• 한국멀티미디어학회논문지
• /
• 제20권5호
• /
• pp.731-739
• /
• 2017

Distributed compressed video sensing (DCVS) is a framework that integrates both compressed sensing and distributed video coding characteristics to achieve a low complexity video sampling. In DCVS schemes, motion estimation & motion compensation is employed at the decoder side, similarly to distributed video coding (DVC), for a low-complex encoder. However, since a simple BCS-SPL algorithm is applied to a residual arising from motion estimation and compensation in conventional MC-BCS-SPL (motion compensated block compressed sensing with smoothed projected Landweber) scheme, the reconstructed visual qualities are severly degraded in Wyner-Ziv (WZ) frames. Furthermore, the scheme takes lots of iteration to reconstruct WZ frames. In this paper, the conventional MC-BCS-SPL algorithm is improved to be operated in more effective way in WZ frames. That is, first, the proposed algorithm calculates a correlation coefficient between two reference key frames and, then, by selecting adaptively the reference frame, the residual reconstruction in pixel domain is performed to the conventional BCS-SPL scheme. Experimental results show that the proposed algorithm achieves significantly better visual qualities than conventional MC-BCS-SPL algorithm, while resulting in the significant reduction of the decoding time.

• 한국정보통신학회논문지
• /
• 제21권7호
• /
• pp.1355-1363
• /
• 2017

최근에 낮은 복잡도의 부호화기를 구현하기 위해 분산 비디오 부호화 와 압축센싱을 결합한 구조로서 분산 압축 비디오 센싱기술에 대한 연구가 활발히 진행되고 있다. 기존에 움직임 보상 블록 압축센싱 기술(MC-BCS-SPL)은 가장 간단한 표본화를 추구하면서 모든 압축센싱 프레임을 갖는 DCVS방식중의 효과적인 방안으로 다루어져 왔다. 이 방식은 키 프레임과 WZ 프레임으로 분리하여 압축센싱한다. 그러나 MC-BCS-SPL 방식은 복호화기에서 WZ 프레임을 복원할 때, 움직임이 큰 영상 시퀀스의 경우에 화질 저하가 발생시키는 단점이 존재한다. 본 논문에서는 이러한 기존의 문제점을 극복하기 위한 개선된 MC-BCS-SPL 방식을 제안한다. 제안한 방식은 연속적인 키 프레임 간 에 존재하는 높은 상관관계를 이용하여 키 프레임을 참조함으로써 초기 영상을 보정한다. GOP 예측 구조 방식에 따른 율-왜곡 성능을 비교한다. 다양한 실험 결과를 통하여 제안하는 알고리즘이 기존 알고리즘보다 더 좋은 화질을 제공함을 보여준다.

• 한국산업정보학회논문지
• /
• 제23권6호
• /
• pp.47-58
• /
• 2018

최근에 원거리 비디오 센싱과 같은 응용은 많은 무선 네트워크에 중요한 응용으로 크게 관심을 받고 있다. 분산 압축 비디오 센싱기술은 높은 부호화 복잡도를 간단히 하고, 동시에 비디오 데이터를 캡처함과 동시에 압축함으로써 이 분야에 적용 가능한 기술로 고려되고 있다. 특히, 움직임 보상 블록 압축센싱 기술인 MC-BCS-SPL은 분산 압축 비디오 센싱 방법 중에 효과적인 기술로서 고려되고 있으나, 복원된 위너-지브 프레임에서 우수하지 못한 성능을 제공한다. 본 논문에서는 기존의 MC-BCS-SPL 알고리즘을 살펴보고, 이웃하는 키프레임 사이에 신뢰성에 기초하여 효과적으로 움직임 보상 프레임을 얻는 방법을 도입함으로써 우수한 화질을 제공하는 방법을 제안한다. 다양한 실험 결과를 통하여 제안한 알고리즘은 기존의 알고리즘에 비해 우수한 화질을 제공할 수 있음을 확인한다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 추계학술대회 논문집
• /
• pp.502-505
• /
• 2005

To overcome some of the limitations in the conventional photolithography technique, MC-SPL which has advantages such as flexibility and high speed was developed in the past. To make a fine pattern using MC-SPL, there are many variables to control, for example, applied load, scribing speed, chemical etching condition, and etc. In this work, the effect of contact load on the width of the pattern was investigated. The load not only influences the width of the pattern but it also affects the wear of the probe tip. It was found that it is beneficial to load the tip in two stages. Futhermore, the experimental results showed that the pattern width was more sensitive to the initial contact force.

