• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.1
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• pp.79-83
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• 2004

This study was how to control the mass flow controller in gas supplying system. The flow controller consists of piezoelectric material and sensor with heating wire. It is difficult to obtain accurate model, because MFC was composed of many parts, and the relationship between input and output of controller is nonlinear. The model for control was obtained by time constant and DC gain Based on this model, PID controller was applied to flow controller using DSP board. Also, the results were compared to controller using system identification.

• Transactions of Materials Processing
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• v.14 no.1 s.73
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• pp.49-56
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• 2005

In the semi-solid die casting process, an important thing is the flow behavior of semi-solid materials. The flow patterns of the semi-solid material can make the defects during die filling. To control the flow patterns is very important and difficult. In this paper, the flow behavior of the semi-solid A356 alloy material during die filing at various die gate shapes has been observed with the grain size controlled material. The effect of the gate shape on the die filling characteristics was investigated. The filling tests in each plunger stroke were experimented, and also simulated on the semi-solid material die casting process by MAGMAsoft. According to the filling tests and computer simulation, the effect of the gate shape on liquid segregation has been investigated.

• Journal of Korean Institute of Industrial Engineers
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• v.34 no.3
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• pp.296-307
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• 2008

A semiconductor production system has sophisticated manufacturing operations and needs high capital investment for its expensive equipment, which warrants efficient real-time flow control for wafers. In the bay, we consider material handling equipment that can handle multiple carriers of wafers. The dispatching logic first determines the transportation time of each carrier to its destination by each unit of transportation equipment and uses this information to determine the destination machine and target carrier. When there is no available buffer space at the machine tool, the logic allows carriers to stay at the buffer of a machine tool and determine the delay time, which is used to determine the destination of carriers in URL. A simulation study shows this dispatching logic performs better than the procedure currently in use to reduce the mean flow time and average WIP of wafers and increase efficiency of material handling equipment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.34-37
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• 2004

Recently advancing mobile communication tools and I.T industry, semiconductor device is requested more integrated, faster operation time and more scaled-down. Because of these reasons semiconductor device is requested multilayer interconnection. For the multilayer interconnection chemical mechanical polishing (CMP) becomes one of the most useful process in semiconductor manufacturing process. In this experiment, we focus on understand the characterize and improve the CMP technology by control of slurry flow rate. Consequently, we obtain that optimal flow rate of slurry is 170ml/min, since optimal conditions are less chemical flow and performance high with good selectivity to Ta. If we apply this results to copper CMP process. it is thought that we will be able to obtain better yield.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.04a
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• pp.433-436
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• 2011

The effect of plasma on flow characteristics in subsonic flow in backward-facing step is studied. The velocty of main flows are 0.5 m/s. DBD plasma is using for flow control. Stainless foil and polymide films are used as an electrode and dielectric material. The change of flow characteristics are shown by different of plasma generation region in fluid flow.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.36 no.2
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• pp.81-90
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• 2013

Material flow control (MFC) is a kind of operational policy to control of the movement of raw materials, components, and products through the manufacturing lines. It is very important because it varies throughput, line cycle time, and work-in-process (WIP) under the same manufacturing environments. MFC can be largely categorized into three types such as Push, Pull, and Hybrid. In this paper, we set various manufacturing environments to compare five existing MFC mechanisms: Push, Pull, and Hybrid (CONWIP, Gated MaxWIP, Critical WIP Loops, etc). Three manufacturing environments, manufacturing policies (make to stock and make to order), demand (low, medium, high), and line balancing (balanced, unbalanced, and highly unbalanced) are considered. The MFCs are compared in the point of the five functional efficiencies and the proposed compounded efficiency. The simulation results shows that the Push is superior in the functional efficiency and GMWIP is superior in the compounded efficiency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.66-69
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• 1989

After reviewing previous work done on two piezoelectric thin films(PZT, ZnO), ZnO thin piezofim of 1-3UM is fabricated by sputtering on the different substrates(i. e., P+Si/N-Si, SiO2/P+Si/ N-Si, Al/SiO2/ P+Si/ N+Si). The result shows that ZnO piezofilm on the Al has the best c-axis orientation. One of applications for the ZnO piezofilm as an microvalve to control liquid flow is introduced, and which can be controlled electrically and remotely.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.931-937
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• 2003

The principle of the superconducting vortex flow transistor (SVFT) is based on control of the Abrikosov vortex flowing along a channel. The induced voltage is controlled by a bias current and a control current, instead of external magnetic field. The device is composed of parallel weak links with a nearby current control line. We explained the process to get an I-V characteristic equation and described the method to induce the external and internal magnetic field by the Biot-Savarts law in this paper. The equation can be used to predict the I-V curves for fabricated device. From the equation we demonstrated that the current-voltage characteristics were changed with input parameters. I-V characteristics were simulated to analyze a SVFT with multi-channel by a computer program.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.86-95
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• 2002

This paper suggests the new technology to control metal flow in order to reduce the number of preforming and the machining for the cold forged product with complex geometry. This technology is the combined forming that consists of bulk and sheet forming with double action dies. To analyze the process, finite element simulation has been performed. The proposed technology is applied to hub model that is part of air conditioner clutch. The purpose of this study is to investigate the material now of hub through the relative-velocity control of punch and mandrel using the flow control forming technique.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.155-158
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• 2000

Flow defect of a piston-pin for automobile parts is investigated in this study. In cold forging of piston-pin Lapping defect a kind of flow defect appears by the dead metal zone. This appearance evidently happens in products with a thin piercing thickness for the dimension accuracy and the decrease of material loss. The best method that can prevent flow defect is removing dead metal zone. The finite element simulations are applied to analyze the flow defect. This study proposed processes for preventing flow defect by removing dead metal zone. Then the results are compared with the experiments for verification. These FE simulation results are in good agreement with the experimental ones.