• Title/Summary/Keyword: Matching Module

Search Result 158, Processing Time 0.022 seconds

Novel New Approach to Improve Noise Figure Using Combiner for Phase-Matched Receiver Module with Wideband Frequency of 6-18 GHz

  • Jeon, Yuseok;Bang, Sungil
    • Journal of electromagnetic engineering and science
    • /
    • v.16 no.4
    • /
    • pp.241-247
    • /
    • 2016
  • This paper proposes the design and measurement of a 6-18 GHz front-end receiver module that has been combined into a one- channel output from a two-channel input for electronic warfare support measures (ESM) applications. This module includes a limiter, high-pass filter (HPF), power combiner, equalizer and amplifier. This paper focuses on the design aspects of reducing the noise figure (NF) and matching the phase and amplitude. The NF, linear equalizer, power divider, and HPF were considered in the design. A broadband receiver based on a combined configuration used to obtain low NF. We verify that our receiver module improves the noise figure by as much as 0.78 dB over measured data with a maximum of 5.54 dB over a 6-18 GHz bandwidth; the difference value of phase matching is within $7^{\circ}$ between ports.

New Impedance Matching Scheme for 60 GHz Band Electro-Absorption Modulator Modules

  • Choi, Kwang-Seong;Chung, Yong-Duck;Kang, Young-Shik;Jun, Dong-Suk;Ahn, Byoung-Tae;Moon, Jong-Tae;Kim, Je-Ha
    • ETRI Journal
    • /
    • v.28 no.3
    • /
    • pp.393-396
    • /
    • 2006
  • This letter proposes a new impedance matching scheme of a traveling wave electro-absorption modulator (TWEAM) module for a 60 GHz band radio-over-fiber (ROF) link. A microstrip band pass filter (BPF) was used to achieve impedance matching at the 60 GHz band, and termination resistance was carefully designed to obtain an input impedance close to $50\;{\Omega}$. Also, a bias circuit for the device was designed in the module. The measured return loss and frequency response show that the modulator module observes the characteristics of a filter without the need of a further tuning process.

  • PDF

Matching Improvement of RF Matcher for Plasma Etcher (식각장비의 RF 정합모듈 성능 개선)

  • Sul, Yong-Tae;Lee, Eui-Yong;Kwon, Hyuk-Min
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.9 no.2
    • /
    • pp.327-332
    • /
    • 2008
  • New RF matcher module has been proposed in this paper for improvement of RF matcher in plasma etcher system using in semiconductor and display panel manufacturing process. New designed warm gear was used instead of bevel gear in new driving module, and control system was re-arranged with one-chip micro-process technique. The matching performance of new match module was improved in various process condition with reduction of backlash and matching time, and flexible motion of motor compared commercial match module. However this new type RF match module will improve the productivity in etching process of the mass production line.

Design and implementation of interpolated view video (중간 시점 영상 생성 기술 설계 및 구현)

  • Lee, Euisang;Park, Seonghwan;Kim, Junsik;Kim, Sangil;Kim, Kyuheon
    • Proceedings of the Korean Society of Broadcast Engineers Conference
    • /
    • 2018.06a
    • /
    • pp.313-316
    • /
    • 2018
  • 최근 미디어의 생성 및 소비 기술의 발전으로 몰입도 있는 콘텐츠에 대한 수요가 증가하고 있다. View Interpolation 기술은 두 개의 좌/우 영상을 기반으로 하여 두 영상의 중간 시점에 해당하는 영상을 생성해내는 기술이다. 먼저 Depth Hole Filling Module을 이용하여 좌/우 영상 및 그에 대응하는 깊이 지도를 입력으로 받아 깊이 지도에 존재하는 오류를 검출하고, 보정한다. 깊이 지도의 오류 보정이 완료되면, 해당 데이터를 각각 Feature Matching Module 및 Layer Dividing Module로 전달한다. Feature Matching Module은 실사 영상 내의 특징점들을 검출하고, 두 영상 내 특징점을 매칭하는 역할을 수행하며, Layer Dividing Module은 깊이 값을 기반으로 영상의 Layer를 분할한다. Feature Matching Module에서 특징점의 매칭이 완료되면, 특징점의 영상 내 좌표 및 해당 좌표에서의 깊이 값을 Distance Estimating Module로 전달한다. Distance Estimating Module은 전달받은 특징점의 좌표 및 해당 좌표에서의 깊이 값을 기반으로 전체 깊이 값에서의 이동도를 계산한다. 이와 같이 이동도의 계산 및 Layer 분할이 완료되면, 각 Layer를 이동도에 기반하여 이동시키고, 이동된 Layer들을 포개어 배치함으로써 View interpolation을 완성한다.

