• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.5
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• pp.515-523
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• 2015

In this paper, we fabricated and evaluated the gas sensor for the detection of CO gas and $NO_X$ gas among the vehicle exhaust emission gasses. The $SnO_2$ (tin dioxide) layer is used as the detection material, and the thin-film type and the nano-fiber type layers are deposited with various thicknesses using sputtering method and electro spinning method, respectively. The experiments are performed in the chamber where the gas concentration is controlled with mass flow controller. The fabricated devices are applied to the CO and $NO_X$ gas, where the device with the thinner $SnO_2$ layer shows better sensitivity. The nano-fiber has the larger surface area, and the shorter response time and recovery time are obtained. From the experimental results, both types of gas sensors successfully detect CO and $NO_X$ gases, which can be applied to measure those gases from the vehicle emissions.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.8 no.6
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• pp.64-72
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• 2009

In this paper, a high efficiency 2.45 GHz rectenna with a microstrip patch antenna and a dual-mode band-pass filter in which the 2nd and 3rd harmonics are suppressed, is presented. From the experimental results, the 2.45GHz rectenna using 3rd harmonic suppressed dual-mode BPF shows the conversion efficiency of 41.6% with incident power density of 0.3 mW/cm2 and the received power of 1.66 mW. This result shows high conversion efficiency because the received power of this rectenna is lower than other rectennas to be compared with. This rectenna can be applied to the WPT (Wireless Power Transmission) field for energy harvesting. Also, it is expected to be used to provide the stand-by power for the low power devices for USN, and wireless power transfer in sensor application of MEMS devices.

• Smart Structures and Systems
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• v.4 no.6
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• pp.727-740
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• 2008

A down hole vertical seismic array is a sequence of instruments installed at various depths in the earth to record the ground motion at multiple points during an earthquake. Numerous studies demonstrate the unique utility of vertical seismic arrays for studying in situ site response and soil behavior. Examples are given of analyses made at two sites to show the value of data from vertical seismic arrays. The sites examined are the Lotung, Taiwan SMART1 array and a new site installed at Jingliao, Taiwan. Details of the installation of the Jingliao array are given. ARX models are theoretically the correct process models for vertical wave propagation in the layered earth, and are used to linearly map deeper sensor input signals to shallower sensor output signals. An example of Event 16 at the Lotung array is given. This same data, when examined in detail with a Bayesian inference model, can also be explained by nonlinear filters yielding commonly accepted soil degradation curves. Results from applying an ARMAX model to data from the Jingliao vertical seismic array are presented. Estimates of inter-transducer soil increment resonant frequency, shear modulus, and damping ratio are presented. The shear modulus varied from 50 to 150 MPa, and damping ratio between 8% and 15%. A new hardware monitoring system - TerraScope - is an affordable 4-D down-hole seismic monitoring system based on independent, microprocessor-controlled sensor Pods. The Pods are nominally 50 mm in diameter, and about 120 mm long. An internal 16-bit micro-controller oversees all aspects of instrumentation, eight programmable gain amplifiers, and local signal storage.

• Journal of Magnetics
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• v.10 no.3
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• pp.122-127
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• 2005

New classes of LC resonators for micro magnetic sensor device were proposed and fabricated. The first type LC resonator (Type I) consists of a small piece of microwire and two cylindrical electrodes at the end of the microwire without direct contact to its ferromagnetic core. In type I resonator the ferromagnetic core of the microwire and cylindrical electrodes act as an inductor and two capacitors respectively to form a LC circuit. The second type LC resonator (Type II) consists of a solenoidal micro-inductor with a bundle of soft magnetic microwires as a core. The solenoidal micro-inductors fabricated by MEMS technique were $500\sim1,000\;\mu{m}$ in length with $10\sim20$ turns. A capacitor is connected in parallel to the micro-inductor to form a LC circuit. A tiny glass coated $CO_{83.2}B_{3.3}Si_{5.9}Mn_{7.6}$ microwire was fabricated by a glass-coated melt spinning technique. A supergiant magneto-impedance effect was found in a type I resonator as much as 400,000% by precise tuning frequency at around 518.51 MHz. In type II resonator the changes of inductance as a function of external magnetic field in micro-inductors with properly annealed microwire cores were varied as much as 370%. The phase angle between current and voltage was also strongly dependent on the magnetic field. The drastic increments of magnetoimpedance at near the resonance frequency were observed in both types of LC resonators. Accordingly, the sudden change of the phase angle, as large as $180^{\circ}C$, evidenced the occurrence of the resonance at a given external magnetic field.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.17 no.6
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• pp.153-172
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• 2018

