• Title/Summary/Keyword: MUF

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Bonding Performance of Adhesives with Lamina in Structural Glulam Manufactured by High Frequency Heating System

  • Kim, Keon-Ho;Kim, Se-Jong;Yang, Sang-Yun;Yeo, Hwanmyeong;Eom, Chang-Deuk;Shim, Kugbo
    • Journal of the Korean Wood Science and Technology
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    • v.43 no.5
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    • pp.682-690
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    • 2015
  • The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

The Succession of Microbial Populations and Variation of Enzyme Activities in Composting of Apple Pomace (사과박 퇴비화에서의 미생물군집의 천이와 효소활성도의 변화)

  • Lee, Yong-Ok;Jo, Ik-Hwan;Lee, Yong-Se;Jun, Ha-Joon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.7 no.2
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    • pp.73-82
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    • 1999
  • To verify the usefulness of enzyme activity as a index for the stability or maturity of apple pomace composting. the succession of microbial populations using viable count procedure. and Vmax of ${\beta}$-glucosidase and cellobiohydrolase were measured. based on an increase in fluorescence as the nonfluorescent methylumbelliferyl substrates were enzymatically hydrolyzed, leading to the highly fluorescent methylumbelliferyl molecule 4-methylumbelliferone(MUF). The activities of these enzymes in the decomposition of carbohydrates were gradually decreased in the course of the time. Correlation between microbial population and enzyme activity was not significant with exception of fungi. and the fungi were represented in high density. This indicates that the fungi probably play a major role in composting of apple pomace.

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Effect of Agricultural Straw Addition in Particleboard Bonded with Melamine-urea-formaldehyde Resin (요소-멜라민수지로 접착된 파티클보드에 농작물 짚 첨가의 효과)

  • Lee, Jong-Kyu;Kim, Jong-In;Oh, Yong-Sung
    • Journal of Korean Society of Forest Science
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    • v.94 no.6
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    • pp.476-480
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    • 2005
  • Agricultural straws such as rice and barley were used as partial replacement of raw materials for particleboard (PB) manufacture. A melamine-urea-formaldehyde (MUF) resin, based on 5 percent melamine addition of the resin solids weight, was synthesized in the laboratory for the bonding of PB. PBs were made using two straw particles based on 10, 20, 30, 40% oven dry weight addition with MUF resin. PBs were tested for physical and mechanical properties, and water soak dimensional stability. The results indicated that as rice and barley straws addition level were increased, the properties of IB, MOR and dimensional stabilities such as thickness swell and water absorption were decreased. Overall, the agricultural straws can be used at 15% substitution of raw materials for PB manufacture.

A Study on the CIM Justification (CIM구축의 타당성평가에 관한 연구)

  • 한성배;이석주;이순효
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.18 no.34
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    • pp.51-60
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    • 1995
  • The key competition factor of manufacturing industries has progressively changed from cost to quality and time. Recently, the manufacturing environments more rapidly change than before. So, many companies want to introduce a advanced manufacturing system like CIMS to meet various user's needs and short delivery. But there is a considerable gap between the decision to invest and the achievement of promised benefits. Managers, generally, cannot afford CIM invesment unless they can determine beforehand that CIM will work in thier company and that will provide a coherent strategy and satisfactory return on investment In many cases, it is impossible to justify CIM investment by only economical analysis. Decision making problems like CIM investment are of a multiple objective nature. So, decision making process and multiattribute utility function are very useful methods to evaluate CIM justification In this paper, we described the key functions of CIM justification evaluation using IDEF methodology and developed the applicattion procedure of DMP and MUF method for CIM justification.

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Recent Progress of Hybrid Bonding and Packaging Technology for 3D Chip Integration (3D 칩 적층을 위한 하이브리드 본딩의 최근 기술 동향)

  • Chul Hwa Jung;Jae Pil Jung
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.38-47
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    • 2023
  • Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

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The Characteristics of Thermophilic Fungi in Relation to Growth-Promoting Effect on the Mycelium of Pleurotus ostreatus (Pleurotus ostreatus 균사의 생장 촉진 효과를 나타내는 고온성 곰팡이의 특징)

  • Lee, Ho-Yong;Shin, Chang-Yup;Kim, Jun-Ho;Kim, Won-Rok;Lee, Young-Keun;Chang, Hwa-Hyoung;Song, In-Geun;Hyun, Soung-Hee;Min, Bong-Hee
    • The Korean Journal of Mycology
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    • v.28 no.2
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    • pp.97-102
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    • 2000
  • The mycelial growth of Pleurotus ostreatus in compost is strongly stimulated by solid-state fermentation with thermophilic fungi which were isolated from oyster mushroom compost. The biochemical characteristics of these thermophilic fungi were investigated. Cellulase and ligninase activities were not detected by clear zone effect on CMC and lignin media. All of thermophilic fungi grew well with high mycelial density on xylan media and the growing rate of Sepedonium sp. S-2 observed very high. In results of MUF-test, extracellular enzyme activity of Sepedonium sp. S-2, and S-5 measured very high. On the compost after high temperature fermentation with Sepedonium sp. S-2 and S-5, the mycelial growing rate of Pleurotus ostreatus was increased about 50% and it also showed the inhibiting effect on mycelial growth of Trichoderma sp. SJG-51. Isolated thermophilic fungi, Sepedonium sp. S-2 and S-5 were expected as very useful organism for making oyster mushroom compost.

