• Journal of the Korean Ceramic Society
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• v.46 no.6
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• pp.609-614
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• 2009

The low-temperature preparation of porous ceramics was carried out using mixtures of alumina-zinc borosilicate (ZBS) glass. The compositions of alumina-ZBS glass mixture with PMMA pore-former were unfortunately densified. Because PMMA was evaporated below the softening point of ZBS glass ($588{^{\circ}C}$), the densification through the pore-filling caused by the capillary force might occur. Howerver, those with carbon possessed pores where carbon was evaporated above the softening point. The porous ceramic having 35% porosity was successively fabricated by the low-temperature sintering process below $900{^{\circ}C}$ using 45 vol% of alumina, 45 vol% ZBS of glass, and 10 vol% of carbon as starting materials.

• Journal of Powder Materials
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• v.24 no.2
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• pp.115-121
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• 2017

In this work, p-type Bi-Sb-Te alloys powders are prepared using gas atomization, a mass production powder preparation method involving rapid solidification. To study the effect of the sintering temperature on the microstructure and thermoelectric properties, gas-atomized powders are consolidated at different temperatures (623, 703, and 743 K) using spark plasma sintering. The crystal structures of the gas-atomized powders and sintered bulks are identified using an X-ray diffraction technique. Texture analysis by electron backscatter diffraction reveals that the grains are randomly oriented in the entire matrix, and no preferred orientation in any unique direction is observed. The hardness values decrease with increasing sintering temperature owing to a decrease in grain size. The conductivity increases gradually with increasing sintering temperature, whereas the Seebeck coefficient decreases owing to increases in the carrier mobility with grain size. The lowest thermal conductivity is obtained for the bulk sintered at a low temperature (603 K), mainly because of its fine-grained microstructure. A peak ZT of 1.06 is achieved for the sample sintered at 703 K owing to its moderate electrical conductivity and sustainable thermal conductivity.

• Journal of the Korean Ceramic Society
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• v.38 no.7
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• pp.597-601
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• 2001

The effect of CuO, $B_2$ $O_3$, $V_2$ $O_{5}$ and CuO-B $i_2$ $O_3$additives on microwave dielectric properties of (P $b_{0.45}$C $a_{0.55}$) [(F $e_{0.5}$N $b_{0.5}$)$_{0.9}$S $n_{0.1}$] $O_3$(PCFNS) were investigated. The PCFNS ceramics were sintered at 11$65^{\circ}C$. To decrease the sintering temperature for using as a low-temperature co-firing ceramics (LTCC), CuO, $B_2$ $O_3$, $V_2$ $O_{5}$ and CuO-B $i_2$ $O_3$were added to the PCFNS. As the content of CuO increased, the sintered density and dielectric constant increased and the temperature coefficient of resonance frequency ($\tau$$_{f}$) shifted to the positive value. When the CuO-B $i_2$ $O_3$were added, dielectric properties were $\varepsilon$$_{r}$ of 83, Q. $f_{0}$ of 6085 GHz, and $\tau$$_{f}$ of 8ppm/$^{\circ}C$ at a sintering temperature of 100$0^{\circ}C$. The relationship between the microstructure and properties of ceramics was studied by X-ray diffraction and scanning electron microscopy.icroscopy.y.icroscopy.y.

• New & Renewable Energy
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• v.20 no.2
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• pp.71-81
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• 2024

In this study, the electrochemical properties of garnet-structured all-solid-state battery electrolytes (Li_6.4La₃Zr_1.4Ta_0.6O₁₂, hereafter LLZTO) were assessed by altering the calcination temperature, while maintaining a consistent sintering duration. Among the various heat treatment conditions employed for sample fabrication, the '700_1100' condition, denoting a calcination temperature of 700℃ and a sintering temperature of 1100℃, resulted in the most exceptional ionic conductivity of 4.89 × 10^-4 S/cm and a relative density of 88.72% for the LLZTO material. This is attributed to the low calcination temperature of 700℃, leading to reduced grain size and enhanced cohesiveness, thus resulting in a higher sintered density. In addition, a microstructure similar to the typical sintering characteristics observed in Spark Plasma Sintering (SPS) methods was identified in the SEM analysis results under the '700_1100' condition. Consequently, the '700_1100' heat treatment condition was deemed to optimal choice for enhancing ionic conductivity.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.795-801
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• 2004

