• Journal of Korea Multimedia Society
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• v.20 no.5
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• pp.731-739
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• 2017

Distributed compressed video sensing (DCVS) is a framework that integrates both compressed sensing and distributed video coding characteristics to achieve a low complexity video sampling. In DCVS schemes, motion estimation & motion compensation is employed at the decoder side, similarly to distributed video coding (DVC), for a low-complex encoder. However, since a simple BCS-SPL algorithm is applied to a residual arising from motion estimation and compensation in conventional MC-BCS-SPL (motion compensated block compressed sensing with smoothed projected Landweber) scheme, the reconstructed visual qualities are severly degraded in Wyner-Ziv (WZ) frames. Furthermore, the scheme takes lots of iteration to reconstruct WZ frames. In this paper, the conventional MC-BCS-SPL algorithm is improved to be operated in more effective way in WZ frames. That is, first, the proposed algorithm calculates a correlation coefficient between two reference key frames and, then, by selecting adaptively the reference frame, the residual reconstruction in pixel domain is performed to the conventional BCS-SPL scheme. Experimental results show that the proposed algorithm achieves significantly better visual qualities than conventional MC-BCS-SPL algorithm, while resulting in the significant reduction of the decoding time.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.7
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• pp.1355-1363
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• 2017

Recently, distributed compressed video sensing (DCVS) has been actively studied in order to achieve a low complexity video encoder by integrating both compressed sensing and distributed video coding characteristics. Conventionally, a motion compensated block compressed sensing with smoothed projected Landweber (MC-BCS-SPL) has been considered as an effective scheme of DCVS with all compressed sensing frames pursuing the simplest sampling. In this scheme, video frames are separately classified into key frames and WZ frames. However, when reconstructing WZ frame with conventional MC-BCS-SPL scheme at the decoder side, the visual qualities are poor for temporally active video sequences. In this paper, to overcome the drawbacks of the conventional scheme, an enhanced MC-BCS-SPL algorithm is proposed, which corrects the initial image with reference to the key frame using a high correlation between adjacent key frames. The proposed scheme is analyzed with respect to GOP (Group of Pictures) structuring method. Experimental results show that the proposed method performs better than conventional MC-BCS-SPL in rate-distortion.

• Journal of Korea Society of Industrial Information Systems
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• v.23 no.6
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• pp.47-58
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• 2018

Recently, remote sensing video applications have become increasingly important in many wireless networks. Distributed compressive video sensing (DCVS) framework in these applications has been studied to reduce encoding complexity and to simultaneously capture and compress video data. Specially, a motion compensated block compressed sensing with smoothed projected Landweber (MC-BCS-SPL) has been actively researched for one useful algorithm of DCVS schemes, However, conventional MC-BCS-SPL schemes do not provide good visual qualities in reconstructed Wyner-Ziv (WZ) frames. In this paper, the conventional schemes of MC-BCS-SPL are described and then upgraded to provide better visual qualities in WZ frames by introducing reliability estimate between adjacent key frames and by constructing efficiently motion-compensated interpolated frames. Through experimental results, it is shown that the proposed algorithm is effective in providing better visual qualities than conventional algorithm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.502-505
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• 2005

To overcome some of the limitations in the conventional photolithography technique, MC-SPL which has advantages such as flexibility and high speed was developed in the past. To make a fine pattern using MC-SPL, there are many variables to control, for example, applied load, scribing speed, chemical etching condition, and etc. In this work, the effect of contact load on the width of the pattern was investigated. The load not only influences the width of the pattern but it also affects the wear of the probe tip. It was found that it is beneficial to load the tip in two stages. Futhermore, the experimental results showed that the pattern width was more sensitive to the initial contact force.

• Journal of Korea Society of Industrial Information Systems
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• v.22 no.2
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• pp.27-34
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• 2017

For The Purpose of Pursuing the Simplest Sampling, a Motion Compensated Block Compressed Sensing with Smoothed Projected Landweber (MC-BCS-SPL) has been Studied for an Effective Scheme of Distributed Compressive Video Sensing with all Compressed Sensing (CS) Frames. However, Conventional MC-BCS-SPL Scheme is Very Simple and so it Does not Provide Good Visual Qualities in Reconstructed Wyner-Ziv (WZ) Frames. In this Paper, the Conventional Scheme of MC-BCS-SPL is Modified to Provide Better Visual Qualities in WZ Frames. That is, the Proposed Agorithm is Designed in such a way that the Reference Frame may be Adaptively Selected Based on the Temporal Correlation Between Successive Frames. Several Experimental Results show that the Proposed Algorithm Provides Better Visual Qualities than Conventional Algorithm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.128-128
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• 2004

나노 스케일의 구조물 제작에 있어서 기존의 리소그래피 공정들이 가지는 한계점을 극복하기 위해서 다양한 방식의 새로운 공정들이 개발되고 있다. 특히, 기계-화학적 가공공정을 이용한 미세탐침 기반의 나노리소그래피 기술(Mechano-Chemical Scaning Probe based Lithography; MC-SPL)은 기존의 포토리소그래피 공정의 단점을 극복하고, 보다 경제적이며 패턴 디자인 변경이 유연한 미세 패턴 제작 기술임이 확인되었다.(중략)

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.5
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• pp.22-26
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• 2003

In this work, a new non-photolithographic micro-fabrication technique is presented. The motivation of this work is to overcome the demerits of the most commonly used photolithographic techniques. The micro-fabrication technique presented in this work is a two-step process which consists of mechanical scribing followed by chemical etching. This method has many advantages over other micro-fabrication techniques since it is simple, cost-effective, rapid, and flexible. Also, the technique can be used to obtain a metal structure which has sub-micrometer width patterns. In this paper, the concept of this method and its application to microsystem technology are described.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.228-233
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• 2002

In this work, a new non-photolithographic micro-fabrication technique is presented. The motivation of this work is to overcome the demerits of the most commonly used photolithographic techniques. The micro-fabrication technique presented in this work is a two-step process which consists of mechanical scribing followed by chemical etching. This method has many advantages over other micro-fabrication techniques since it is simple, cost-effective, rapid, and flexible. Also, the technique can be used to obtain a metal structure which has sub-micrometer width patterns. In this paper, the concept of this method and its application to microsystem technology are described.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1043-1047
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• 2003

With the advancement of micro-systems and nanotechnology, the need for ultra-precision fabrication techniques has been steadily increasing. In this paper, a novel nano-structure fabrication process that is based on the fundamental understanding of nano-scale tribological interaction is introduced. The process, which is called Mechano-Chemical Scanning Probe Lithography (MC-SPL), has two steps, namely, mechanical scribing for the removal of a resist layer and selective chemical etching on the scribed regions. Organic monolayers are used as a resist material, since it is essential for the resist to be as thin as possible in order to fabricate more precise patterns and surface structures. The results show that high resolution patterns with sub-micrometer scale width can be fabricated on both silicon and various metal surfaces by using this technique.

• Journal of the Korean Wood Science and Technology
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• v.15 no.3
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1