• Title/Summary/Keyword: Lumped Capacitance Model

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An Experimental Study on Quantitative Interpretation of Local Convective Heat Transfer for the Fin and Tube Heat Exchanger Using Lumped Capacitance Method (Lumped Capacitance 방법을 이용한 휜-관 열교환기의 정량적 국소 대류 열전달 해석을 위한 실험적 연구)

  • Kim, Ye-Yong;Kim, Gwi-Sun;Jeong, Gyu-Ha
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.2
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    • pp.205-215
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    • 2001
  • An experimental study has been performed to investigate the heat transfer characteristics of fin and tube heat exchanger. The existing transient and steady methods are very difficult to apply for the measurements of heat transfer coefficients of a thin heat transfer model. In this study the lumped capacitance method was adopted. The heat transfer coefficients were measured by using the lumped capacitance method based on the liquid crystal thermography. The method is validated through impinging jet and flat plate flow experiments. The two experiments showed that the results of the lumped capacitance method with polycarbonate model showed very good agreements with those of the transient method with acryl model. The lumped capacitance method showed similar results regardless of the thickness of polycarbonate model. The method was also applied for the heat transfer coefficient measurements of a fin and tube heat exchanger. The quantitative heat transfer coefficients of the plate fin were successfully obtained. As the frontal velocity increased, the heat transfer coefficients were increased, but the color-band shape showed similar patterns regardless of frontal velocity.

Thermal Analysis of Lithium-ion Cell Using Equivalent Properties and Lumped Capacitance Method (등가물성 및 집중용량법을 이용한 리튬-이온 전지의 열해석)

  • Lee, Hee Won;Park, Il Seouk
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.8
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    • pp.775-780
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    • 2013
  • In general, the battery module of an electric vehicle (EV) consists of lithium-ion cells. A lithium-ion battery is a secondary rechargeable battery, and it consists of numerous stacked plates that serve as electrodes and separators. Owing to these microstructural features, its numerical analysis is very expensive. Therefore, this study aims to present a simplified thermal analysis model using equivalent thermal properties, and we compare the experimental results with numerical results for 185.3Ah and 20Ah cells. Furthermore, we show the thermal behavior of cells without the finite element method (FEM) or finite volume method (FVM) by adopting the lumped capacitance method (LCM).

Hemodynamic simulation of the aging effect on the cardiovascular system (심혈관계의 노화현상에 대한 혈류역학적 시뮬레이션)

  • Byun Su-Young;Sohn Jeong L.;Shim Eun-Bo;Ro Sung Tack
    • Proceedings of the KSME Conference
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    • 2002.08a
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    • pp.713-716
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    • 2002
  • Aging effect on the cardiovascular circulation is simulated by lumped parameter model. Aging phenomena can be hemodynamically explained as (1) the increase of flow resistance induced by remodeling of artery vessels and increased viscosity of blood and (2) the reduction of the vessel capacitance caused by arteriosclerosis. Appropriate physiological parameters are evaluated from the clinical data of adults and old men. Simulation results well explain the hypertension with aging of cardiovascular system.

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Shielding 효과를 고려한 회로 설계 방법에 관한 연구

  • 김용규;권대한;황성우
    • Proceedings of the IEEK Conference
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    • 2001.06a
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    • pp.413-416
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    • 2001
  • In high frequency range, RF circuit design without considering shielding effect can cause several significant changes due to increase in parasitic capacitance and inductance between RF signal lines and shielding box. In this paper, bandpass filter has been made to measure the shielding effect and its s-parameter has been measured by Vector Network Analyzer (VNA). Equivalent circuit model including the shielding effect has been constructed with the lumped elements extracted from the 3D electromagnetic simulator, Maxwell SI. Then, the validity of the model is verified using microwave circuit simulator, ADS (Advanced Design System).

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Inductance modeling of intel i486 microprocessor 168 pin PGA package usning RAPHAEL program (PAPHAEL 프로그램을 이용한 인텔 i486 마이크로 프로세서의 168 pin PGA 페키지 인덕턴스 모델링)

  • 박종훈;박홍준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.10
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    • pp.94-100
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    • 1994
  • By using the RAPHAEL 3D inductance calculation program RI3, the PGA package inductance values of INTEL i486 microprocessor have been extracted. The lead frame layouts are drawn using the mentor Boardstation and the output files are converted into the RI3 program input format of RAPHAEL. The power and ground planes of the PGA package are modeled y grid-line structures of single bars. The capacitance valuse of signal lines have been clalculated by using the RAPHAEL 2D/3D capacitance extraction program. The extraced L, C, R values have been converted into the SPICE netlist formats with lumped circuit model for future use in the signal ingegrity analysis.

