• Title/Summary/Keyword: MM scheme

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Low Temperature Hermetic Packaging using Localized Beating (부분 가열을 이용한 저온 Hermetic 패키징)

  • 심영대;김영일;신규호;좌성훈;문창렬;김용준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.1033-1036
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    • 2002
  • Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

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Low Temperature Hermetic Packaging by Localized Heating using Forced Potential Scheme Micro Heater (Forced Potential Scheme 미세 가열기를 이용한 부분 가열 저온 Hermetic 패키징)

  • 심영대;신규호;좌성훈;김용준
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.2
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    • pp.1-5
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    • 2003
  • In this project, the efficiency of localized heating for micro systems packaging is developed by using a forced potential scheme microheater. Less than 0.2 Mpa contact pressure was used for bonding with a 200 mA current input for $50{\mu}m$ width, $2{\mu}m$ height and $8mm{\times}8mm$, $5mm{\times}5mm$, $3mm{\times}3mm$ sized phosphorus-doped poly-silicon microheater. The temperature can be raised at the bonding region to $800^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3 minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional microheaters. For performing the gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for conducting a gross leak check. The pass ratio of bonded dies was 67%, for conventional localized heating, and 85% for our newly developed FP scheme. The bonding strength was more than 25Mpa for FP scheme packaging, which shows that FP scheme can be a good candidate for micro-scale hermetic packaging.

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An Efficient mmWave MIMO Transmission with Hybrid Precoding

  • Ying Liu;Jinhong Bian;Yuanyuan Wang
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.18 no.7
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    • pp.2010-2026
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    • 2024
  • This work investigates the hybrid precoder scheme in a millimeter wave (mmWave) multi-user MIMO system. We study a sum rate maximization scheme by jointly designing the digital precoder and the analog precoder. To handle the non-convex problem, a block coordinate descent (BCD) method is formulated, where the digital precoder is solved by a bisection search and the analog precoder is addressed by the penalty dual decomposition (PDD) alternately. Then, we extend the proposed algorithm to the sub-connected schemes. Besides, the proposed algorithm enjoys lower computational complexity when compared with other benchmarks. Simulation results verify the performance of the proposed scheme and provide some meaningful insight.

A Wire-overhead-free Reset Propagation Scheme for Millimeter-scale Sensor Systems

  • Lee, Inhee;Bang, Suyoung;Kim, Yejoong;Kim, Gyouho;Sylvester, Dennis;Blaauw, David;Lee, Yoonmyung
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.4
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    • pp.524-533
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    • 2017
  • This paper presents a novel reset scheme for mm-scale sensing systems with stringent volume and area constraints. In such systems, multi-layer structure is required to maximize the silicon area per volume and minimize the system size. The multi-layer structure requires wirebonding connections for power delivery and communication among layers, but the area overhead for wirebonding pads can be significant. The proposed reset scheme exploits already existing power wires and thus does not require additional wires for system-wide reset operation. To implement the proposed reset scheme, a power management unit is designed to impose reset condition, and a reset detector is designed to interpret the reset condition indicated by the power wires. The reset detector uses a coupling capacitor for the initial power-up and a feedback path to hold the developed supply voltage. The prototype reset detector is fabricated in a $180-{\mu}m$ CMOS process, and the measurement results with the prototype mm-scale system confirmed robust reset operation over a wide range of temperatures and voltages.

Influence of Process Design Scheme on Product Qualities in Cylindrical Cup Drawing (원형컵 드로잉의 공정설계 변화가 제품품질에 미치는 영향)

  • 이재명;김종호;원시태
    • Transactions of Materials Processing
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    • v.11 no.8
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    • pp.716-723
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    • 2002
  • A systematic investigation for the process design in deep drawing is necessary to improve the quality of drawn cups. This study concentrates mainly on the influence of process desing scheme on the product qualities in cylindrical cup drawing. Three types of process design scheme were chosen in this study. Case 1 is to draw a finished cup of 50mm in diameter in one stage, Case 2 and Case 3 are redrawing the first drawn cups of 55, 65mm in diameter to the final size respectively. Through experiments the maximum drawing force in two-stage cup drawing can be reduced up to 24% as compared with that of one-stage cup drawing. In addition, Case 3 process results in better product qualities than the other two processes in terms of the distributions of thickness and hardness.

A multi-point sense amplifier for embedded SRAM

  • 장일관;김진국;이승민;곽계달
    • Proceedings of the IEEK Conference
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    • 1998.06a
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    • pp.526-529
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    • 1998
  • This paper describes new sense amplifier with fast sensing delay time of 0.54ns and 32kb CMOS embedded SRAM with 4.67ns access time for a 3-V powr supply. It was achieved using the sense amplifier with multiple point sensing scheme and high speed bit-line scheme. The sense amplifier saves 25% of the power dissipation compared with the conventional one while maintaining a very short sensing delay. The SRAM uses 0.5.mu.m double-polysilicon and triplemetal CMOS process technology. A die size is 1.78mm*2.13mm.

