• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.78-88
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• 2017

Cantilever beam MEMS piezoelectric accelerometers are the simplest and most widely used accelerometer structure. This paper discusses the design of a piezoelectric accelerometer exclusively for SHM applications. While such accelerometers need to operate at a lower frequency range, they also need to possess high sensitivity and low noise floor. The availability of a simple model for deflection, charge, and voltage sensitivities will make the accelerometer design procedure less cumbersome. However, a review of the open literature suggests that such a model has not yet been proposed. In addition, previous works either depended on FEM analysis or only reported on the fabrication and characterization of piezoelectric accelerometers. Hence, this paper presents, for the first time, a simple analytical model developed for the deflection, induced voltage, and charge sensitivity of a cantilever beam piezoelectric accelerometer.The model is then verified using FEM analysis for a range of different cases. Further, the model was validated by comparing the induced voltages of an accelerometer estimated using this model with experimental voltages measured in the accelerometer after fabrication. Subsequently, the design of an accelerometer is demonstrated for SHM applications using the analytical model developed in this work. The designed accelerometer has 60 mV/g voltage sensitivity and 2.4 pC/g charge sensitivity, which are relatively high values compared to those of the piezoresistive and capacitive accelerometers for SHM applications reported earlier.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.394-399
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• 2012

In recent years, MEMS sensors show huge attraction in machine condition monitoring, which have advantages in power, size, cost, mobility and flexibility. They can integrate with smart sensors and MEMS sensors are batch product. So the prices are cheap. And the suitability of it for condition monitoring is researched by experimental study. This paper presents a comparative study and performance test of classification of MEMS sensors in target machine fault classification by 3 intelligent classifiers. We attempt to signal validation of MEMS sensor accuracy and reliability and performance comparisons of classifiers are conducted. MEMS accelerometer and MEMS current sensors are employed for experiment test. In addition, a simple feature extraction and cross validation methods were applied to make sure MEMS sensors availabilities. The result of application is good for using fault classification.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.8
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• pp.872-878
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• 2008

Many industrial operations require continuous or nearly-continuous operation of machines, interruption of which can result in significant cost loss. The condition monitoring of these machines has received considerable attentions in recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is to develop a new type of smart sensor for on-line condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This system is capable for signal preprocessing task and analog to digital converter which is controlled by CPU. This sensor communicates with a remote site PC using TCP/IP protocols. The developed sensor executes performance tests for data acquisition accuracy estimations.

• International Journal of Control, Automation, and Systems
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• v.6 no.6
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• pp.873-883
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• 2008

This paper presents a parametric study on the controller design scheme for a gyro-accelerometer to have robust performance under some parameter variations. In particular, an integral and derivative based controller design method is suggested to achieve the desired performances of stability margin, bandwidth, and uniformity of scale for both gyroscopes and accelerometers with uncertainties of quality factor and resonant frequency. The simulation result shows that the control loop based on the suggested method gives satisfactory performance robustness under parameter variations, demonstrating the usefulness of the proposed design scheme.

• ETRI Journal
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• v.40 no.6
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• pp.794-801
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• 2018

This paper proposes a novel graphene-based optical microelectromechanical systems MEMS accelerometer that is dependent on the intensity modulation and optical properties of graphene. The designed sensing system includes a multilayer graphene finger, a laser diode (LD) light source, a photodiode, and integrated optical waveguides. The proposed accelerometer provides several advantages, such as negligible cross-axis sensitivity, appropriate linearity behavior in the operation range, a relatively broad measurement range, and a significantly wider bandwidth when compared with other important contributions in the literature. Furthermore, the functional characteristics of the proposed device are designed analytically, and are then confirmed using numerical methods. Based on the simulation results, the functional characteristics are as follows: a mechanical sensitivity of 1,019 nm/g, an optical sensitivity of 145.7 %/g, a resonance frequency of 15,553 Hz, a bandwidth of 7 kHz, and a measurement range of ${\pm}10g$. Owing to the obtained functional characteristics, the proposed device is suitable for several applications in which high sensitivity and wide bandwidth are required simultaneously.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.114-120
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• 2012

This paper describes the design, fabrication and testing of a micromachined resonant accelerometer consisting of a symmetrical pair of proof masses and double-ended tuning fork(DETF) oscillators. Under the external acceleration along the input axis, the proof mass applies forces to the oscillators, which causes a change in their resonant frequency. This frequency change is measured to indicate the applied acceleration. Pivot anchor and leverage mechanisms are adopted in the accelerometer to generate larger force from a proof mass under certain acceleration, which enables increasing its scale factor. Finite element method analyses have been conducted to design the accelerometer and a silicon on insulator(SOI) wafer with a substrate glass wafer was used for fabricating it. The fabricated accelerometer has a scale factor of 188 Hz/g, which is shown to be in agreement with analysis results.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2010.10a
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• pp.263-264
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• 2010

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.04a
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• pp.755-756
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• 2012

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.430-435
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• 2004

The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.6
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• pp.851-858
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• 2012

In this paper, we design a seismic data acquisition system(SDAS) and implement it. This system is essential for development of a noble local earthquake disaster preventing system in population center. In the system, we choose a proper MEMS-type triaxial accelerometer as a sensor, and FPGA and ARM processor are used for implementing the system. In the SDAS, each module is realized by Verilog HDL and C Language. We carry out the ModelSim simulation to verify the performances of important modules. The simulation results show that the FPGA-based data acquisition module can guarantee an accurate time-synchronization for the measured data from each axis sensor. Moreover, the FPGA-ARM based embedded technology in system hardware design can reduce the system cost by the integration of data logger, communication sever, and facility control system. To evaluate the data acquisition performance of the SDAS, we perform experiments for real seismic signals with the exciter. Performances comparison between the acquired data of the SDAS and the reference sensor shows that the data acquisition performance of the SDAS is valid.