• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.41.2-41.2
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.231-231
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• 2010

Thermoelectric properties of a multi-layered thin film, which was composed with indium selenide and bismuth telluride, were investigated. The structure of the layered thin film is Bi-Te /In-Se/Bi-Te and it was prepared on sapphire substrate by RF magnetron sputter using stoichiometric $Bi_2Te_3$ (99.9%) and $In_2Se_3$(99.99%) target at room temperature. Then, it was annealed at temperature range of 150 - $500^{\circ}C$ in Ar ambient. Structural characterizations were done using X-ray diffraction(XRD, BRUKER, D8, 60kW) and transmission electron microscopy (TEM, FEI, Tecnai, F30 S-Twin), respectively. Cross-section of multi-layer structure was observed by Scanning electron microscopy (SEM). The resistivity and Seebeck coefficient of these samples were also measured by conventional equipment at room temperature. The maximum value of power factor was $1.16\;{\mu}W/k^2m$ at annealing temperature of $400^{\circ}C$.

• 마이크로전자및패키징학회지
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• 제18권1호
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• pp.49-53
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• 2011

Diamond-like carbon (DLC)은 $Sp^3$ 결합분율이 높은 준안정 상태의 비정질 탄소물질로 이루어진 박막이다. DLC는 기계적 특성, 화학적 특성, 윤활 특성뿐만 아니라 광학적, 전기적 특성 또한 우수한 물질이다. 본 연구에서는 DLC 박막을 그라파이트(graphite) 타깃을 출발 물질로 하여 고주파 마그네트론 스퍼터(RF magnetron sputter)로 $SiO_2$ 기판 상에 증착하였다. 증착된 DLC 박막은 후 열처리를 하였으며 열처리 온도에 따른 DLC 박막의 특성 변화를 관찰하였다. 열처리는 진공에서 급속가열법(rapid thermal process)으로 $300{\sim}500^{\circ}C$ 범위에서 시행하였다. 열처리된 DLC 박막은 전기적 특성 평가를 위하여 Hall 계수 측정기를 이용하여 상온 비저항을 측정하였으며 표면 변화를 확인하기 위하여 원자력 현미경(atomic force microscopy)을 이용하여 표면형상 변화를 관찰 하였다. 또한 표면특성, 비저항 특성 변화와 구조적 특성 변화와의 관계를 확인하기 위하여 X-선 광전자 분광법(X-ray photoelectron spectroscopy)과 라만 분광법을 이용하여 열처리에 따른 DLC 박막의 구조 변화를 관찰하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 추계학술대회 초록집
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• pp.52.2-52.2
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• 2011

본 연구의 목적은 CIGS 태양전지의 두 가지 TCO층 중 AZO를 제외한 intrinsic ZnO의 전자빔 처리 영향에 대한 특성 분석을 하고자 함이다. 또한 추후 CIGS 태양전지를 제조하여 적용 시 전자빔 처리 전후의 특성이 어떻게 변하는지를 알아보기 위한 사전 실험이다. Intrinsic ZnO는 RF magnetron sputter 를 이용하여 약 100nm의 두께로 증착 하였다. 이때 공정 압력을 변수로 RF power는 80W로 설정 하였으며 Ar 분압은 10mtorr, 5mtorr, 1mtorr로 각각 달리 하며 증착 하였다. 이후 전자빔 처리를 위해 각각의 시편에 Argon flow 7sccm 상태에서 DC power 3kW, RF power 300W의 세기로 전자빔 처리를 실시 하였다. 전자빔 처리에 따른 전기적, 구조적 특성을 분석하기위해 Hall measurement와 SEM, XRD, UV-vis spectroscopy을 사용하였다. 먼저 Hall measurement 측정을 통한 전기적 분석 결과 비저항이 무한대에서 약 $40m{\Omega}{\cdot}cm$로 감소된 결과를 도출 할 수 있었으며, $2{\sim}3.4{\times}10^{18}/cm^3$ 이상의 carrier density 가 측정 되었다. UV-vis spectroscopy를 이용한 투과도 측정결과 모든 시편에서 Band gap이 감소하는 결과를 보였다. SEM, XRD를 이용한 분석결과 결정성 및 grain의 크기가 증가하는 결과를 얻을 수 있었다.

• 한국표면공학회지
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• 제41권2호
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• pp.57-62
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• 2008

Electrochemical properties of Ti-30Ta-$(3{\sim}15)$Nb alloys coated by HA/Ti compound layer have been studied by various electrochemical method. Ti-30Ta binary alloys contained 3, 7, 10, and 15 wt% Nb contents were manufactured by the vacuum furnace system. The specimens were homogenized for 24 hrs at $1000^{\circ}C$. The samples were cut and polished for corrosion test and coating. It was coated with HA/Ti compound layer by magnetron sputter. The HA/Ti non-coated and coated morphology of Ti alloy were analyzed by x-ray diffractometer(XRD) and filed emission scanning electron microscope(FE-SEM). The corrosion behaviors were investigated using potentiodynamic method in 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. The homoginazed Ti-30Ta-$(3{\sim}15wt%$)Nb alloys showed the ${\alpha}+{\beta}$ phase, and ${\beta}$ phase peak was predominantly appeared with increasing Nb content. The microstructure of Ti alloy was transformed from needle-like structure to equiaxed structure as Nb content increased. HA/Ti composite surface showed uniform coating layer with 750 nm thickness. The corrosion resistance of HA/Ti composite coated Ti-alloys were higher than those of the non-coated samples in 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. Especially, corrosion resistance of Ti-Ta-Nb system increased as Nb content increased.

