• Journal of Sensor Science and Technology
• /
• v.22 no.2
• /
• pp.150-155
• /
• 2013

Recently, various hearing aids are developed to overcome hearing loss. There are available hearing aids, such as air conduction hearing aid, implantable middle ear hearing aid and so on. But air conduction hearing aid is inconvenience caused by howling, and ossicle chain driving type implantable middle ear hearing aid has some week point due to problem of possible nercobiosis of coupling spot along incus long process. In recent years, in order to improve these shortcomings round window (RW) driving hearing aid has been paying attention. In this paper, the physical cochlear model is proposed for a performance evaluation of the RW driving hearing aids of a transducer. In order to verify an experiment proposed on a performance of physical cochlear model, the transducer which has ossicles characteristics is used. By measuring and comparing the frequency characteristics of transducer with ossicles and human temporal bone, performance of physical cochlear model was verified. As from the result of experiment, it is expected that an implemented cochlear model is useful for evaluating characteristics of RW transducer.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.39C no.1
• /
• pp.82-89
• /
• 2014

Recently, inertial sensors are popularly used for the location and position recognition of small devices for M2M/IoT. In this paper, we designed low power, low noise, small sized 6-axis inertial sensor IC for mobile applications, which uses a 3-axis piezo-electric gyroscope sensor and a 3-axis piezo-resistive accelerometer sensor. Proposed IC is composed of 3-axis gyroscope readout circuit, two gyroscope sensor driving circuits, 3-axis accelerometer readout circuit, 16bit sigma-delta ADC, digital filter and control circuit and memory. TSMC $0.18{\mu}m$ mixed signal CMOS process was used. Proposed IC reduces 27% of the current consumption of LSM330.

• Smart Structures and Systems
• /
• v.4 no.6
• /
• pp.727-740
• /
• 2008

A down hole vertical seismic array is a sequence of instruments installed at various depths in the earth to record the ground motion at multiple points during an earthquake. Numerous studies demonstrate the unique utility of vertical seismic arrays for studying in situ site response and soil behavior. Examples are given of analyses made at two sites to show the value of data from vertical seismic arrays. The sites examined are the Lotung, Taiwan SMART1 array and a new site installed at Jingliao, Taiwan. Details of the installation of the Jingliao array are given. ARX models are theoretically the correct process models for vertical wave propagation in the layered earth, and are used to linearly map deeper sensor input signals to shallower sensor output signals. An example of Event 16 at the Lotung array is given. This same data, when examined in detail with a Bayesian inference model, can also be explained by nonlinear filters yielding commonly accepted soil degradation curves. Results from applying an ARMAX model to data from the Jingliao vertical seismic array are presented. Estimates of inter-transducer soil increment resonant frequency, shear modulus, and damping ratio are presented. The shear modulus varied from 50 to 150 MPa, and damping ratio between 8% and 15%. A new hardware monitoring system - TerraScope - is an affordable 4-D down-hole seismic monitoring system based on independent, microprocessor-controlled sensor Pods. The Pods are nominally 50 mm in diameter, and about 120 mm long. An internal 16-bit micro-controller oversees all aspects of instrumentation, eight programmable gain amplifiers, and local signal storage.

• Journal of Sensor Science and Technology
• /
• v.24 no.6
• /
• pp.379-384
• /
• 2015

