• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• Journal of Welding and Joining
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• v.16 no.2
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• pp.73-83
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• 1998

This study investigated the relationships between the microstructure and the wear resistance of hardfaced iron/chromium alloys to examine the low stress abrasive wear mechanism. The effects of volume fraction of reinforcing phases(chromium carbide and eutectic phase) were studied. The alloys were deposited once or twice on a mild steel plate using a self-shielding flux cored arc welding process. The low stress abrasion resistance of he alloys against dry sands was measured by the Dry Sand/Ruber Wheel Abrasion Tester (RWAT). The wear resistance of hypoeutectic alloys, below 0.36 volume fraction of chromium-carbide phase (VFC), behaved as Equal Pressure Mode (EPM) for the inverse rule of mixture whereas the wear resistance of hypereutectic alloys, above 0.36 VFC, represented Equal Wear Mode (EWM) for the linear rule of mixture.

• Journal of Ocean Engineering and Technology
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• v.9 no.1
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• pp.151-160
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• 1995

The characteristics of low temperature impact toughness and stress corrosion resistance at boiling MgCl$_2$ solution of GTA and SMA weld of duplex stainless steels have been investigated. The impact toughness was highest at the GTAW weld metal and lowest at the SMAW weld, which was almost the same as that of the SMAW heat-affected zone. This was attributable to influence of austenite-ferrite phase balance, and the degree and nature of precipitation that occurred during welding. The SCC resistance of the weldments was slightly higher than that of the base metal, whereas no difference in the SCC resistance was found between two different weldments.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.5.1-5.1
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• 2009

Organic photovoltaic (OPV)cells have attracted considerable attention due to their potential for flexible, lightweight, and low-cost application of solar energy conversion. Since a 1% power conversion efficiency (PCE) OPV based on a single donor-acceptor heterojunction was reported by Tang, the PCE has steadily improved around 5%. It is well known that a high parallel (shunt)resistance and a low series resistance are required simultaneously to achieve ideal photovoltaic devices. The device should be free of leakage current through the device to maximize the parallel resistance. The series resistance is attributed to the ohmic loss in the whole device, which includes the bulk resistance and the contact resistance. The bulk resistance originated from the bulk resistance of the organic layer and the electrodes; the contact resistance comes from the interface between the electrodes and the active layer. Furthermore, it has been reported that the bulk resistance of the indium tin oxide (ITO) of the devices dominates the series resistance of OPVs for a large area more than $0.01\;cm^2$. Therefore, in practical application, the large area of ITO may significantly reduce the device performance. In this work, we investigated the effect of sheet resistance ($R_{sh}$) of deposited ITO on the performance of OPVs. It was found that the device performance of polythiophene-fullerene (P3HT:PCBM) bulk heterojunction OPVs was critically dependent on Rsh of the ITO electrode. With decreasing $R_{sh}$ of the ITO from 39 to $8.5\;{\Omega}/{\square}$, the fill factor (FF) of OPVs was dramatically improved from 0.407 to 0.580, resulting in improvement of PCE from $1.63{\pm}0.2$ to $2.5{\pm}0.1%$ underan AM1.5 simulated solar intensity of $100\;mW/cm^2$.

• Journal of Korean Society for Quality Management
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• v.46 no.3
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• pp.425-440
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• 2018

Purpose: This study is aimed at developing of the flex resistance testing process at low temperature with the waterproof fabric to suit the military environment, and is designed to fit for the purpose of the waterproof materials in order to optimize the test method by finding out matters to improve from existing the test method and through previous studies. Methods: The test method, which has been applied to flex resistance of existing water-repellent materials, was improved and consequently, differentiated test results could be obtained according to the test temperature, sample size, and flexing method. Results: The testing of the total of 8 samples revealed that performance of the military requirement could hardly be met just by presenting the materials or 2~3 layers when the quality criteria for high functional water repellent fabrics were applied. PTFE(Polytetrafluoroethylene) is preferred to PU(Polyurethane) to be used in the extremely low-temperature environment, but durability under the low-temperature environment may be varied depending on film thickness or laminating technique even if the materials of waterproof films are identical. Therefore, in addition to the material or texture, the test method capable of reflecting durability under the low-temperature environment shall be suggested, and the newly designed test method proposed in this study was shown to suggest differentiated quality criteria by the material. Conclusion: The water resistance measurement and the test method following flex resistance with expanded range of flex will enable the differentiable test of the samples according to the number of repetition. This study is meaningful in that it suggests a differentiable test method capable of establishing a basis of deciding suitable material when selecting military goods made of water repellent material by properly improving the test method.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.2
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• pp.155-161
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• 2008

The grounding systems provide a low resistance path for fault or normal currents into the earth. The material for reducing ground resistance is buried around the grounding electrode to increase its effective size of the electrode and thus to obtain low ground resistance. Increasing the contacting area with the grounding electrode is effective for lowering the ground resistance in soils. Using this idea the conductive expansion ground resistance reducing material was developed. In this paper experimental data has shown that the ground resistance reduction method using proposed material is superior to using a typically available commercial ground resistance reducing material.