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Design and Fabrication of InP/InGaAs PIN Photodiode for Horizontally Integrated OEIC's (수평집적형 광전자집적회로를 위한 InP/InGaAs PIN 광다이오드의 설계 및 제작)

  • 여주천;김성준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.4
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    • pp.38-48
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    • 1992
  • OEIC(Optoelectronic Integrated Circuit)'s can be integrated horizontally or vertically. Horizontal integration approach is, however, more immune to parasitic and more universally applicable. In this paper, a structural modeling, fabrication and characterization of PIN photodiodes which can be used in the horizontal integration are performed. For device modeling, we build a transmission line model from 2-D device simulation, from which lumped model parameters are extracted. The speed limits of the PIN photodiodes can also be calculated under various structural conditions from the model. Thus optimum design of horizontally integrated PIN photodiodes for high speed operation are possible. Such InGaAs/InP PIN photodiodes for long-wavelength communications are fabricated using pit etch, epi growth, planarization, diffusion and metallization processes. Planarization process using both RIE and wet etching and diffusion process using evaporated Zn$_{3}P_{2}$ film are developed. Characterization of the fabricated devices is performed through C-V and I-V measurements. At a reserve bias of 10V, the dark current is less than 5nA and capacitance is about 0.4pF. The calculated bandwidth using the measured series resistance and capacitance is about 4.23GHz.

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Common Model EMI Prediction in Motor Drive System for Electric Vehicle Application

  • Yang, Yong-Ming;Peng, He-Meng;Wang, Quan-Di
    • Journal of Electrical Engineering and Technology
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    • v.10 no.1
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    • pp.205-215
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    • 2015
  • Common mode (CM) conducted interference are predicted and compared with experiments in a motor drive system of Electric vehicles in this study. The prediction model considers each part as an equivalent circuit model which is represented by lumped parameters and proposes the parameter extraction method. For the modeling of the inverter, a concentrated and equivalent method is used to process synthetically the CM interference source and the stray capacitance. For the parameter extraction in the power line model, a computation method that combines analytical method and finite element method is used. The modeling of the motor is based on measured date of the impedance and vector fitting technique. It is shown that the parasitic currents and interference voltage in the system can be simulated in the different parts of the prediction model in the conducted frequency range (150 kHz-30 MHz). Experiments have successfully confirmed that the approach is effective.

Simulation Method for Thermal appropriate Desing of Compound Cylinder using Bondgraph Modeling (원통결합부의 열특성 최적설계를 위한 예측 시뮬레이션 방법)

  • 민승환;박기환;이선규
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.635-640
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    • 1996
  • A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

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Temperature Characteristics of Impulsed Magnetizing Fixture System (임펄스 착자요크 시스템의 온도특성에 관한 연구)

  • Baek, S.H.;Maeng, I.J.;Kim, Y.;Kim, P.S.;Ham, J.G.
    • Proceedings of the KIEE Conference
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    • 1993.07b
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    • pp.1098-1100
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    • 1993
  • In this paper, We found the thermal characterstic of impulsed magnetizing fixture system through the SPICE modeling and investigated the applied possibility in application aspects. As the detailed thermal characteristic of magnetizing fixure can be obtained, the efficient design of the magnetizing fixture which produce desired magnet will be possible using our thermal modeling. The purpose of this work is to compute the temperature increasing for different magnetizing conditions. The method uses multi-lumped model with equivalent thermal resistance and thermal capacitance. The model ing and experimental results are in close agreement.

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Characteristics Analysis of Magnetizing Circuit and Fixture considering Temperature Characteristic (온도특성을 고려한 착자회로 및 요크의 특성 해석)

  • Baek, Soo-Hyun;Maeng, In-Jae;Kim, Pill-Soo;Kim, Cherl-Jin
    • Proceedings of the KIEE Conference
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    • 1993.11a
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    • pp.82-84
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    • 1993
  • A method for simulating general characteristics and temperature characteristics of magnetizing fixture coil of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristics of magnetizing circuit can be obtained, the efficient design of the magnetizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, The knowledge of the temperature of the magnetizing fixture is very important to forecast the characteristics of the magnetizing circuits tinder different conditions. The capacitor voltage was not raised above 810[V] to protect the magnetizing fixture from excessive heating. The temperature estimation method uses multi-lumped model with equivalent thermal resistance and thermal capacitance.

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