  • PDF

A Study on Pattern Inspection of LCD Using Color Compensation and Pattern Matching (색상보정 및 패턴 정합기법을 이용한 LCD 패턴검사에 관한 연구)

  • Ye, Soo-Young;Yoo, Choong-Woong;Nam, Ki-Gon
    • Journal of the Institute of Convergence Signal Processing
    • /
    • v.7 no.4
    • /
    • pp.161-168
    • /
    • 2006
  • In this paper, we propose a method for the pattern inspection of LCD module using the color compensation and pattern matching. The pattern matching is generally used for the inspection method of LCD module at the industry. LCD module has many defections such as the brightness difference of the back light, the optic feature of liquid crystal, the difference of the light penetrated by driving LCD and the color difference by the lighting. The conventional method without the color compensation can not solve these defections and decreases the efficiency of inspecting LCD module. The method proposed to inspect defective badness through the pattern matching after it compensated color difference of the LCD occurred by the various causes. At first, it revises with setting by standard tone of color with the LCD pattern of the reference image. And It perform the preprocessing and pattern matching algorithm on the compensated image. In experiment, we confirmed that this algorithm is useful to detect some defections of LCD module. The proposed methods was easy to detect the faulty product.

  • PDF

Implementation of Front End Module for 2.4GHz WLAN Band (2.4GHz 무선랜 대역을 위한 Front End Module 구현)

  • Lee, Yun-Sang;Ryu, Jong-In;Kim, Dong-Su;Kim, Jun-Chul;Park, Jong-Dae;Kang, Nam-Kee
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.15 no.1
    • /
    • pp.19-25
    • /
    • 2008
  • In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

  • PDF

Capacitive compensation and consequent bandwidth expansion of 2.5 Gbps optical transmitter module (2.5Gbps 광송신 모듈의 용량선 보상 및 대역폭 확대)

  • 김성일;김상배;이해영
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.33A no.7
    • /
    • pp.216-222
    • /
    • 1996
  • Since many typical 2.5 Gbps optical transmitter modules use a 50$\Omega$ characteristic impedance, they require relatively high voltage and high power sources compared to the 25$\Omega$ module. However, simple replacement of the 50$\Omega$ internal matching impedance with 25$\Omega$ results in bandwidth reduction and consequent problem of data transmitter module is proposed in order to expand the modulator bandwidth. From the calculated resutls based on accurate 3-dimensional inductance analysis, we have found that the series parasitic inductance is a dominant element limiting the bandwidth and the insertion of a 2.5pF capacitor in parallel to the 20$\Omega$ matching resiter can increase the 3 dB bandwidth about 1.4GHz wider. The time-domain results show the rise time (140 psec) without the compensation is greatly improved to 63 psec with the compensation. This capacitive ocmpensation can be implemented easily and be compatible with common manufacturing process of the optical transmitter module.

  • PDF

A Study on Implementation of Zigbee Module based on CC520 (CC2520 기반의 지그비 모듈 구현에 대한 연구)

  • Moon, Yong-Seon;Bae, Young-Chul;Roh, Sang-Hyun
    • The Journal of the Korea institute of electronic communication sciences
    • /
    • v.5 no.6
    • /
    • pp.664-671
    • /
    • 2010
  • In this paper, we developed a Zigbee module based on CC2520 which is possible to construct the mesh network and also support to Zigbee Pro standard as a preceding research of autonomous moving of mobile robot using Zigbee. After manufacturing the Zigbee module, we selected antenna to fit Zigbee wireless frequency band using network analyze as means performance improvement. We also carry out an impedance matching of Zigbee module, extend the possible distance of two-way wireless communication and ensure the safety of communication.

Motion Estimation Using Feature Matching and Strongly Coupled Recurrent Module Fusion (특징정합과 순환적 모듈융합에 의한 움직임 추정)

  • 심동규;박래홍
    • Journal of the Korean Institute of Telematics and Electronics B
    • /
    • v.31B no.12
    • /
    • pp.59-71
    • /
    • 1994
  • This paper proposes a motion estimation method in video sequences based on the feature based matching and anistropic propagation. It measures translation and rotation parameters using a relaxation scheme at feature points and object orinted anistropic propagation in continuous and discontinuous regions. Also an iterative improvement motion extimation based on the strongly coupled module fusion and adaptive smoothing is proposed. Computer simulation results show the effectiveness of the proposed algorithm.

  • PDF

Improving Stability and Characteristic of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module (Dual band Antenna Switch Module의 LTCC 공정변수에 따른 안정성 및 특성 개선에 관한 연구)

  • Lee Joong-Keun;Yoo Joshua;Yoo Myung-Jae;Lee Woo-Sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.12 no.2 s.35
    • /
    • pp.105-109
    • /
    • 2005
  • A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

  • PDF