• Current Photovoltaic Research
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• 제2권3호
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• pp.110-114
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• 2014

We propose a low temperature sol-gel ZnO/Ag nanowire composite thin film to fulfill low temperature and low cost requirements, which are essential criteria in future flexible electronic devices. In this proposed thin film, Ag nanowire plays the role of electrical conduction, and sol-gel ZnO provides a structural medium with a high visible transmittance. Low temperature restriction in the sol-gel fabrication process prevents sufficient oxidation of Zn acetate precursors, which were solved by a post-coating treatment with ultraviolet light irradiation. Composite thin film formation was performed by spin coating methods with a mixed precursor solution or in a sequential manner. We obtained an average visible transmittance larger than 85% and a sheet resistance smaller than $50{\Omega}/sq$. After optimization in a fabricated composite transparent conductive thin film with the thickness around 100 nm. Similar experimental demonstration in a flexible substrate (polyethyleneterephthalate) was successful, which implies a promising application opportunity of this technology.

• 원예과학기술지
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• 제30권5호
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• pp.603-612
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• 2012

본 연구는 콜드칩 가공용 감자 계통을 선발하고자, 47계통과 대조구 품종인 '대서', '수미', '구이벨리'의 수확 후, $4^{\circ}C$, $8^{\circ}C$ 저온저장 및 $20^{\circ}C$ 가온 조정처리에 따른 glucose 함량, 아크릴아마이드 함량 및 두 형질 간의 상관성을 비교 분석하였다. 대조구 품종 및 47계통 모두에서 수확 후, glucose 함량이 0.25% 이하, 아크릴아마이드 함량 1000ppb 이하로 나타났고, $4^{\circ}C$ 저온저장에 의해 glucose와 아크릴아마이드 함량 모두 급격히 증가하였으며, H7, H13, H16, H40 등 4계통에서만 500ppb 이하로 검출되었다. $8^{\circ}C$ 저온저장 역시 두 함량 모두 증가하였으나, $4^{\circ}C$ 저온저장에 비해 비교적 낮게 나타났으며, $20^{\circ}C$ 가온 조정에 의해서도 두 함량 모두 감소한 것으로 나타났다. 저온저장에 따른 glucose 함량과 아크릴아마이드 함량 간의 상호관계를 분석한 결과 정의 상관성을 확인할 수 있었다. 결론적으로 저온처리에도 낮은 glucose 함량을 나타낸 H7, H13, H16, H40계통들이 낮은 함량의 아트릴아마이드 함유한 것으로 나타나 콜드 칩 가공용 우수 감자 계통으로 선발할 수 있었다.

• 한국환경과학회:학술대회논문집
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• 한국환경과학회 2002년도 봄 학술발표대회 발표논문집
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• pp.468-471
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• 2002

The present study was undertaken to Investigate the effects of low temperature and salicylic acid (SA) on chilling tolerance In acclimated and nonacclimated cucumber seedlings. Acclimation significantly affected survival and shoot dry weights. Injuries of acclimated seedlings at the third leaf stage were on the average smaller by half than those of the nonacclimated ones. Chilling caused a large increase in free proline levels, regardless of acclimation status. Exogenous treatment with SA resulted in improvement in growth and survival of acclimated, chilled seedlings, indicating SA and acclimation have common effects. Cycloheximide treatment In the presence of SA restored acclimation-induced chilling tolerance. An elevated proline level was observed in cold-treated and SA- treated plants and the level was more pronounced in the light than in the dark at chilled temperature, indicating that endogenous proline may play a role in chilling tolerance.

• 한국포장학회지
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• 제11권2호
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• pp.87-90
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• 2005

The dried persimmons is produced fungi and develop browning, hardening in circulation at normal temperature. To resolve such problem in commercial value preservation, the research was conducted to measure the quality changes of dreid persimmons depending on pre-treatments and packagings at low temperature ($0^{\circ}C$) during 6 month storage. The rate of weigh loss, fungi, browning, hardening, surface chromaticity were changed a little in the "Cinnamon" pre-treatment and N/LDPE.