An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

• Steel and Composite Structures
• /
• v.38 no.3
• /
• pp.337-353
• /
• 2021

Micro-electro-mechanical systems (MEMS) are widely employed in sensors, biomedical devices, optic sectors, and micro-accelerometers. New reinforcement materials such as carbon nanotubes as well as graphene platelets provide stiffer structures with controllable mechanical specifications by changing the graphene platelet features. This paper deals with buckling analyses of functionally graded graphene platelets micro plates with two piezoelectric layers subjected to external applied voltage. Governing equations are based on Kirchhoff plate theory assumptions beside the modified couple stress theory to incorporate the micro scale influences. A uniform temperature change and external electric field are regarded along the micro plate thickness. Moreover, an external in-plane mechanical load is uniformly distributed along the micro plate edges. The Hamilton's principle is employed to extract the governing equations. The material properties of each composite layer reinforced with graphene platelets of the considered micro plate are evaluated by the Halpin-Tsai micromechanical model. The governing equations are solved by the Navier's approach for the case of simply-supported boundary condition. The effects of the external applied voltage, the material length scale parameter, the thickness of the piezoelectric layers, the side, the length and the weight fraction of the graphene platelets as well as the graphene platelets distribution pattern on the critical buckling temperature change and on the critical buckling in-plane load are investigated. The outcomes illustrate the reduction of the thermal buckling strength independent of the graphene platelets distribution pattern while meanwhile the mechanical buckling strength is promoted. Furthermore, a negative voltage, -50 Volt, strengthens the micro plate stability against the thermal buckling occurrence about 9% while a positive voltage, 50 Volt, decreases the critical buckling load about 9% independent of the graphene platelet distribution pattern.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
• /
• v.8 no.6
• /
• pp.939-946
• /
• 2018

In this work, we present simple schematics for a three-terminal graphene-based nanoelectromechanical switch with the vertical electrode, and we investigated their operational dynamics via classical molecular dynamics simulations. The main structure is both the vertical pin electrode grown in the center of the square hole and the graphene covering on the hole. The potential difference between the bottom gate of the hole and the graphene of the top cover is applied to deflect the graphene. By performing classical molecular dynamic simulations, we investigate the nanoelectromechanical properties of a three-terminal graphene-based nanoelectromechanical switch with vertical pin electrode, which can be switched by the externally applied force. The elastostatic energy of the deflected graphene is also very important factor to analyze the three-terminal graphene-based nanoelectromechanical switch. This simulation work explicitly demonstrated that such devices are applicable to nanoscale sensors and quantum computing, as well as ultra-fast-response switching devices.

• Proceedings of the Korean Ceranic Society Conference
• /
• 2005.06a
• /
• pp.1-112
• /
• 2005

This report is results of a research on recent R&D trends in electroceramics, mainly focusing on the papers submitted to the organizing committee of the International Conference on Electroceramics 2005 (ICE-2005) which was held at Seoul on 12-15 June 2005. About 380 electroceramics researchers attended at the ICE-2005 from 17 countries including Korea, presenting and discussing their recent results. Therefore, we can easily understand the recent research trends in the field of electroceramics by analyses of the subject and contents of the submitted papers. In addition to the analyses of the papers submitted to the ICE-2005, we also collected some informations about domestic and international research trends to help readers understand this report easily. We analysed the R&D trends on the basis of four main categories, that is, informatics electroceramics, energy and environment ceramics, processing and characterization of electroceramics, and emerging fields of electroceramics. Each main category has several sub-categories again. The informatics ceramics category includes integrated dielectrics and ferroelectrics, oxide and nitride semiconductors, photonic and optoelectronic devices, multilayer electronic ceramics and devices, microwave dielectrics and high frequency devices, and piezoelectric and MEMS applications. The energy and environment ceramics category has four sub-categories, that is, rechargable battery, hydrogen storage, fuel cells, and advanced energy conversion concepts. In the processing and characterization category, there exist domain, strain, and epitaxial dynamics and engineering sub-category, innovative processing and synthesis sub-category, nanostructured materials and nanotechnology sub- category, single crystal growth and characterization sub-category, theory and modeling sub-category. Nanocrystalline electroceramics, electroceramics for smart sensors, and bioceramics sub-categories are included to the emerging fields category. We hope that this report give an opportunity to understand the international research trend, not only to Korean ceramics researchers but also to science and technology policy researchers.

