation has been conducted for NO concentration of 50ppm balanced by air, and gas flow rate of $5{\ell}/min$. Ceramic pellets were used for surface discharge and the sludge pellets was added on $BaTiO_3$ and $TiO_2$ to increase $NO_x$ removal rate. In the result, $NO_x$ removal rate using $TiO_2$ was better than other pellets. $NO_2$ segnificatly generated by using $BaTiO_3$ pellets and sludge pellets used with $BaTiO_3$ decreased $NO_2$ generation.

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Experimental Study on Characteristics of Dry Wire Electrical Discharge Machining (EDM) Process (건성 와이어방전가공 프로세스 특성에 관한 실험적 연구)

  • Lee, Sang-Won;Kim, Hong-Seok
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.11-17
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    • 2010
  • This study investigates the non-traditional manufacturing process of dry wire electrical discharge machining (EDM) in which liquid dielectric is replaced by a gaseous medium. Wire EDM experiments of thin workpieces were conducted both in wet and dry EDM conditions to examine the effects of spark cycle (T), spark on-time ($T_{on}$), thickness of work pieces, and work material on machining performance. The material removal rate (MRR) in the dry wire EDM case was much lower than that in the wet wire EDM case. In addition, the thickness of workpiece and work-material were found to be critical factors influencing the MRR for dry EDM process. The relative ratios of spark, arc and short circuit were also calculated and compared to examine the effectiveness of processes of dry and wet wire EDM.

A Study on Mirror-like Polishing of Brittle Material by Elastic Emission Machining (탄성방출가공법에 의한 경취재료의 경면 폴리싱에 관한 연구)

  • 남성호;김정두
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.1009-1014
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    • 1997
  • The small material removal rate of elastic emission machinong (EEM) becomes a serious problem due to using fine powder particles for obtaining finished of high quality. If a cylindrical polyurethane-wheel is used as a tool for accelerating powder particles, the efficiency of machining may be increased through enlarging the machining regionand increasing the surface velocity of the wheel. If these analyicl results are compared with experimental ones, characteristics of EEM using polyurethan-wheel can be clarified. In this study, effects of EEM using cylindrical polyurethane-wheel on the surface roughness and the material removal rate were verified through polishing of the brittle material under various conditions. The high-efficient polishing of silicon wafer has been also carried out using this method.

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A Study on the Characterisitcs of Electircal Discharge Machining (Sic/A1 복합재료의 방전가공 특성에 관한 연구)

  • 우정윤;왕덕현;김원일;이규창
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.3-7
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    • 1996
  • Metal Matrix Composite(MMC) material of 30% SiC particulate based on A1 matrix was machined by drilling and Electrical Discharge Machining (EDM) processes. When drilling process was executed, surface fracture due to brittle property near the bottom was found. It was also found the possiblity of difficult shape of EDM process for MMC material, but few the research about basic EDM characteristics. Material Removal Rate(MRR) was examined for different conditions and the surface morphology was evaluated by roughness values and Scanning Electron Microscopy(SEM) research. The higher the current is, the more MRR was obtained but the higher MRR was showed around 0.45 duty factor. The average roughness of EDMed surface was slightly changed with increased pulse current and increases with duty factor. The SEM photographs of EDMed surface showed recast region after melting.

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Effect of Current Density on Material Removal in Cu ECMP (구리 ECMP에서 전류밀도가 재료제거에 미치는 영향)

  • Park, Eunjeong;Lee, Hyunseop;Jeong, Hobin;Jeong, Haedo
    • Tribology and Lubricants
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    • v.31 no.3
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    • pp.79-85
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    • 2015
  • RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.

NOx removal in cylinder type reactor and Packed-bed type reactor (원통형과 packed-bed형 반응기에서 NOx제거특성)

  • 박재윤;박상현;이경호;하상태;송원섭;황보국
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.499-502
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    • 2001
  • In this experiment, an attempt to use the sludge pellets as catalyst for NO removal from simulated gas is experimentally investigated by using cylinder type reactor and packed-bed reactor. An experimental investigation has been conducted for NO concentration of 50[ppm], 100[ppm], 200[ppm] balanced with air, a gas flow rate of 5[1/min]. Ac voltage to discharge the gases was supplied. In the result, NOx removal rate in packed bed reactor is higher than that in cylinder type reactor. it is thought that plasma density in contact point of BaTiO$_3$ is significantly higher than that in cylinder reactor.

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