• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.28-32
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• 2004

In this paper, degradation in field-aged PV modules including degradation of interconnect, discoloration of encapsulant and hot spot have been observed and analyzed. From the results, photovoltaic module installed for 6 years shows around 16% drop of electrical properties due to the interconnect degradation and PV module passed 18 years has been found to drop of around 20% mainly by the encapsulant discoloration. Furthermore the difference between low and high temperature of PV array at hot spot goes up to $30^{\circ}C$ and it leads to interconnect degradation. On the other hands, the temperature difference was observed to be around $15^{\circ}C$ at the encapsulant discoloration spot of PV array.

• 대한금속재료학회지
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• 제46권3호
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• pp.125-130
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• 2008

Conventional plasma carburizing or nitriding for austenitic stainless steels results in a degradation of corrosion resistance. However, a low temperature plasma surface treatment can improve surface hardness without deteriorating the corrosion resistance. The 2-step low temperature plasma processes (the combined carburizing and post nitriding) offers the increase of both surface hardness and thickness of hardened layer and corrosion resistance than the individually processed low temperature nitriding and low temperature carburizing techniques. In the present paper, attempts have been made to investigate the influence of the introduction of Ar gas (0~20%) in nitriding atmosphere during low temperature plasma nitriding at $370^{\circ}C$ after low temperature plasma carburizing at $470^{\circ}C$. All treated specimens exhibited the increase of the surface hardness with increasing Ar level in the atmosphere and the surface hardness value reached up to 1050 HV0.1, greater than 750 $HV_{0.1}$ in the carburized state. The expanded austenite phase (${\gamma}_N$) was observed on the most of the treated surfaces. The thickness of the ${\gamma}_N$ layer reached about $7{\mu}m$ for the specimen treated in the nitriding atmosphere containing 20% Ar. In case of 10% Ar containing atmosphere, the corrosion resistance was significantly enhanced than untreated austenitic stainless steels, whilst 20% Ar level in the atmosphere caused to form CrN in the N-enriched layer (${\gamma}_N$), which led to the degradation of corrosion resistance compared with untreated austenitic stainless steels.

• 한국식품과학회지
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• 제23권3호
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• pp.355-359
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• 1991

글루타민산 나트륨(MSG)의 열안정성을 조사하기 위하여 가열온도 및 pH를 변화시키면서 가열 중 MSG의 분해정도를 비교하였다. 가열온도와 pH의 범위는 각각 $100{\sim}120^{\circ},\;4{\sim}9C$로 하였고, MSG는 2% 용액으로 만들었으며 가열 중 잔류 MSG 농도를 HPLC로 측정하였다. 그 결과 pH 4와 $120^{\circ}C$의 3시간 가열로 약 73% MSG가 감소한 반면, $100^{\circ}C$에서의 3시간 가열은 12% 정도만이 감소함을 보였다. 가열온도와 pH에 따른 초기 MSG의 분해속도와 분해 속도상수{(%MSG/log(hrs)}를 비교한 결과 $110^{\circ}C$와 $120^{\circ}C$에서의 초기 분해속도는 pH 4가 가장 빨랐으며 분해 속도상수도 상당히 높은 값을 보였다. 분해가 가장 적었던 pH 범위는 $pH6{\sim}8$ 범위였다. 또한 가열온도에 영향을 가장 많이 받았던 pH 4와 pH 5의 MSG 열분해 속도상수와 1/T의 관계에서 계산된 활성화에너지는 각각 18.3 kcal/mole과 9.2 kcal/mole이었다.

• 한국안전학회지
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• 제37권6호
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• pp.1-8
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• 2022

This study analyzed the characteristics of insulation resistance and operating time based on an accelerated degradation test of a low-voltage circuit breaker. The experimental sample used a molded case circuit breaker (MCCB) and an earth leakage circuit breaker (ELCB). After measuring the insulation resistance of the circuit breakers, the leakage current was affected by an external rather than an internal structure. Furthermore, the insulation resistance of the circuit breakers with accelerated degradation was measured using a Megger insulation tester. In the accelerated degradation test, aging times of five, ten, 15, and 20 years were applied according to a temperature derived using the Arrhenius equation. Circuit breakers with an equivalent life of ten, 15, and 20 years had increased insulation resistance compared to those with less degradation time. In particular, the circuit breaker with an equivalent life of ten years had the highest insulation resistance. Component analysis of the circuit breaker manufactured through an accelerated degradation test confirmed that the timing of the increase in insulation resistance and the time of additive loss were the same. Finally, after analyzing the operating time of the circuit breakers with degradation, it was confirmed that the MCCB did not change, but the ELCB breaker failed.