• 한국표면공학회지
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• 제50권4호
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• pp.272-276
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• 2017

The response of AISI 310 type austenitic stainless steel to the novel low temperature plasma carburizing process has been investigated in this work. This grade of stainless steel shows better corrosion resistance and high temperature oxidation resistance due to its high chromium and nickel content. In this experiment, plasma carburizing was performed on AISI 310 stainless steel in a D.C. pulsed plasma ion nitriding system at different temperatures in $H_2-Ar-CH_4$ gas mixtures. The working pressure was 4 Torr (533Pa approx.) and the applied voltage was 600 V during the plasma carburizing treatment. The hardness of the samples was measured by using a Vickers micro hardness tester with the load of 100 g. The phase of carburized layer formed on the surface was confirmed by X-ray diffraction. The resultant carburized layer was found to be precipitation free and resulted in significantly improved hardness and corrosion resistance.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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• pp.85-88
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• 2000

Cu-free Bi-Sr-Ca-O powder mixtures were screen-printed on Cu tapes and heat-treated at 850-$870^{\circ}C$ for several minutes in air, oxygen, nitrogen and low oxygen pressure. Cu-free precursors were composed of Bi_{x}$SrCaO_{y}$ (x=1.2-2). In order to obtain the optimum heat-treatment condition, we studied on an effect of the precursor composition, the printing thickness and the heat-treatment atmosphere on the superconducting properties of Bi2212 films and the reaction mechanism of their rapid formation. Microstructures and phases of thick films were analyzed by optical microscope and XRD. The electric properties of superconducting films were examined by the four probe method. At heat-treatment temperature, the thick films were in a partially molten state by liquid reaction between CuO in the oxidized copper tape and the precursors which were printed on Cu tapes.

• 한국염색가공학회지
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• 제17권6호
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• pp.36-41
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• 2005

The effects of low temperature plasma treatment on the properties of three types of foams, polyurethane(PU), injection phylon(IP), and phylon(PH) that used for footwear mid-sole were examined. The change of surface properties of foams were characterized by electron scanning microscope, contact angle measurement, and universal testing machine. Adhesion was tested by T-peel tests of plasma treated foams/polyurethane adhesive joints. The contact angle of three types of foams were decreased dramatically with the plasma treatment time, specifically noticeable in the case of phylon(Ph). It has shown the relationship with the contact angle of phylon(PH) and the distance between electrode and samples. The peel strength of foams were increased with the increase of plasma treatment time.

• 한국염색가공학회지
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• 제16권5호
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• pp.35-41
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• 2004

Poly(ethylene terephthalate), polyimide(Kapton), and polypropylene surfaces were modified with argon low temperature plasma by RF glow discharge at 240m Torr, 40W to investigate the surface morphological changes due to the plasma treatment using atomic force microscopy(AFM). Analysis of the AFM images and Ra(average roughness) revealed that the plasma treatment resulted in significant ablation on the surfaces. The morphological changes and surface roughness, however, were different depending on material characteristics such as heat stability, presence of amorphous region, swelling phenomenon, and molecular structure of repeating unit. It was assumed that polypropylene due to its tertiary hydrogen was ablated easily compared to poly(ethylene terephthalate), and that polyimide was more resistant to the ablation than PET due to rigid skeleton of imide and stable phenyl ring structure.

• 한국환경과학회지
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• 제4권2호
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• pp.181-194
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• 1995

여러가지 다양한 상수처리 실험조건에서 응집제로 Ferric Nitrate를 사용하여 수증의 카오린 점토입자를 응결하는 과정중의 응집동력학을 조사하기 위하여 본 영구는 수행되었다. 응집동력학을 측정하기 위한 방법으로서 AIA 시스템으로 부터 없어진 입자크기분포와 Rlowing suspension에서의 PDA에 의한 탁도증가 정도의 측정이 사용되었다. 결론으로서, 저온에서의 응집은 그 효율이 상당히 저하 되는것으로 발견 되었으며 저온에서의 응집을 향상시키기 위아여 수중의 pH보다는 pOH를 일정하게 유지하는 것이 부분적으로 응집효율향상에 도움이 되는 것으로 나타났다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.121-121
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• 2018

Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.