• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Journal of Power System Engineering
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• v.5 no.1
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• pp.44-49
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• 2001

Low temperature vacuum drying technique shows very excellent energy efficiency and prominent drying performances compared with the conventional hot air drying technique. This study was focused on the thermal characteristics of the low temperature vacuum drying technique. From the results of this study, it was confirmed that the time consumption for drying with the new drying technique could be shortened to about 1/3 of the time consumption with the conventional hot air drying technique under the same drying conditions for wet products. Also, the maximum drying rate with the new drying technique reached to about $0.35kg/m^2h$ at about 400% of moisture content.

• Journal of Biosystems Engineering
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• v.42 no.3
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• pp.163-169
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• 2017

Purpose: This study was performed to evaluate the feasibility of using an infrared thermography technique for phenotype analysis of pepper seedlings exposed to a low-temperature environment. Methods: We employed an active thermography technique to evaluate the thermal response of pepper seedlings exposed to low-temperature stress. The temperatures of pepper leaves grown in low-temperature conditions ($5^{\circ}C$, relative humidity [RH] 50%) for four periods (6, 12, 24, and 48 h) were measured in the experimental setting ($23^{\circ}C$, RH 70%) as soon as pepper seedling samples were taken out from the low-temperature environment. We also assessed the visible images of pepper seedling samples that were exposed to low-temperature stress to estimate appearance changes. Results: The greatest appearance change was observed for the low-temperature stressed pepper seedlings that were exposed for 12 h, and the temperature from these pepper seedling leaves was the highest among all samples. In addition, the thermal image of low-temperature stressed pepper seedlings for 6 h exhibited the lowest temperature. Conclusions: We demonstrated that the leaf withering owing to the water deficiency that occurred under low-temperature conditions could induce an increase in temperature in plant leaves using the infrared thermography technique. These results suggested that the time-resolved and averaged thermal signals or temperatures of plants could be significantly associated with the physiological or biochemical characteristics of plants exposed to low-temperature stress.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.17 no.1
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• pp.18-22
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• 2007

Carbon nanofilaments were deposited on silicon oxide substrate by thermal chemical vapor deposition method. We used $Fe(CO)_5$ as the catalyst for the carbon nanofilaments formation. Around $800^{\circ}C$ substrate temperature, the formation density of carbon nanofilaments could be enhanced by the vacuum sublimation technique of $Fe(CO)_5$, compared with the conventional spin coating technique. Finally, we could achieve the low temperature, as low as $350^{\circ}C$, formation of carbon nanofilaments using the sublimated Fe-complex nanograins with thermal chemical vapor deposition. Detailed morphologies and characteristics of the carbon nanofilaments were investigated. Based on these results, the role of the vacuum sublimation technique for the low temperature deposition of carbon nanofilaments was discussed.

• Journal of Information Display
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• v.4 no.3
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• pp.17-21
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• 2003

A low temperature doping technique to be applied in poly-Si TFTs on plastic substrates was investigated. Heavily-doped amorphous silicon layers were deposited on poly-Si and the dopant atoms were driven in by subsequent excimer laser annealing. The entire process was carried out under a substrate temperature of 120 $^{\circ}C$, and a sheet resistance of as low as 300 ${\Omega}$/sq. was obtained.

• Nuclear Engineering and Technology
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• v.53 no.8
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• pp.2600-2609
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• 2021

Low cycle fatigue behaviors of SA508-3 low-alloy steel were investigated in room-temperature air, high-temperature air and in light water reactor (LWR) water environments. The fatigue mean curve and design curve for the low-alloy steel are developed based on the fatigue data in room-temperature and high-temperature air. The environmental fatigue model for low-alloy steel is developed by the environmental fatigue correction factor (F_en) methodology based on the fatigue data in LWR water environments with the consideration of effects of strain rate, temperature, and dissolved oxygen concentration on the fatigue life.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1131-1134
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• 2003

A low temperature doping technique has been studied for application in poly-Si TFT's on plastic substrates. Heavily-doped amorphous silicon layers were deposited on poly-Si and the dopant atoms were driven in by subsequent excimer laser annealing. The entire process was carried out under a substrate temperature of $120^{\circ}C$, and a sheet resistance as low as $300 {\Omega}/sq$. was obtained.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1463-1465
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• 1994

The electrical characteristics of $Al/Ta_2O_5/Si$ metal-oxide-semiconductor (MOS) capacitors were studied. $Ta_2O_5$ films on p-type silicon had been prepared by ionized cluster beam epitaxy technique (ICBE). This $Ta_2O_5$ films have low leakage current, high breakdown strength and low flat band shift. In this research, a single crystalline cpitaxial film of $Ta_2O_5$ has been grown on p-Si wafer using an ICBE technique. The native oxide layer ($SiO_2$) on the silicon substrate was removed below $500^{\circ}C$ by use of an accelerated arsenic ion beam, instead of a high temperature deposition. $Ta_2O_5$ films formed by ICBE technique can be received considerable attention for applications to coupling capacitors, gate dielectrics in MOS devices, and memory storage capacitor insulator because of their high dielectric constants above 20 and low temperature process.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.3
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• pp.87-99
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• 1991

The effect of oven firing on the color stability and surface texture of extrinsic stains used characterization and color modification of metal cermic restoration were studied by comparing different temperatures and techniques. They were autoglaze technique, applied glaze technique, two step low-fusing glaze technique and one step low-fusing glaze technique. Autoglaze technique and applied glaze technique were air-fired to manufacturer's recommended temperature. Two step low-fusing glaze technique is separated staining and overglazing. Thin slurry of stain powder were air-fired to $1500^{\circ}F$, Overglaze powder powder was then mixed with seam medium and air-fired to $170^{\circ}F$. One step low-fusing glaze technique is combined staining and overglazing. Thin slurry of stain and glaze powder were air-fired to $170^{\circ}F$. The obtained results were as fellows. 1. Slightly significant color differences by colorimeter were found between different stain application and fusion techniques(P<0.05). 2. Two step low-fusing glaze method showed the most rough surface, especially ceramco orage stain(P<0.05). 3. Surface roughness increased gradually in order of autoglaze, applied glaze, one step low-fusing glaze but they were not significantly different(P<0.05). 4. When two step low-fusing glaze was applied, both color measurement and surface texture were sinificantly different from other groups(P<0.05).

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.372-376
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• 2004

In this paper, the standard test methods at low temperature of rubber suspension components of railway vehicle are investigated and reviewed. In order to connect the TKR(Trans-Korean Railway)-TSR(Trans-Siberian Railway), it is necessary to evaluate the performance of rubber suspenion components of railway vehicle. In the current Korean Standard, the test method at low temperature of railway vehilce components and the test method of rubber bellows of air spring are specified. But, the specified test temperature is higher than the the operating temperature of TSR railway. So, the in-depth research for the test method and performance evaluation technique of rubber suspension component at low temperature is necessary and current KS code should be adjusted.