• Title/Summary/Keyword: Low melting temperature

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Measurement Methods of Latent Heat for PCM with Low Melting Temperature in Closed Tube

  • Hong Hiki;Kang Chaedong;Peck Jong Hyeon
    • International Journal of Air-Conditioning and Refrigeration
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    • v.12 no.4
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    • pp.206-213
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    • 2004
  • Cycle test for developed phase change material (PCM) is necessary in order to assess the variation of latent heat, which decreases with time by deterioration. T-history method and measurement using heat-flux meter are appropriate for the cycle test in a tube filled with PCM because they do not need an extraction of sample in measuring heat of fusion. In the present study, these methods were applied to a PCM having a melting point below a room temperature, different to the past studies for PCMs melting above a room temperature. As a result of experiment using pure water as specimen, we can obtained rea-sonable values for heat of fusion.

Measurement Methods of Latent Heat for PCM with Low Melting Temperature in Closed Tube (밀폐튜브 내 저온 PCM의 잠열측정법)

  • 류경용;박창현;백종현;홍회기
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.15 no.7
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    • pp.604-610
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    • 2003
  • Cycle test for developed phase change material (PCM) is necessary in order to analyze the variation of latent heat, which decreases with time by deterioration. 7-history method and measurement using heat flux meter are appropriate for the cycle test in a tube filled with PCM because they do not need an extraction of sample in measuring the heat of fusion. In the present study, these methods were applied to a PCM having a melting point below a room temperature, different from the past studies for PCMs melting above a room temperature. As a result of experiment using pure water as specimen, we can obtain reason-able values for heat of fusion by both methods.

Heat and Flow Characteristics During Melting Process of a PCM Inside a Liquid Flexitank for Cargo Containers (화물 컨테이너용 액상 백 내부 PCM의 용융 과정에 대한 열유동 특성 해석)

  • Lilong Sun;Joon Hyun Kim;Jaehoon Na;Jaeyong Sung
    • Journal of the Korean Society of Visualization
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    • v.22 no.1
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    • pp.6-17
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    • 2024
  • This study examined the natural convection heat flow characteristics of the melting process of PCM (palm oil) inside a liquid flexitank(bag) for a cargo container. A film heating element was installed on the bottom of the container, and numerical analysis was performed under heat flux conditions of 1,000 to 4,000 W/m2. As a result, the melt interface of the PCM rises to a nearly horizontal state over time. In the initial stage, conduction heat transfer dominates, but gradually waves at the cell flow and melt interfaces are formed due to natural convection heat transfer. As melting progresses, the Ra number increases parabolically, and the Nu number increases linearly and has a constant value. The Nu number rises slowly under low heat flux conditions, whereas under high heat flux conditions, the Nu number rises rapidly. As the heat flux increases, the internal temperature oscillation of the liquid phase after melting increases. However, under high heat flux conditions, excess heat exceeding the latent heat is generated, and the temperature of the molten liquid is raised, so the increase in melting rate decreases. Therefore, the appropriate heating element specification applied to a 20-ton palm oil container is 2,000 W/m2.

Numerical Investigation on the Urea Melting Characteristics with Coolant and Electric Heaters (냉각수 및 전기 가열 방식에 따른 요소수 해동 특성에 관한 수치해석 연구)

  • Lee, Seung Yeop;Kim, Man Young
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.1
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    • pp.1-7
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    • 2016
  • A Urea-SCR(Selective Catalytic Reactor) system, which converts nitrogen oxides into nitrogen and water in the presence of a reducing agent, creates a major exhaust gas aftertreatment system for NOx reduction among other compounds. With regard to vehicle applications, a urea solution was chosen based on its eutectic composition of a 32.5wt% urea-water solution. An important advantage of this eutectic composition is that its melting point of $-11.7^{\circ}C$ is sufficiently low to avoid solidification in cold environments. However, the storage tanks must be heated separately in case of low ambient temperature levels to ensure a sufficient amount of liquid is available during scheduled start ups. In this study, therefore, a numerical investigation of three-dimensional unsteady heating problems analyzed to understand the melting processes and heat transfer characteristics including liquid volume fraction, temperature distributions, and temperature profiles. The investigations were performed using Fluent 6.3 commercial software that modeled coolant and electric heater models based on a urea solution. It is shown that the melting performance with the electric heater is higher than a coolant heater and is more efficient.

Fabrication and Characteristics of Flame Retardant Fabric Developed by using Bicomponent Filament (복합사를 이용한 난연 직물의 제조와 특성)

  • Lee, Shin-Hee
    • Textile Coloration and Finishing
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    • v.25 no.2
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    • pp.110-117
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    • 2013
  • The purpose of this study is to fabricate the flame retardant polyester fabric by thermal bonding with low melting component of flame retardant bicomponent filament(LMFRPC) and to describe the characteristics of thermal bonded fabrics. The fabrics were prepared with flame retardant polyester filaments(FRP) as warp and blended filaments of FRP and LMFRPC as weft. The LMFRPC have a sheath and a core wherein the core comprises a flame retardant polyester and the sheath comprises a thermoplastic polyester of low-melting point. In this study, we investigated the physical properties, melting behavior of filament, the effect of the component of FRP and LMFRPC on the thermal bonding, mechanical properties. Melting peak of LMFRPC showed the double melting peak. The thermal bonding of the fabric formed at lower melting peak temperature of bicomponent filament of LMFRPC. The optimum thermal bonding conditions for fabrics was applied at about $170^{\circ}C$ for 60 seconds by pin tenter. On the other hand, the tensile strength, elongation, and LOI of the fabric increased with an increasing component of FRP of weft.