• Current Applied Physics
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• 제18권12호
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• pp.1600-1604
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• 2018

This paper reports on a systematic and quantitative assessment of light induced degradation (LID) and regeneration in full Al-BSF and passivated emitter rear contact cells (PERC) along with the fundamental understanding of the difference between the two. After LID, PERC cells showed a much greater loss in cell efficiency than full Al-BSF cells (~0.9% vs ~0.6%) because the degradation in bulk lifetime also erodes the benefit of superior BSRV in PERC cells. Three main regeneration conditions involving the combination of heat and light ($75^{\circ}C/1\;Sun/48h$, $130^{\circ}C/2\;Suns/1.5h$ and $200^{\circ}C/3\;Suns/30s$) were implemented to eliminate LID loss due to BO defects. Low temperature/long time ($75^{\circ}C/48h$) and high temperature/short time ($200^{\circ}C/30s$) regeneration process was unable to reach 100% stabilization. The intermediate temperature/time ($130^{\circ}C/1.5h$) generation achieved nearly full recovery and stabilization (over 99%) for both full Al-BSF and PERC cells. We discussed the effect of temperature, time and suns in regeneration mechanism for two cells.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권2호
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.473-476
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• 2008

A simple voltage compensation pixel circuit for AMOLED is produced using low temperature polycrystalline silicon (LTPS) technology. Its operation is verified by AIM-SPICE. Simulation results show that the pixel circuit has high immunity to variation of LTPS-TFT and reduces the drop in luminance due to the degradation of the OLED.

• 한국안전학회지
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• 제18권2호
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• pp.50-55
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• 2003

Radiation degradation of crosslinked polyethylene(XLPE) was investigated using thermogravimetric analysis(TGA), The results of TGA were compared with FT-IR, melting temperature, oxidation induction time, and elongation at break on the XLPE exposed by $\gamma$-ray. 5% decomposition temperature of $\gamma$-ray irradiated XLPE showed similar tendencies with the case of elongation at break. Both properties agreed below 1000 KGy, however, did not show any remarkable characteristics above 1000 kGy, these properties can be useful to evaluate the radiation degradation of XLPE for only low irradiated region. Above 1000 kGy, the thermal decomposition activation energy showed decreased, on the contrary, increasing below 1000 kGy. Compared with FT-IR spectrum of irradiated XLPE, it was confirmed that the oxidation reaction was still occurring below 1000 kGy. Radiation degradation of XLPE was dependent upon the irradiation doses, TGA can be a useful tool to evaluate the degradation.

• 한국재료학회지
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• 제27권11호
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• pp.577-582
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• 2017

Self-cleaning and photocatalytic $TiO_2$ thin films were prepared by a facile sol-gel method followed by spin coating using peroxo titanic acid as a precursor. The as-prepared thin films were heated at low temperature($110^{\circ}C$) and high temperature ($400^{\circ}C$). Thin films were characterized by X-ray diffraction(XRD), Field-emission scanning electron microscopy(FESEM), UV-Visible spectroscopy and water contact angle measurement. XRD analysis confirms the low crystallinity of thin films prepared at low temperature, while crystalline anatase phase was found the for high temperature thin film. The photocatalytic activity of thin films was studied by the photocatalytic degradation of methylene blue dye solution. Self-cleaning and photocatalytic performance of both low and high temperature thin films were compared.

• 대한기계학회논문집A
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• 제22권1호
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• pp.177-189
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• 1998

The contents of this paper include a non-destructive technique for evaluating the degradation of the boiler superheater tube in a fossil power plant through an electrochemical polarization test. Correlation between Ip of polarization parameter and SP-DBTT for the superheater tubes in long-term use was obtained. 1.0Cr-0.5Mo steel was degraded by softening, and the degree of degradation was dependent upon carbides with Cr and Mo elements. Since brittle fracture at low temperature and ductile fracture mode at high temperature were shown, similarity between standard Charpy and small punch tests could be found. In addition, SP-DBTT showing the degree of degradation was higher, as the time-in use of the materials got longer. Electrolyte including picric acid of 1.3 g in distilled water of 100ml at 25.deg. C temperature and sodium tridecylbenzene sulfonate with 1g could be applied to evaluate the degradation of 1.0Cr-0.5Mo steel by means of the electrochemical polarization test. Ip and Ipa values measured through the electrochemical test are the appropriate parameters for representing the degradation of the superheater tube(1.0Cr-0.5Mo steel) for the fossil power plant. It is poassible to evaluate the degradation of materials with different time histories electrochemically, by Ip value only, at field test.