• Journal of Biomedical Engineering Research
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• v.28 no.3
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• pp.348-354
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• 2007

Polymer actuators, which are also called as smart materials, change their shapes when electrical, chemical, thermal, or magnetic energy is applied to them and are useful in wide variety of applications such as microelectromechanical systems (MEMS), machine components, and artificial muscles. For this study, Polyaniline/carbon-nanotube polymer actuator that is one of electroactive polymer actuators was prepared. Since the nonlinear phenomena of hysteresis and a step response are essential considerations for practical use of polymer actuators, we have investigated the movement of the Polyaniline/carbon-nanotube polymer actuator and have developed an integrated model that can be used for simulating and predicting the hysteresis and a step response during actuation. The Preisach hysteresis model, one of the most popular phenomenological models of hysteresis, were used for describing the hysteretic behavior of Polyaniline/carbon-nanotube polymer actuator while the ARX method, one of system identification techniques, were used for modeling a step response. In this paper, we first expain details in preparation of the Polyaniline/carbon-nanotube polymer then present the mathematical description of our model, the extraction of the parameters, simulation results from the model, and finally a comparison with measured data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.965-968
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• 2004

Effective transverse Piezoelectric Coefficients $(e_{31,f})$ of thick PZT $(Pb(Zr_{0.52}Ti{0.48}Ti_{0.48})O_3)$ films on $SiN_x/Si$ substrates were measured with PZT thicknesses and top electrode dimensions. $e_{31,f}$ is one of important Parameters characterizing Piezoelectricity of PZT films. Thick PZT films have been used as various sensors and actuators because of their high driving force and high breakdown voltage. Thick PZT films were fabricated on Pt/Ta/$SiN_x$/Si substrates using sol-gel method. Thicknesses of PZT films were $1{\mu}m$ and $1.8{\mu}m$. $|e_{31,f}|$ values of $1.8{\mu}m$-thick-PZT films were higher than those of $1{\mu}$-thick-PZT films. Maximum $|e_{31,f}|$ of $1.8{\mu}$-thick-PZT films was about $50^{\circ}C/m^2$.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.388-394
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• 2021

The conventional microelectromechanical system (MEMS) process has been used to fabricate sensors with high costs and high-volume productions. Emerging 3D printing can utilize various materials and quickly fabricate a product using low-cost equipment rather than traditional manufacturing processes. 3D printing also can produce the sensor using various materials and design its sensing structure with freely optimized shapes. Hence, 3D printing is expected to be a new technology that can produce sensors on-site and respond to on-demand demand by combining it with open platform technology. Therefore, this paper reviews three standard 3D printing technologies, such as Fused Deposition Modeling (FDM), Direct Ink Writing (DIW), and Digital Light Processing (DLP), which can apply to the sensor fabrication process. The review focuses on strain/load sensors having both sensing material features and structural features as well. NCPC (Nano Carbon Piezoresistive Composite) is also introduced as a promising 3D material due to its favorable sensing characteristics.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.6 s.324
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• pp.59-68
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• 2004

Thanks to the development of microelectromechanical systems(MEMS), wireless communication technology and microsensor technology, it was Possible to manufacture a very small and low costdata acquisition node with sensing function, processing function, wireless communication function and battery. Thus sensor networks begin to be prevailed. The sensor network is a spontaneous system which sets up automatically routing paths and transmits asignificant data to the destination. Sensor nodes requires low-power operation because most of them use a battery as operating power. Sensor nodes transmit a sensing data to the destination. Moreover, they play a router. In fact, because the later consumes more energy than the former, the low-power routing is very important. Sensor networks don't have a routing standard unlike general wireless Ad-hoc networks. So This paper proposes a low-power routing method for anting to sensor networks. It is based on AODV and adapts a method to drop probably RREQ depending on remaining power. We examined it through simulations. From simulation results, we could confirm to reduce power consumption about $10-20\%$ and distribute equally power consumption among nodes.