• Title/Summary/Keyword: Low residue flux

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A Study on Low Residue Flux for Improving Flip Chip Non-wet and Reliability (Flip Chip Non-wet 개선 및 신뢰성 향상을 위한 Low Residue Flux 구현 방안 연구)

  • Lee, Hyunsuk;Kim, Minseok;Kim, Taehoon;Moon, Kiill
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.45-50
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    • 2021
  • As the difficulty of flip chip products increases, there is a growing interest in the material of flux, which is safe from the solder wetting and reliability. In the case of no clean flux, there is merit in terms of process efficiency because there is no cleaning process. But Cu migration and delamination can be occurred if the residue remains after the reflow process. In this study, major element materials, solvent and activator, are changed and confirmed effect of non-wet and reliability in the package environment. Stability of materials were secured through storage stability evaluation, and we found out non-wet zero materials through the application of two types of solvent and activator with different boiling point and the increase of activator content. After reliability test, no delamination was found in the plane analysis, which secured the final composition of low residue flux.

A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux (저잔사 플럭스를 사용한 플로우 솔더링부의 젖음성 및 결함거동에 관한 연구)

  • 최명기;이창열;정재필;서창제;신영의
    • Journal of Welding and Joining
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    • v.16 no.6
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    • pp.77-85
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    • 1998
  • Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

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A study on the tensile strength of flow-soldered joint using low residue flux (저잔사 플럭스를 사용한 플로 솔더링부의 인장특성 연구)

  • 장인철;최명기;신영의;정재필;서창제
    • Journal of Welding and Joining
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    • v.17 no.1
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    • pp.77-81
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    • 1999
  • Through-hole PCB(Printed Circuit Board) was soldered by flow soldering process using cleaning or noncleaning fluxes. Preheating temperature and conveyor speed were changed in the range of 323∼413K and 0.3∼2m/min respectively. The soldered joints were tensile tested in order to evaluated bonding strength. As experimental results, relatively high tensile fracture load, 120∼140N, were obtained in case of preheating temperature of 383K, and conveyor speed was 0.6∼1.0 m/min. Fractured surfaces of higher tensile strength show some dimple area, while those of lower tensile fracture load show brittle fracture.

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A study on the Combustion Characteristics of Wall Paper (내장벽지의 연소특성에 관한 연구)

  • Oh, Kyu-Hyung;Choi, Yeon-Yi;Lee, Sung-Eun
    • Fire Science and Engineering
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    • v.21 no.1 s.65
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    • pp.90-97
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    • 2007
  • Combustion characteristics and toxicity of combustion gas of wallpaper samples were analyzed to evaluate the fire risk of wallpaper furnished in living space. In this study ash residue ratio was measured with high temperature electric furnace, and thermal analysis was carried out with TGA. Combustion time and smoke concentration were measured with cone heater and combustion gas analyzer. Smoke density of samples was measured using smoke chamber of ASTM E 662. The experimental results were showed as followings. Pyrolysis of silk wallpaper started at lower temperature compared to the other samples. It means that the silk wallpaper can be ignited at low heat flux and will have more fire risk than the others. Ignition time by radiation heat flux of silk wallpaper is shorter compared to the other samples, so evacuation time must be reduced. In the case of vinyl coated silk wall paper, carbon mono oxide concentration is the highest and the toxicity and damage effect to consciousness was stronger compared to the other samples. Smoke density of silk wall paper and fire retardant mixed coated silk wall paper were very high due to vinyl coating.

Introduction of KIER Pyrolysis Process and 3,000 ton/yr Demonstration Plant (KIER의 열분해유화 공정 기술과 실증플랜트 소개)

  • Shin, Dae-Hyun;Jeon, Sang-Gu;Kim, Kwang-Ho;Lee, Kyong-Hwan;Roh, Nam-Sun;Lee, Ki-Bong
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.05a
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    • pp.479-482
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    • 2008
  • Since late of 2000, KIER has developed a novel pyrolysis process for production of fuel oils from polymer wastes. It could have been possible due to large-scale funding of the Resource Recycling R&D Center. The target was to develop an uncatalyzed, continuous and automatic process producing oils that can be used as a fuel for small-scale industrial boilers. The process development has proceeded in three stages bench-scale unit, pilot plant and demonstration plant. As a result, the demonstration plant having capacity of 3,000 tons/year has been constructed and is currently under test operation for optimization of operation conditions. The process consisted of four parts ; feeding system, cracking reactor, refining system and others. Raw materials were pretreated via shredding and classifying to remove minerals, water, etc. There were 3 kind of products, oils(80%), gas(15%), carbonic residue(5%). The main products i.e. oils were gasoline and diesel. The calorific value of gas has been found to be about 18,000kcal/$m^3$ which is similar to petroleum gas and shows that it could be used as a process fuel. Key technologies adopted in the process are 1) Recirculation of feed for rapid melting and enhancement of fluidity for automatic control of system, 2) Tubular reactor specially-designed for heavy heat flux and prevention of coking, 3)Recirculation of heavy fraction for prevention of wax formation, and 4) continuous removal & re-reaction of sludge for high yield of main product (oil) and minimization of residue. The advantages of the process are full automation, continuous operation, no requirement of catalyst, minimization of coking and sludge problems, maximizing the product(fuel oil) yield and purity, low initial investment and operation costs and environment- friendly process. In this presentation, background of pyrolysis technology development, the details of KIER pyrolysis process flow, key technologies and the performances of the process will be discussed in detail.

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Occurrence of Pesticide Residues in Han River Basin in 2012 and 2014 (2012, 2014년 한강수계 하천수 중 잔류농약 검출 양상)

  • Kim, Chan-Sub;Lee, Hee-Dong;Son, Kyeong-Ae;Lee, Eun-Young;Oh, Jin-A
    • Korean Journal of Environmental Agriculture
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    • v.38 no.4
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    • pp.338-351
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    • 2019
  • BACKGROUND: To investigate distribution and seasonal variation of concentration and flux of pesticides in Han river basin, water samples were examined at 24 sites in 2012 and 2014. METHODS AND RESULTS: Water samples were collected four times per year and subjected to liquid-liquid partition extraction followed by GC-ECD/NPD analysis. Of fifteen pesticides detected, iprobenfos, diazinon, isoprothiolane, endosulfan sulfate and oxadiazon were detected in a higher frequency, while fenoxanil, carbofuran, fenitrothion, butachlor and metolachlor were only detected in a sample. Pesticides with high occurrences, iprobenfos, diazinon, isoprothiolane, endosulfan sulfate and oxadiazon were detected in residue level of 0.01-0.46, 0.01-0.24, 0.03-0.85, 0.02-0.06 and 0.05-0.24 ㎍/L, respectively. Carbofuran and acetanilide herbicides were found at lower frequencies, but their concentrations were one order of magnitude higher than those of the others. CONCLUSION: Discharge of pesticides in downstream area were mainly contributed from rice farming and suburban horticulture, while pesticide occurrences in upstream area, such as Donggang river basin were caused by highland agriculture for cabbage and potato production. Despite the influx of pesticides from tributaries through intensive agriculture areas, pesticide concentration in the main stream water was low due to the dilution effect from the upstream. Therefore, the water quality was considered to be good at the most downstream, the effluent of Paldang dam.

The Study on Micro Soldering Using Low-Residue Flux in $N_2$Atmosphere (질소 분위기에서 저잔사 플럭스를 사용한 마이크로 솔더링에 관한 연구)

  • 최명기;정재필;이창배;서창제;황선효
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.4
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    • pp.7-15
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    • 2000
  • The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

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