• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1029-1032
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• 2002

This paper describes a design of a tactile sensor, which can measure three components force and temperature due to thermal conductive. The bio-mimetic tactile sensor, alternative to human's finger, is comprised of four micro force sensors and four thermal sensors, and its size being 10mm$\times$10mm. Each micro force sensor has a square membrane, and its force range is 0.1N - 5N in the three-axis directions. On the other hand, the thermal sensor for temperature measurement has a heater and four temperature sensor elements. The thermal sensor is designed to keep the temperature. $36.5^{\circ}C$, constant, like human skin, and measure the temperature $0^{\circ}C$ to $50^{\circ}C$. The MEMS technology is applied to fabricate the sensing element of the tactile sensor.

• Journal of IKEEE
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• v.13 no.4
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• pp.37-42
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• 2009

In this study, nanopower ZnO and $SnO_2$ as sensing materials were prepared by hydrazine and hydrothermal routes, respectively, and were doped with Pd, Ru catalyst. The CO and $NO_2$ sensors were fabricated by coating of sensing materials on the MEMS-based structure with electrodes and heaters. The 0.1 wt% Pd doped $SnO_2$ sensor and Ru doped ZnO sensor showed the high sensor response to CO 30 ppm and $NO_2$ 1 ppm, respectively. The sensor signal was stable. This can be used for the detection of pollutant gases emitted from gasoline engine.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.41 no.5
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• pp.513-522
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• 2021

A smartphone (SMP) includes a MEMS sensor that can record 3-components motions and has a wireless network device to transmit data in live. These features and relatively low maintenance costs are the advantage of using SMPs as an auxiliary seismic observation network. Currently, 279 SMPs are monitoring seismic motions. In this study, we compare the SMP records with the seismic station (SS) records to validate SMP records. The data used for comparison are records for five earthquakes that occurred in 2019, which are 321 SS data recorded by the Korea Meteorological Administration and the Korea Institute of Geoscience and Mineral Resources and 145 recorded by SMPs. The analysis shows that the event-term corrected average residual of the SMP MEMS sensor records is 0.59 which indicating that the peak horizontal acceleration by SMP is 1.8 factor bigger than the peak ground acceleration by SS. In addition, the residuals tend to decrease as the installation floor of the smartphone MEMS sensor increases, which is the similar trend with response spectra from SS.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Journal of the Korea institute for structural maintenance and inspection
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• v.19 no.4
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• pp.43-48
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• 2015

In this study, a method to enhance the dynamic range of seismic sensor is proposed. The low frequency noise included in the measurement of seismic sensor is modelled as an ARMA(Auto Regressive Moving Average) model and the order and parameters of the model are identified through system identification method. The identified noise model is augmented into Kalmman filter which estimate seismic signal from sensor measurement. The proposed method is applied to a newly developed seismic sensor which is MEMS based 3-axis accelerometer type. The experiment show that the proposed method can enhance the dynamic range compared to the simple low pass filtering.

• Smart Structures and Systems
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• v.6 no.5_6
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• pp.525-543
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• 2010

Testing and validation processes are critical tasks in developing a new hardware platform based on a new technology. This paper describes a series of experiments to evaluate the performance of a newly developed MEMS-based wireless sensor node as part of a wireless sensor network (WSN). The sensor node consists of a sensor board with four accelerometers, a thermometer and filtering and digitization units, and a MICAz mote for control, local computation and communication. The experiments include calibration and linearity tests for all sensor channels on the sensor boards, dynamic range tests to evaluate their performance when subjected to varying excitation, noise characteristic tests to quantify the noise floor of the sensor board, and temperature tests to study the behavior of the sensors under changing temperature profiles. The paper also describes a large-scale deployment of the WSN on a long-span suspension bridge, which lasted over three months and continuously collected ambient vibration and temperature data on the bridge. Statistical modal properties of a bridge tower are presented and compared with similar estimates from a previous deployment of sensors on the bridge and finite element models.

• Journal of Sensor Science and Technology
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• v.30 no.3
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• pp.170-174
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• 2021

As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.5
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• pp.350-354
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• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• Journal of the Korea Society of Computer and Information
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• v.25 no.5
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• pp.73-79
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• 2020

As the number of earthquakes gradually increases on the Korean Peninsula, much research has been actively conducted to detect earthquakes quickly and accurately. Because traditional seismic stations are expensive to install and operate, recent research is currently being conducted to detect earthquakes using low-cost MEMS sensors. In this article, we evaluate how a low-cost MEMS acceleration sensor installed in a smartphone can be used to detect earthquakes. To this end, we installed about 280 smartphones at various locations in Korea to collect acceleration data and then assessed the installed sensors' noise floor through PSD calculation. The noise floor computed from PSD determines the magnitude of the earthquake that the installed MEMS acceleration sensors can detect. For the last few months of real operation, we collected acceleration data from 200 smartphones among 280 installed smartphones and then computed their PSDs. Based on our experiments, the MEMS acceleration sensor installed in the smartphone is capable of observing and detecting earthquakes with a magnitude 3.5 or more occurring within 10km from an epic center. During the last several months of operation, the smartphone acceleration sensor recorded an earthquake of magnitude 3.5 in Miryang on December 30, 2019, and it was confirmed as an earthquake using STA/LTA which is a simple earthquake detection algorithm. The earthquake detection system using MEMS acceleration sensors is expected to be able to detect increasing earthquakes more quickly and accurately.

• Journal of Information Display
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• v.13 no.1
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• pp.51-54
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• 2012

In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.