• Journal of the Korean Society for Precision Engineering
• /
• v.14 no.8
• /
• pp.82-91
• /
• 1997

The major objective of this study is to establish analytical technique in order to analyze the behaviour of semi-solid material considering induction heating of the billet. Induction heating process is analyzed by using commerical finite element software. ANSYS. The finite element program, SFAC2D, for the simulation of deformation in semi-solid state is developed in the present study. The semi-solid behaviour is described by a viscoplastic model for the solid phase, and by the Darcy's law for the liquid flow. Simple compression and closed-die compression process considering induction heating are analyzed, and also it is found that the distribution of initial solid fraction of the billet has an important effect on deformation behaviour of semi-solid material. In order to verify the effectiveness of proposed analytical technique the simulation result is compared with experimental result.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.11
• /
• pp.954-958
• /
• 2000

The characterization of zinc diffusion processes applied for high-speed avalanche photodiodes has been examined. The different diffusion process conditions for InP test structures were explored. The zinc diffusion profiles, such as the diffusion depth and the zinc dopant concentration, were examined using secondary ion mass spectrometry with varying the process variables and material parameters. It is observed that the diffusion profiles are severly impacted on the process parameters, such as the amount of Zn$_3$P$_2$ source and the diffusion time, as well as material parameters, such as doping concentration of diffusion layer. These results can be utilized for the high-speed avalanche photodiode fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.731-734
• /
• 2000

The characterization of Zinc diffusion processes applied fur high-speed avalanche photodiodes has been examined. The different diffusion process conditions for InP test structures were explored. The Zinc diffusion profiles, such as the diffusion depth and the Zinc dopant concentration, were examined using secondary ion mass spectrometry with varying the process variables and material parameters. It is observed that the diffusion profiles are severely impacted on the process parameters, such as the amount of Zn$_3$P$_2$source and the diffusion time, as well as material parameters, such as doping concentration of diffusion layer. These results can be utilized for the high-speed avalanche photodiode fabrication.

• Aerospace Engineering and Technology
• /
• v.7 no.2
• /
• pp.103-109
• /
• 2008

A study has been conducted on the bulging process of regenerative cooling nozzle which is essential for the manufacturing of liquid rocket thrust chamber. Tension tests have been performed for the material to be used for the development of the bulging process and mechanical properties are obtained by the test. Two or three bulging tools were required to complete the bulging process. The necking of the material was a major failure encountered in the bulging process and a research has revealed that grain size of the material has considerable effect on its occurrence. The presently developed bulging process with a controlled grain size material has been successfully applied to the manufacturing of subscale and 30-tonf full scale regeneratively cooled nozzle while demonstrating the applicability and usefulness of the presently developed bulging process.

• International Journal of Precision Engineering and Manufacturing
• /
• v.2 no.1
• /
• pp.18-25
• /
• 2001

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusion and improves mechanical and corrosion resistance of stainless steel. If there is a Bailby layer, it will be removed and the true structure of the surface will be restored. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of metal object. A new electrolyte composed of phosphoric, sulfuric and distilled water has been developed in this study. Two current density, high & low current density regions, have been applied in this study. In this study, In the region of high current density, there is no plateau region but excellent electrolytic polishing effect can be accomplished in short machining time because material removel process and leveling process occur simultaneously. In the low current density region, there can be found plateau region. The material removal process and leveling process occur successively. The aim of this work is to determine electrolytic polishing for stainless steel in terms of high & low current density and workpiece surface roughness.

• ETRI Journal
• /
• v.35 no.6
• /
• pp.1152-1155
• /
• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of Magnetics
• /
• v.3 no.1
• /
• pp.9-14
• /
• 1998

A non-coercive cast Nd-Fe-B-type material can be easily converted into a coercive one by employing HDDR process. Applying the conventional HDDR process to the Nd-Fe-B-type material generally leads to a powder-like material. HDDR treated material in a solid form can, however, be realised if the process is properly modified (solid-HDDR). In the present study, the change of rigidity (compressive strength) of the Nd-Fe-B-type material during the solid-HDDR has been investigated using a homogeneous sintered magnet with composition $Nd_{13.8}Dy_{0.7}Fe_{78.25}Si_{0.15}Mn_{0.6}B_{6.5}.$ It has been found that the low strength of the hydrided material was improved by the subsequent disproportionation. The restoration of the strength was explained by the eutectoid-like disproportionation structure containing fine neodymium hydride rod embedded in tough iron matrix. The high strength of disproportionated material was reduced radically in earlier stage of recombination, and this wes explained by the reduction of the disproportionated phase. The reduced strength was, however, recovered by further recombination, and this was explained by the fact that as the recombination continues the recombined grains adhere together. The optimally HDDR processed material has a comparable or even higher strength with respect to the initial sintered material prior to the solid-HDDR. The present study suggested that the rigidity of Nd-Fe-B-type material could be retained even after the solid-HDDR.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.43 no.2
• /
• pp.65-71
• /
• 2020

Worldwide plant market keeps maintaining steady growth rate and along with this trend, domestic plant market and its contractors also maintain such growing tendency. However, in spite of its external growth, win-win growth of domestic material industry that occupies the biggest share in plant industry cost portion is extremely marginal in reality. Domestic plant material suppliers are required to increase awareness of domestic material brand by securing quality and reliability of international standard through improvement of design quality superior to that of overseas material suppliers. Improvement of design quality of plant material becomes an essential element, not an option, for survival of domestic plant industry and its suppliers. Under this background, in this study, priority and importance by each evaluation index was analyzed by materializing plant design stage through survey of experts and defining evaluation index by each design stage and based on this analysis result, evaluation index of stage-gate based decision-making process that may improve design quality of plant material was suggested. It is considered that by utilizing evaluation index of stage-gate based decision-making process being suggested in this study, effective and efficient decision-making of project decision-makers would be enabled and it would be contributory to improve design quality of plant material.

• Clean Technology
• /
• v.3 no.2
• /
• pp.13-24
• /
• 1997

The present paper aims to give basic information to establish zero emission material cycle including the minimization of emissions from industrial production processes and the area in regional scale. Strategies and methodologies to analyze emissions from the production processes and our human activities and to reduce those emissions by refining and/or replacing the unit process with the alternatives are introduced as well. Quantitative evaluation and management systems of any raw materials and the production process are from vie points of treatment are essential. Estabiishment of a process networking for the recycle of discharged non-products materials by the intra-process, trans-process and the trans-industries are proposed. Procedures and priorities to formulate industrial and regional zero emission system are proposed as well.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.05a
• /
• pp.127-130
• /
• 2003

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusions and improves mechanical and corrosion resistance of stainless steel. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of a metal object. An electrolyte of phosphoric, sulfuric and distilled water has been used in this study. In the low current density region, there can be found plateau region and material removal process and leveling process occur successively. In this study, an electrochemical polishing process using pulse current is adopted as a new electrochemical polishing process. In electrochemical machining processes, it has been found that pulse electrochemical processes provide an attractive alternative to the electrochemical processes using continuous current. Hence, this study will discuss the electrochemical polishing processes in low current density region and pulse electrochemical polishing.