• Journal of the Korean earth science society
• /
• v.34 no.6
• /
• pp.588-601
• /
• 2013

In geophysics and geophysical exploration fields, we can use information about inclination and azimuth in various ways. These include borehole deviation logging for inversion process, real-time data acquisition system, geophysical monitoring system, and so on. This type of information is also necessarily used in the directional drilling of shale gas fields. We thus need to develop a subminiature, low-powered, multi-functional inclination and azimuth measurement system for geophysical exploration fields. In this paper, to develop real-time measurement system, we adopt the high performance low power Micro Control Unit (made with state-of-the-art Complementary Metal Oxide Semiconductor technology) and newly released Micro Electro Mechanical Systems Attitude Heading Reference System sensors. We present test results on the development of a multifunctional real-time inclination and azimuth measurement system. The developed system has an ultra-slim body so as to be installed in 42mm sonde. Also, this system allows us to acquire data in real-time and to easily expand its application by synchronizing with a depth encoder or Differential Global Positioning System.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.241-241
• /
• 2008

Macrofore formation in silicon and other semiconductors using electrochemical etching processes has been, in the last years, a subject of great attention of both theory and practice. Its first reason of concern is new areas of macropore silicone applications arising from microelectromechanical systems processing (MEMS), membrane techniques, solar cells, sensors, photonic crystals, and new technologies like a silicon-on-nothing (SON) technology. Its formation mechanism with a rich variety of controllable microstructures and their many potential applications have been studied extensively recently. Porous silicon is formed by anodic etching of crystalline silicon in hydrofluoric acid. During the etching process holes are required to enable the dissolution of the silicon anode. For p-type silicon, holes are the majority charge carriers, therefore porous silicon can be formed under the action of a positive bias on the silicon anode. For n-type silicon, holes to dissolve silicon is supplied by illuminating n-type silicon with above-band-gap light which allows sufficient generation of holes. To make a desired three-dimensional nano- or micro-structures, pre-structuring the masked surface in KOH solution to form a periodic array of etch pits before electrochemical etching. Due to enhanced electric field, the holes are efficiently collected at the pore tips for etching. The depletion of holes in the space charge region prevents silicon dissolution at the sidewalls, enabling anisotropic etching for the trenches. This is correct theoretical explanation for n-type Si etching. However, there are a few experimental repors in p-type silicon, while a number of theoretical models have been worked out to explain experimental dependence observed. To perform ordered macrofore formaion for p-type silicon, various kinds of mask patterns to make initial KOH etch pits were used. In order to understand the roles played by the kinds of etching solution in the formation of pillar arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, N-dimethylformamide (DMF), iso-propanol, and mixtures of HF with water on the macrofore structure formation on monocrystalline p-type silicon with a resistivity varying between 10 ~ 0.01 $\Omega$ cm. The etching solution including the iso-propanol produced a best three dimensional pillar structures. The experimental results are discussed on the base of Lehmann's comprehensive model based on SCR width.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.17 no.5
• /
• pp.1-9
• /
• 2016

Railroad bridges account for 25% of the entire high-speed rail network. Railway bridges are subject to gradual structural degradation or fatigue accumulation due to consistent and repeating excitation by fast moving trains. Wireless sensing technology has opened up a new avenue for bridge health monitoring owing to its low-cost, high fidelity, and multiple sensing capability. On the other hand, measuring the transient response during train passage is quite challenging that the current wireless sensor system cannot be applied due to the intrinsic time delay of the sensor network. Therefore, this paper presents a framework for monitoring such transient responses with wireless sensing systems using 1) real-time excessive vibration monitoring through ultra-low-power MEMS accelerometers, and 2) post-event time synchronization scheme. The ultra-low power accelerometer continuously monitors the vibration and trigger network when excessive vibrations are detected. The entire network of wireless smart sensors starts sensing through triggering and the post-event time synchronization is conducted to compensate for the time error on the measured responses. The results of this study highlight the potential of detecting the impact load and triggering the entire network, as well as the effectiveness of the post-event time synchronized scheme for compensating for the time error. A numerical and experimental study was carried out to validate the proposed sensing hardware and time synchronization method.