• 한국산업정보학회논문지
• /
• 제22권2호
• /
• pp.27-34
• /
• 2017

가장 간단한 샘플링을 위한 목적으로 SPL (Smoothed Projected Landweber)기법 기반의 움직임 보상 블록 압축센싱 기법이 모든 센싱 프레임들에 대해 분산 압축 비디오 센싱 기술이 적용되는 효과적인 방안으로 연구되어 오고 있다. 그러나 기존의 움직임 보상 블록기반의 압축센싱 기법은 매우 간단하여 복원된 위너-지브 프레임에서 우수한 화질을 제공하지 못하는 한계점이 있다. 본 논문에서는 기존의 움직임 보상 블록기반의 압축센싱 기법을 이용한 위너-지브 프레임에서 우수한 화질을 제공될 수 있도록 알고리즘을 변형한다. 즉, 제안된 알고리즘은 참조 프레임이 연속적인 프레임들에 있어 시간적 상관관계에 기초해서 적응적으로 선택되도록 하는 방법으로 설계된다. 다양한 실험 결과를 통하여 제안한 알고리즘은 기존의 알고리즘에 비해 우수한 화질을 제공할 수 있음을 확인한다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2004년도 춘계학술대회 논문요약집
• /
• pp.128-128
• /
• 2004

나노 스케일의 구조물 제작에 있어서 기존의 리소그래피 공정들이 가지는 한계점을 극복하기 위해서 다양한 방식의 새로운 공정들이 개발되고 있다. 특히, 기계-화학적 가공공정을 이용한 미세탐침 기반의 나노리소그래피 기술(Mechano-Chemical Scaning Probe based Lithography; MC-SPL)은 기존의 포토리소그래피 공정의 단점을 극복하고, 보다 경제적이며 패턴 디자인 변경이 유연한 미세 패턴 제작 기술임이 확인되었다.(중략)

• International Journal of Precision Engineering and Manufacturing
• /
• 제4권5호
• /
• pp.22-26
• /
• 2003

In this work, a new non-photolithographic micro-fabrication technique is presented. The motivation of this work is to overcome the demerits of the most commonly used photolithographic techniques. The micro-fabrication technique presented in this work is a two-step process which consists of mechanical scribing followed by chemical etching. This method has many advantages over other micro-fabrication techniques since it is simple, cost-effective, rapid, and flexible. Also, the technique can be used to obtain a metal structure which has sub-micrometer width patterns. In this paper, the concept of this method and its application to microsystem technology are described.

• 한국정밀공학회지
• /
• 제19권11호
• /
• pp.228-233
• /
• 2002

In this work, a new non-photolithographic micro-fabrication technique is presented. The motivation of this work is to overcome the demerits of the most commonly used photolithographic techniques. The micro-fabrication technique presented in this work is a two-step process which consists of mechanical scribing followed by chemical etching. This method has many advantages over other micro-fabrication techniques since it is simple, cost-effective, rapid, and flexible. Also, the technique can be used to obtain a metal structure which has sub-micrometer width patterns. In this paper, the concept of this method and its application to microsystem technology are described.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2003년도 춘계학술대회
• /
• pp.1043-1047
• /
• 2003

With the advancement of micro-systems and nanotechnology, the need for ultra-precision fabrication techniques has been steadily increasing. In this paper, a novel nano-structure fabrication process that is based on the fundamental understanding of nano-scale tribological interaction is introduced. The process, which is called Mechano-Chemical Scanning Probe Lithography (MC-SPL), has two steps, namely, mechanical scribing for the removal of a resist layer and selective chemical etching on the scribed regions. Organic monolayers are used as a resist material, since it is essential for the resist to be as thin as possible in order to fabricate more precise patterns and surface structures. The results show that high resolution patterns with sub-micrometer scale width can be fabricated on both silicon and various metal surfaces by using this technique.

• Journal of the Korean Wood Science and Technology
• /
• 제15권3호
• /
• pp.44-55
• /
• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1