A Study on the Melting Morphology of Graphite in Cast Iron

  • Lim, Chang-Hee;Ra, Hyung-Yong
    • Journal of Korea Foundry Society
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    • v.5 no.4
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    • pp.243-257
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    • 1985
  • Many authors have studied the solidification process of cast iron and the effect of grain boundaries in austenite shell on the growth of spheroidal graphite. But, the studies on the melting morphology of cast iron are rare and the effect of grain boundaries in austenite shell on the melting procedure of spheroidal graphite cast iron is unknown. Therefore, in this work, the melting procedure of cast iron and the role of grain boundaries in austenite shell on the melting of spheroidal graphite have been studied. The main results are summarized as follows. 1. In white cast iron containing silicon, melting initiates at the interface between austenite matrix and temper carbon which was decomposed from $Fe_3C$ during heating. 2. In gray cast iron, melting initiates at the boundary of eutectic cell where elements with low melting temperature are condensed. The dissolution of kish graphite is difficult. 3. In spheroidal graphite cast iron containing little phosphor, melting initiates at the outer region of austenite shell in which silicon is condensed. In this case, grain boundaries in austenite shell give little effect on the melting procedure of spheroidal graphite. 4. In spheroidal graphite cast iron containing phosphor above 0.3 wt%, its melting phenomena are changed with heating rate due to the existence of steadite. In this case, it can be concluded that liquid phase of steadite, which segregated on outer region of austenite shell, moves to spheroidal graphite-austenite interface along the grain boundaries in austenite shell.

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An Analysis of the I-t Characteristic of Low Voltage Distribution Line Fuse Using the FEM (유한 요소법을 이용한 저압 배전용 전선퓨즈의 I-t 특성 해석)

  • 황명환;박두기;이세현;한상옥
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.11 no.6
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    • pp.74-80
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    • 1997
  • In this paper, we deal with the I -t characteristic of low voltage distribution fuse (line fuse). That fuse element has two parts;One is low temperature melting element(LTME) to put up with over current and the other is high temperature melting element (HTME) which put up with large current. Melting charateristic of fuse is determined by L TME and HTME. So we verified their properties of fuse design, mathematically, by simulating the thermal and electric characteristics of each other. We simulated the I-t characteristic of line fuse by using the numerical method;Finite Element Method(FEM). Then, we could acquire very similar result at the HTME and L TME area when compared the simlation result with experimental one.

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Effects of Ag on the Characteristics of Sn48In52Agx (wt%) Low-Melting Solders for Photovoltaic Ribbon (태양광 리본용 Sn48In52Agx (wt%) 저융점 솔더의 특성에 미치는 Ag의 영향)

  • Seung-Han Lee;Dong-Hyeon Shin;Tae-Sik Cho;Il-Sub Kim
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.1
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    • pp.74-78
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    • 2024
  • We have studied the effects of Ag on the characteristics of Sn48In52Agx (wt%) low-melting solders for photovoltaic ribbons. The Sn48In52 (wt%) solder coexisted in the InSn4 and In3Sn alloys. Ag atoms added in the solder formed an AgIn2 alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn48In52Agx (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn48In52 (wt%) solder was 53.6 N/mm2, and that of the Sn48In52Ag1 (wt%) solder largely increased to 125.1 N/mm2. In the meanwhile, the melting temperature of the Sn48In52 (wt%) solder was 119.2℃, and that of the Sn48In52Ag1 (wt%) solder decreased to 114.0℃.

Low Temperature bonding Technology for Electronic Packaging (150℃이하 저온에서의 미세 접합 기술)

  • Kim, Sun-Chul;Kim, Youngh-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.17-24
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    • 2012
  • Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

Quality Characteristics of Grape Jellies with Sugar Derivative Sweeteners for the Elderly (대체당 첨가 고령자용 포도젤리의 품질 특성)

  • Lee, Mi-Hye;Choi, Eun-Jung;Oh, Myung-Suk
    • Journal of the Korean Society of Food Culture
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    • v.23 no.4
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    • pp.499-506
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    • 2008
  • This study was conducted to determine the quality characteristics of grape jellies for the elderly. The jellies contained sugar (control) or sugar derivative sweeteners (erythritol, isomaltooligosaccharide, sorbitol, and xylitol). Agar (0.31%) and $\kappa$-carrageenan (0.27%) were the gelling agents. The average age of the subjects participating in the acceptance test was 79. The lightness (L), redness (a), and yellowness (b) values of the agar gel with erythritol mostly decreased, indicating a darker and pale red color. The L and b values of the carrageenan gel with sugar derivative sweeteners increased, indicating brighter and yellowish color. The agar and carrageenan gels with sorbitol showed higher gelling and melting temperature, indicating that gelation occurred easily and did not easily melt. The agar and carrageenan gels with xylitol showed a low-melting temperature, indicating low stability with temperature change. The break-down rate of the agar and carrageenan gels with erythritol was low, whereas that of agar gel with sorbitol was relatively high despite its high melting temperature. Hardness, cohesiveness, gumminess, and chewiness of the gels with sugar derivative sweeteners decreased, and this tendency was most distinct with isomaltooligosaccharide in the agar gel and with sorbitol in the carrageenan gel. The rupture properties of the gel were the same as the hardness of the gel. Sensory acceptance of the agar gels with erythritol, sorbitol, isomaltooligosaccharide, and the carrageenan gel with erythritol was fairly high, whereas that of the agar gel with xylitol and the carrageenan gel with isomaltooligosaccharide and xylitol was low. The results show that sorbitol and erythritol are appropriate as sugar substitutes in grape jellies for the elderly about the acceptability and stability of the gels.