Overloading of Commercial vehicles have been an important area of transportation as one of the main causes of pavement damage, bridge collapse, severe traffic accident, etc. In this study, we analyzed the effects of overweight prevention by analyzing overweight driving patterns and using weight sensors. First, we analyzed relevant literatures of overweight and surveyed the commercial weight sensors. Then we chose the typical type of overweight vehicles based of overweight enforcement data analysis. MEMs inclinometer weight sensor were installed to 10 test vehicles and data was collected by weight sensors and gps in real time. As a result of gross vehicle weight and axle weight analysis, it was found weight sensor could decrease overweight rate. However, since the number of samples of test vehicles is insufficient to represent the whole commercial vehicle, further studies are deemed possible through the extension test.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.55-59
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• 2018

In this paper, we investigated the characteristics of shear stress type piezoresistor on a diaphragm structure formed by MEMS (Microelectromechanical System) technology of silicon-direct-bonding (SDB) wafers with Si/$SiO_2$/Si-sub. The diaphragm structure formed by etching the backside of the wafer using a TMAH aqueous solution can be used for manufacturing various sensors. In this study, the optimum shape condition of the shear stress type piezoresistor formed on the diaphragm is found through ANSYS simulation, and the diaphragm structure is formed by using the semiconductor microfabrication technique and the shear stress formed by boron implantation. The characteristics of the piezoelectric resistance are compared with the simulation results. The sensing diaphragm was made in the shape of an exact square. It has been experimentally found that the maximum shear stress for the same pressure at the center of the edge of the diaphragm is generated when the structure is in the exact square shape. Thus, the sensing part of the sensor has been designed to be placed at the center of the edge of the diaphragm. The prepared shear stress type piezoresistor was in good agreement with the simulation results, and the sensitivity of the piezoresistor formed on the $2200{\mu}m{\times}2200{\mu}m$ diaphragm was $183.7{\mu}V/kPa$ and the linearity of 1.3 %FS at the pressure range of 0~100 kPa and the symmetry of sensitivity was also excellent.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.42 no.1
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• pp.39-45
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• 2005

As a basic research for the development of a non-invasive blood glucose sensor using millimeter waves, we have presented a method for measuring the dielectric properties of high loss dielectrics, based on the reflection method, and investigated the variation of the dielectric properties of glucose-water and glucose -0.9% NaCl solutions in the 10～90 GHz range. In the proposed method, a minimal reflection condition is formed by placing a specially-chosen low-loss plane-parallel plate in front of a high-loss medium under test at a given frequency range. Using the minimal power reflection coefficient and the corresponding frequency at this condition, tile dielectric properties of the medium can be determined. The measured results on pure water have shown the adequacy of the proposed method. The measured results on glucose-water and glucose -0.9% NaCl solutions in the 10～90 GHz range showed that the variations of the dielectric properties of glucose solutions according to the change of their glucose concentration were maximum in the 30～45 GHz range. From these facts we concluded that the variation of about 3 mole/L in the glucose solutions must be distinguished With the measurement accuracies of ±0.1 dB and ±0.01 GHz.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.6 no.10
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• pp.373-382
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• 2016

Under the Agricultural technology is influenced from climate that is requisite of seasonal. So this system will cover the problems and develop the agricultural industry as well. So far, the agricultural industry is developing however, it has the points of the weakness because of natural disasters such as wind risk and heavy snow. This paper designs system to change vinyl on the greenhouse. This is a preliminary study for the real-time feedback control of greenhouse. The study developed a wireless IoT sensor system based on authentic technology capacities, to integrate with the protected horticulture Management System. These system was used to evaluate the levels of the snow cover and wind through IoT devices. The existing greenhouse uses the warm water to clear snow or to change methods. This system will recover by changing the vinyl which is covered outside of the greenhouse. The points of the system is changing vinyl to spin pipe. It is contained extra vinyl. The effects of this system are minimized labor protected crops from natural disasters. For this purpose, the study first developed a wireless IoT sensor unit that integrates an MEMS device and wireless communication module. Also, the study developed an operating program that enables real-time response measurement. It will help operational and maintenance greenhouse as a result.

• Journal of Biomedical Engineering Research
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• v.25 no.5
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• pp.329-334
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• 2004

The electronic nose (E-nose) recently finds its applications in medical diagnosis, specifically on detection of diabetes, pulmonary or gastrointestinal problem, or infections by examining odors in the breath or tissues with its odor characterizing ability. The odor recognition performance of E-nose can be improved by manipulating the sensor array responses of vapors in time-profile forms. The different chemical interactions between the sensor materials and the volatile organic compounds (VOC's) leave unique marks in the signal profiles giving more information than collection of the conventional piecemal features, i.e., maximum sensitivity, signal slopes, rising time. In this study, to use them in vapor recognition task conveniently, a novel time-profile method was proposed, which is adopted from digital image pattern matching. The degrees of matching between 8 different vapors were evaluated by using the proposed method. The test vapors are measured by the silicon-based gas sensor array with 16 CB-polymer composites installed in membrane structure. The results by the proposed method showed clear discrimination of vapor species than by the conventional method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.