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Text Mining of Wood Science Research Published in Korean and Japanese Journals

  • Eun-Suk JANG
    • Journal of the Korean Wood Science and Technology
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    • v.51 no.6
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    • pp.458-469
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    • 2023
  • Text mining techniques provide valuable insights into research information across various fields. In this study, text mining was used to identify research trends in wood science from 2012 to 2022, with a focus on representative journals published in Korea and Japan. Abstracts from Journal of the Korean Wood Science and Technology (JKWST, 785 articles) and Journal of Wood Science (JWS, 812 articles) obtained from the SCOPUS database were analyzed in terms of the word frequency (specifically, term frequency-inverse document frequency) and co-occurrence network analysis. Both journals showed a significant occurrence of words related to the physical and mechanical properties of wood. Furthermore, words related to wood species native to each country and their respective timber industries frequently appeared in both journals. CLT was a common keyword in engineering wood materials in Korea and Japan. In addition, the keywords "MDF," "MUF," and "GFRP" were ranked in the top 50 in Korea. Research on wood anatomy was inferred to be more active in Japan than in Korea. Co-occurrence network analysis showed that words related to the physical and structural characteristics of wood were organically related to wood materials.

Cryogenic Mechanical Characteristics of Laminated Plywood for LNG Carrier Insulation System (LNG운반선 방열시스템에 적용되는 적층형 플라이우드의 극저온 기계적 특성 분석)

  • Kim, Jeong-Hyeon;Park, Doo-Hwan;Choi, Sung-Woong;Lee, Jae-Myung
    • Journal of Ocean Engineering and Technology
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    • v.31 no.3
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    • pp.241-247
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    • 2017
  • Plywood, which is created by bonding an odd number of thin veneers perpendicular to the grain orientation of an adjacent layer, was developed to supplement the weak points such as contraction and expansion of conventional wood materials. With structural merits such as strength, durability, and good absorption against impact loads, plywood has been adopted as a structural material in the insulation system of a membrane type liquefied natural gas (LNG) carrier. In the present study, as an attempt to resolve recent failure problems with plywood in an LNG insulation system, conventional PF (phenolic-formaldehyde) resin plywood and its alternative MUF (melamine-urea-formaldehyde) resin bonded plywood were investigated by performing material bending tests at ambient ($20^{\circ}C$) and cryogenic ($-163^{\circ}C$) temperatures to understand the resin and grain effects on the mechanical behavior of the plywood. In addition, the failure characteristics of the plywood were investigated with regard to the grain orientation and testing temperature.

Report of the Oblique Ionospheric Sounding Results from Korea to Japan

  • Bae, Seok-Hee;Park, Chung-Rim;Wee, Kyu-Jin;Akira Ohtani;Mikitoshi Nagayama;Kiyoshi Igarashi
    • International Union of Geodesy and Geophysics Korean Journal of Geophysical Research
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    • v.22 no.1
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    • pp.1.2-5
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    • 1994
  • Ionospheric sounding experiments have been conducted at RRL (Radio Research Laboratory), Ministry of Communications, using Digisonde 256 since its installation in 1990. Routine observations of the vertical sounding are carried out 48 times (or 39 times) a day, at every 24 hour. In addition, we also made oblique sounding experiments to obtain the real time data of Maximum Usable Frequency (MUF) and detect the anomalous HF propagation, as a part of the joint study between RRL and CRL (Communications Research Laboratory) of Japan. The two stations involved in the study were Anyang (RRL, Korea) and Kokubunji (CRL, Japan). The ionosondes used in both stations were Digisonde 256, developed by ULCAR (University of Lowell, Center for Atmospheric Research), U. S. A. , and the synchronization of time was accomplished with the help of GPS receiver. During most part of the experiments RRL transmitted non-modulated pulses, and CRL received them. The experiment was scheduled from October 25 through October 29, 1993. However, the ionosphere was not developed well enough to conduct the experiment with pre-set operation parameters. The experiment became successful (from 0500 UT to 0800 UT, October 29) only after the operation parameters had been changed, and the continuous ionograms were obtained by CRL at 0718 UT and 0733 UT in October 29, 1993. We believe this type of experiment will ensure the qualitative enhancement of solar-terrestrial physics research and a routine observation of the oblique ionospheric sounding. In this report, we present the results of the fore-mentioned oblique sounding as well as the vertical sounding results obtained by Digisonde 256 at Anyang station of RRL.

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Development of an Ultra-Slim System in Package (SiP)

  • Gao, Shan;Hong, Ju-Pyo;Kim, Jin-Su;Yoo, Do-Jae;Jeong, Tae-Sung;Choi, Seog-Moon;Yi, Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.7-18
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    • 2008
  • This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

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