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Communication Scheme Availability Evaluation for Hand off Scheme in Mobile Communication Networks (핸드오프 구조를 갖는 이동통신망에서의 통신 구조 가용도 계정)

  • Lee, Jun-Hyuk;Oh, Young-Hwan
    • Journal of Applied Reliability
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    • v.8 no.4
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    • pp.193-204
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    • 2008
  • In this paper, we proposed availability evaluation of network in mobile communication network that have hand off structure. Radio mobile communication network is essential hand off action to keep communication that is no discontinuance by transfer of terminal. Part by state and hand off state ago hand off by transfer of terminal and communication network is estimated performance according to the hand off rate and hand off completion rate of system. we applied MS, SM, MM communication structure in radio CORBA for network availability evaluate. System availability in mobile communication network that can repair that propose in this study uses the hand off rate and hand off completion rate of system by transfer of terminal and availability of whole system did evaluate.

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Software development for the visualization of brain fiber tract by using 24-bit color coding in diffusion tensor image

  • Oh, Jung-Su;Song, In-Chan;Ik hwan Cho;Kim, Jong-Hyo;Chang, Kee-Hyun;Park, Kwang-Suk
    • Proceedings of the KSMRM Conference
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    • 2002.11a
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    • pp.133-133
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    • 2002
  • Purpose: The purpose of paper is to implement software to visualize brain fiber tract using a 24-bit color coding scheme and to test its feasibility. Materials and Methods: MR imaging was performed on GE 1.5 T Signa scanner. For diffusion tensor image, we used a single shot spin-echo EPI sequence with 7 non-colinear pulsed-field gradient directions: (x, y, z):(1,1,0),(-1,1,0),(1,0,1),(-1,0,1),(0,1,1),(0,1,-1) and without diffusion gradient. B-factor was 500 sec/$\textrm{mm}^2$. Acquisition parameters are as follows: TUTE=10000ms/99ms, FOV=240mm, matrix=128${\times}$128, slice thickness/gap=6mm/0mm, total slice number=30. Subjects consisted of 10 normal young volunteers (age:21∼26 yrs, 5 men, 5 women). All DTI images were smoothed with Gaussian kernel with the FWHM of 2 pixels. Color coding schemes for visualization of directional information was as follows. HSV(Hue, Saturation, Value) color system is appropriate for assigning RGB(Red, Green, and Blue) value for every different directions because of its volumetric directional expression. Each of HSV are assigned due to (r,$\theta$,${\Phi}$) in spherical coordinate. HSV calculated by this way can be transformed into RGB color system by general HSV to RGB conversion formula. Symmetry schemes: It is natural to code the antipodal direction to be same color(antipodal symmetry). So even with no symmetry scheme, the antipodal symmetry must be included. With no symmetry scheme, we can assign every different colors for every different orientation.(H =${\Phi}$, S=2$\theta$/$\pi$, V=λw, where λw is anisotropy). But that may assign very discontinuous color even between adjacent yokels. On the other hand, Full symmetry or absolute value scheme includes symmetry for 180$^{\circ}$ rotation about xy-plane of color coordinate (rotational symmetry) and for both hemisphere (mirror symmetry). In absolute value scheme, each of RGB value can be expressed as follows. R=λw|Vx|, G=λw|Vy|, B=λw|Vz|, where (Vx, Vy, Vz) is eigenvector corresponding to the largest eigenvalue of diffusion tensor. With applying full symmetry or absolute value scheme, we can get more continuous color coding at the expense of coding same color for symmetric direction. For better visualization of fiber tract directions, Gamma and brightness correction had done. All of these implementations were done on the IDL 5.4 platform.

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A Study on the line characteristics and coverage of FLC-C VDSL system. (FLC-C VDSL 선로특성과 Coverage에 관한 연구)

  • 길계태;하종영;권순철;한권훈;신종원;임종대
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.25 no.3B
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    • pp.446-455
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    • 2000
  • In this paper, we analyzed the reach performance of the FLC-C VDSL system using 4-CAP modulation scheme. We measured the attenuation of VDSL lines and their noise characteristics, and calculated the channel capacity. And then, we evaluated the VDSL coverage fro each type of cables; CPEV 0.5mm, CPEV 0.65mm, UTP3 0.5mm, UTP5 0.5mm, FS 0.4mm, FS 0.5mm. In case that FLC-C VDSL modern transmits 25.92 Mbps data over a UTP5 0.5mm cable, the VDSL reach appears to be about 570mm.

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Design of a High-Resolution DCO Using a DAC (DAC를 이용한 고해상도 DCO 설계)

  • Seo, Hee-Teak;Park, Joon-Ho;Park, Jong-Tae;Yu, Chong-Gun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.7
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    • pp.1543-1551
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    • 2011
  • Dithering scheme has been widely used to improve the resolution of DCO(Digitally Controlled Oscillator) in conventional ADPLLs(All Digital Phase Locked Loop). In this paper a new resolution improvement scheme is proposed where a simple DAC(Digital-to-Analog Converter) is employed to overcome the problems of dithering scheme. The frequencies are controled by varactors in coarse, fine, and DAC bank. The DAC bank consists of an inversion mode NMOS varactor. The other varactor banks consist of PMOS varactors. Each varactor bank is controlled by 8bit digital signal. The proposed DCO has been designed in a $0.13{\mu}m$ CMOS process. Measurement results shows that the designed DCO oscillates in 2.8GHz~3.5GHz and has a frequency tuning range of 660MHz and a resolution of 73Hz at 2.8GHz band. The designed DCO exhibits a phase noise of -119dBc/Hz at lMHz frequency offset. The DCO core consumes 4.2mA from l.2V supply. The chip area is $1.3mm{\times}1.3mm$ including pads.