• International Journal of Naval Architecture and Ocean Engineering
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• v.7 no.3
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• pp.626-639
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• 2015

Ice resistance is defined as the time average of all longitudinal forces due to ice acting on the ship. Estimation of ship's resistance in ice-covered waters is very important to both designers and shipbuilders since it is closely related to propulsion of a ship and it determines the engine power of the ship. Good ice performance requires ice resistance should be as low as possible to allow different manoeuvres. In this paper, different numerical methods are presented to calculate ice resistance, including semi-analytical method and empirical methods. A model test of an icebreaking vessel that was done in an ice basin has been introduced for going straight ahead in level ice at low speed. Then the comparison between model test results and numerical results are made. Some discussions and suggestions are presented as well to provide an insight into icebreaking vessel design at early stage.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.235-240
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• 2009

Crystlline silicon solar cells markets are increasing at rapid pace. now, crystlline silicon solar cells markets screen-printing solar cell is occupying. screen-printing solar cells manufacturing process are very quick, there is a strong point which is a low cost. but silicon and metal contact, uses Ag & Al pates. because of, high contact resistance, high series resistance and sintering inside process the electric conductivity decreases with 1/3. and In pastes ingredients uses Ag where $80{\sim}90%$ is metal of high cost. because of low cost solar cells descriptions is difficult. therefore BCSC(Buried Contact Solar Cell) is developed. and uses light-induced plating, ln-line galvanization developed equipments. Ni/Cu matel contact solar cells researches. in Germany Fraunhofer ISE. In order to manufacture high-efficiency solar cells, metal selections are important. metal materials get in metal resistance does small, to be electric conductivity does highly. efficiency must raise an increase with rise of the curve factor where the contact resistance of the silicon substrate and is caused by few with decrement of series resistance. Ni metal materials the price is cheap, Ti comes similar resistance. Cu and Ag has the electric conductivity which is similar. and Cu price is cheap. In this paper, Ni/Cu/Ag metal contact cell with screen printing manufactured, silicon metal contact comparison and analysis.

• Korean Journal of Materials Research
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• v.25 no.9
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• pp.429-434
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• 2015

Resistance switching memory cells were fabricated using atomically dispersed Pt-$SiO_2$ thin film prepared via RF co-sputtering. The memory cell can switch between a low-resistance-state and a high-resistance-state reversibly and reproducibly through applying alternate voltage polarities. Percolated conducting paths are the origin of the low-resistance-state, while trapping electrons in the negative U-center in the Pt-$SiO_2$ interface cause the high-resistance-state. Intermediate resistance-states are obtained through controlling the compliance current, which can be applied to multi-level operation for high memory density. It is found that the resistance value is related to the capacitance of the memory cell: a 265-fold increase in resistance induces a 2.68-fold increase in capacitance. The exponential growth model of the conducting paths can explain the quantitative relationship of resistance-capacitance. The model states that the conducting path generated in the early stage requires a larger area than that generated in the last stage, which results in a larger decrease in the capacitance.

• International Journal of Highway Engineering
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• v.16 no.2
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• pp.35-41
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• 2014

PURPOSES : Surface treatment is a favorable method in the pavement preventive maintenance. This study (Part I) aimed to develop the low viscosity filling material for waterproof characteristics and high penetrable and weather resistance, and a series of companion study (Part II) presents the coating characteristics and performance analysis using field and lab tests. METHODS : Hydrophobic characteristics of the advanced surface treatment material are observed and measured the filling depth and the permeability for sand and asphalt pavement specimen using the water absorption test and permeability test, X-RAY CT test. Color difference for the weather resistance using ultraviolet ray accelerated weathering test is compared with asphalt pavement specimens. RESULTS : The developed material shows the decreased water absorption and increased impermeable effect because of the hydrophobic characteristics. It is found that the filling depth is about 6mm and weather resistance is better than asphalt pavement specimen. CONCLUSIONS : The advanced hydrophobic - low viscosity filling treatment material is developed in this study (Part I) to improve the waterproof characteristics and high filling capacity and weather resistance for the pavement preventive maintenance.