The injection molded Fe sintered bodies were fabricated using two kinds of Fe powders haying 50 nm and $3\sim5{\mu}m$ in diameter. In the using of Fe powder having 50 nm in diameter, the comparatively dense bodies ($94\sim97\%$) were obtained even at low sintering temperature ($600\sim700^{\circ}C$), while in the sintered bodies ($1000^{\circ}C$) using $3\sim5{\mu}m$ Fe powder, their relative densities showed low values about $93\%$, although they were strongly depend on the sintering temperature and volume ratio of Fe powder and binder. In the sintered bodies using of 50 nm Fe powders, the volume shrinkage and grain size increased as the sintering temperature increased, but the values of hardness decreased. In the sample sintered at $650^{\circ}C$, the values of relative density, volume shrinkage and grain size were $96\%,\;37\%\;and\;0.97{\mu}n$, respectively and the minimum value of wear depth was obtained due to combination of fine grain and comparatively high density.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.11
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• pp.1000-1004
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• 2008

In this paper, the influences of poling electric field on piezoelectric properties of $0.95(K_{0.5}Na_{0.5})NbO_3$-$0.05Li(Sb_{0.8}Nb_{0.2})O_3$ (abbreviated as KNN-LSN) ceramics were investigated. The specimens was sintered at sintering temperature of $1050^{\circ}C$. They showed orthorhombic phase structure without secondary phase. Electromechanical coupling factor (kp), dielectric and piezoelectric constant($d_{33}$) increased with poling electric field. However, mechanical quality factor (Qm) decreased. Take into account of poling conditions and piezoelectric properties of KNN-LSN ceramics, the optimum poling condition for KNN-LSN ceramics was poling electric field of 4.5 kV/mm. At the time, kp of 0.458, Qm of 43.97, $d_{33}$ of 278 pC/N, and dielectric constant of 1079 were shown, respectively.

• Journal of Biomedical Engineering Research
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• v.43 no.4
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• pp.219-229
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• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• Journal of the Korean Recycled Construction Resources Institute
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• v.12 no.2
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• pp.169-177
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• 2024

In this paper, the effect on cement clinker and cement quality was studied to prove the effect of reducing the sintering temperature of cement clinker as a mineralizer to recycle fluorine based semiconductor sludge, an industrial by-product. In addition, a verification study was conducted to compare the properties of clinker and cement at different temperatures when natural fluorite, previously used as a mineralizer, was used. As a result of the study, semiconductor sludge showed sufficient effectiveness as a mineralizer and could replace natural fluorite, an existing mineralizer.

• Journal of the Korean Ceramic Society
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• v.42 no.2 s.273
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• pp.140-144
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• 2005

The microstructures and mechanical properties of Tetragonal Zirconia Polycrystals (TZP) sintered bodies, which made by pressureless and spark plasma sintering techniques, were investigated using XRD, SEM, and TEM techniques. In the spark plasma sintered samples, the TZP grains were equiaxed type including many sub-grain boundaries regardless of sintering conditions. The biaxial strength of TZP having an average of 80 nm grains in diameter was high in value with 1025 MPa, but fracture toughness showed a low value due to the absence of a fracture toughening mechanism such as transformation toughening. In the Pressureless Sintered (PLSed) samples, the grain size of TZP was strongly dependent on the sintering temperature; i.e., it gradually increased as the sintering temperature increased. The value of fracture toughness increased as the grain size increased by the stress-induced phase transformation and Borne crack deflection.