• Journal of the Korean GEO-environmental Society
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• v.14 no.4
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• pp.47-52
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• 2013

In Korea, the number of mining operations are getting smaller. But buried accidents are on the increase every year. For this reason, it is important to safety management in construction process, especially the worker's safety. In the field of construction needs utilization of integration system according to purpose of utilization, particularly in underground construction sites utilizing is emphasized even more. The current element technologies of location tracking, sensors and wireless communication possible to utilize but it is still difficult to utilization of integration system in construction field because a study is not complete on commercialization and availability. In this study, for real time 3-dimensional management of ubiquitous construction site in ground and underground, measure data using MEMS sensor, EDM and DGPS in 2 test site. Also results were analysed by MATLAB. As a result, error is verification less than 3 meter that possible to distinguish with the naked eye and construct direction of study based on result of former.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.924-926
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• 2006

Sensor networks are an emerging area of mobile computing. Networked sensors represent a new design paradigm enabled by advances in micro electro-mechanical systems (MEMS) and low power technology. Created with integrated circuit (IC) technology and combined with computational logic, these 'smart' sensors have the benefit of small size, low cost and power consumption, and, the capability to perform on-board computation. Though this recent technological innovation has shown a significant promise in many application domains, it has also exposed several technical limitations that must be improved. In this paper, we discuss the system deploy issues for infrared thermo sensor camera calibration.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.90-90
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• 2004

반도체 집적회로 제작 기술을 기반으로 하여 각종 물리량 감지를 위한 미세기계구조물과 각종 물리량의 전기신호로의 변화, 증폭, 보정을 위한 전자회로를 동시에 제작하여 하나의 칩 상에 집적화시킬 수 있는 MEMS 기술이 등장하게 됨에 따라 센서의 소형화, 경량화, 다기능화, 고성능화와 함께 비용을 최소화할 수 있는 장점을 가진 반도체 센서가 급격하게 개발되어 자동차 산업에 상용화되고 있다. 특히 반도체 압력센서는 엔진 제어용 MAP센서에서 가장 먼저 상품화되었으며, 현재 타이어압 센서 그리고 탱크 연료압력센서가 상품화되었고, 에어콘 압력 센서등도 실리콘 센서로 대체하기 위한 단계에와 있다.(중략)

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Review of KIISC
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• v.31 no.1
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• pp.15-23
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• 2021

자율주행 시스템이 탑재되어 있는 무인이동체는 운용환경에 따라 공중, 해상, 육상 무인이동체로 분류할 수 있고 모든 분야에서 관련 기술 개발이 활발히 진행되고 있다. 무인이동체는 자율주행 시스템이 탑재되어 외부 환경을 스스로 인식해 상황을 판단하는 특징을 갖고 있다. 따라서, 무인이동체는 센서로부터 수집되는 데이터를 이용하여 주변 환경을 인식해야 한다. 이러한 이유로 보안 (Security) 분야에서는 무인이동체에 탑재되는 센서를 대상으로 신호 오류주입을 수행하여 해당 무인이동체의 오동작을 유발하는 연구결과들이 최근 발표되고 있다. 신호 오류주입공격은 물리레벨 (PHY-level) 에서 수행되기 때문에, 공격 수행 여부를 소프트웨어 레벨에서 탐지하는 것은 매우 어렵다는 특징을 갖고 있다. 현재까지 신호 오류주입 공격을 탐지할 수 있는 방법은 다수의 센서를 이용하는 센서퓨전 (Sensor Fusion)을 기반으로 하는 방법이 있다. 하지만, 현실적으로 하나의 무인이동체에 동일한 기능을 하는 센서 여러 개를 중복해서 탑재하는 것은 어려움이 있다. 그리고 단일 센서만을 이용하여 신호 오류주입 공격을 탐지하는 방법에 대해서는 아직까지 연구가 진행되고 있지 않다. 본 논문에서는 무인이동체 환경에서 가장 널리 사용되고 있는 MEMS 센서를 대상으로 신호 오류주입 공격을 재연하고, 단일 센서 환경에서 해당 공격을 탐지할 수 있는 방법에 대하여 제안한다.

• Journal of IKEEE
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• v.18 no.1
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• pp.119-127
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• 2014

This paper presents a CMOS readout circuit for MEMS(Micro Electro Mechanical System) acceleration sensors. It consists of a MEMS accelerometer, a capacitance to voltage converter(CVC) and a second-order switched-capacitor ${\Sigma}{\Delta}$ modulator. Correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques are used in the CVC and ${\Sigma}{\Delta}$ modulator to reduce the low-frequency noise and DC offset. The sensitivity of the designed CVC is 150mV/g and its non-linearity is 0.15%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 10% when the input voltage amplitude increases by 100mV, and the modulator's non-linearity is 0.45%. The total sensitivity is 150mV/g and the power consumption is 5.6mW. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V and a operating frequency of 2MHz. The size of the designed chip including PADs is $0.96mm{\times}0.85mm$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Journal of Sensor Science and Technology
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• v.23 no.5
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• pp.326-331
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• 2014

In this study, a MEMS microphone that uses $Si_3N_4$ as the vibration membrane was produced for application as an auditory device using a sound visualization technique (sound visualization) for the hearing impaired. Two sheets of 6-inch silicon wafer were each fabricated into a vibration membrane and back plate, after which, wafer bonding was performed. A certain amount of charge was created between the bonded vibration membrane and the back plate electrodes, and a MEMS microphone that functioned through the capacitive method that uses change in such charge was fabricated. In order to evaluate the characteristics of the prepared MEMS microphone, the frequency flatness, frequency response, properties of phase between samples, and directivity according to the direction of sound source were analyzed. The MEMS microphone showed excellent flatness per frequency in the audio frequency (100 Hz-10 kHz) and a high response of at least -42 dB (sound pressure level). Further, a stable differential phase between the samples of within -3 dB was observed between 100 Hz-6 kHz. In particular, excellent omnidirectional properties were demonstrated in the frequency range of 125 Hz-4 kHz.

• Journal of Sensor Science and Technology
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• v.30 no.3
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• pp.170-174
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• 2021

As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

• Current Research on Agriculture and Life Sciences
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• v.32 no.2
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• pp.79-84
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• 2014

The precision aerial application of agricultural unmanned helicopters has become a new paradigm for small farms with orchards, paddy, and upland fields. The needs of agricultural applications require easy and affordable control systems. Recent developments of MEMS technology based on inertial sensors and high speed DSP have enabled the fabrication of low-cost attitude system. Therefore, this study evaluates inertial MEMS sensors for estimating the attitude of an agricultural unmanned helicopter. The accuracies and errors of gyro and acceleration sensors were verified using a pendulum system. The true motion values were calculated using a theoretical estimation and absolute encoder measurement of the pendulum, and then the sensor output was compared with reference values. When comparing the sensor measurements and true values, the errors were determined to be 4.32~5.72%, 3.53~6.74%, and 3.91~4.16% for the gyro rate and x-, z- accelerations, respectively. Thus, the measurement results confirmed that the inertial sensors are effective for establishing an attitude and heading reference system (AHRES). The sensors would be constructed in gimbals for the estimating and proving attitude measurements in the following paper.