• 한국진공학회지
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• 제20권3호
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• pp.200-204
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• 2011

이 논문에서는 반도체의 기판으로 사용되는 Si(silicon)기판과 금속배선 물질인 Cu(copper)의 확산을 효과적으로 방지하기 위한 W(Tungsten)-C(Carbon)-N(Nitrogen) 확산방지막을 제시하였고, 시료 증착을 위하여 rf magnetron sputter를 사용하여 동일한 증착조건에서 질소(N)의 비율을 다르게 증착한 후 시료의 열적 안정성 측정을 위하여 상온에서 $800^{\circ}C$까지 각각 질소 분위기에서 30분간 열처리 과정을 실시하여 열적 손상을 인가하였다. 이후 Nanoindentation 기법을 이용하여 총 16 points에서 Elastic modulus와 Weibull distribution을 측정하였다. 그 결과 질화물질이 고온에서 물성변화가 적게 나타나는 것을 알 수 있었고, 온도변화에 따른 박막의 균일도와 결정성 또한 질화물질에서 더 안정적이었다.

• 한국결정성장학회지
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• 제21권2호
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• pp.65-69
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• 2011

RF 마그네트론 스퍼터링으로 가스조성비와 기판의 온도를 변화시키면서 $Tio_2$ 박막을 성장하였다. XRD, SEM, AFM 및 분광 광도계를 이용하여 박막의 구조와 광학적 특성을 고찰하였다. 박막에는 아나타제 결정성만 관찰되었으며 온도가 높아질수록 회절 피크의 강도가 증가하였다. 산소농도가 증가함에 따라 기둥구조의 결정성장률이 감소되었으며 굴절률과 흡수율은 감소하였다. $Tio_2$ 박막은 300~400oC의 기판온도와 10 %의 $O_2$ 분위기에서 성장한 박막의 표면이 매끄럽고 투과특성이 우수한 $300{\sim}400^{\circ}C$ 박막을 얻을 수 있었다.

• 열처리공학회지
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• 제23권1호
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• pp.23-28
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• 2010

The cylindrical magnetron sputtering has not been widely used, although this system is useful for only certain types of applications such as fiber coatings. This paper presents electrode configurations which improved the complicacy of the target assembly by using the positive voltage power supply. It is a modified type which has a target constructed with a large cylindrical part, a conical part and a small cylindrical part. When positive voltage was applied to an anode, a stable glow discharge was established and a high deposition rate was obtained. The substrate bias current was monitored to estimate the effect of ion bombardment. As a result, it was found that the substrate current was large. With cylindrical and conical cathode magnetron sputter deposition on the surface of the substrate to prevent re-sputtering, ion impact because it can increase the effectiveness with excellent ductility and adhesion of Ti film deposition can be obtained. We board at the front end of the ground resistance of $5\;k{\Omega}$ attached to the substrate potential can be controlled easily, and Ti film deposition with excellent adhesion can be obtained. Microstructure and morphology of Ti films deposited on pure Cu wires were investigated by scanning electron microscopy in relation to preparation conditions. High level ion bombardment was found to be effective in obtaining a good adhesion for Cu wire coatings.

• 한국표면공학회지
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• 제40권3호
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• pp.117-124
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• 2007

The ITO films were deposited on glass substrates by RF-superimposed dc reactive magnetron sputtering and were annealed in $N_2$ vacuum furnace with temperatures in the range of $403K{\sim}573K$ for 30 minutes. Electrical, optical and structural properties of ITO films were examined with varying annealing temperatures from 403 K to 573 K. The resistivity of as-deposited ITO films was $5.4{\times}10^{-4}{\Omega}cm$ at the sputter conditions of applied RF/DC power of 200/200 W, $O_{2}$ flow of 0.2 seem and Ar flow of 0.2 seem. As a result of annealing in the temperature range of $403K{\sim}573K$, the crystallization occurred at 423 K that is lower than the crystallization temperature caused by a conventional sputtering method. And the resistivity decreased from $5.4{\times}10^{-4}{\Omega}cm\;to\;2.3{\times}10^{-4}{\Omega}cm$, the carrier concentration and mobility of ITO films increased from $4.9{\times}10^{20}/cm^3\;to\;6.4{\times}10^{20}/cm^3$, from $20.4cm^2/Vsec\;to\;41.0cm^2/Vsec$, respectively. The transmittance of ITO films in visible became higher than 90% when annealed in the temperature range of $423K{\sim}573K$. High quality ITO thin films made by RF-superimposed dc reactive magnetron sputtering and annealing in $N_2$ vacuum furnace will be applied to transparent conductive oxides of the advanced flat panel display.

• 한국표면공학회지
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• 제42권5호
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• pp.216-219
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• 2009

A surface acoustic wave (SAW) filter structure was fabricated employing $4{\mu}m$ thick nanocrystalline diamond (NCD) and $2.2{\mu}m$ thick ZnO films on Si wafer. The NCD film was deposited in an $Ar/CH_4$ gas mixture by microwave plasma chemical vapor deposition method. The ZnO film was formed over the NCD film in an RF magnetron sputter using ZnO target and $Ar/O_2$ gas. On the top of the two layers, copper film was deposited by the RF sputter and inter digital transducer (IDT) electrode pattern (line/space : $1.5/1.5{\mu}m$) was defined by the photolithography including a lift-off etching process. The fabricated SAW filter exhibited the center frequency of 1.66 GHz and the phase velocity of 9,960 m/s, which demonstrated that a giga Hertz SAW filter can be realized by utilizing the nanocrystalline diamond thin film.