• Title/Summary/Keyword: Low melting point alloy

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A Study on the Formation of the Bosses on the Surface of A390 Cast Bar with Hot Top Process (Hot Top공정으로 제조한 A390합금 주조봉의 표면 돌기 생성에 관한 연구)

  • Lee, Jeong-Mu;Gang, Seok-Bong;Kim, Byeong-Jo
    • 연구논문집
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    • s.25
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    • pp.155-161
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    • 1995
  • During casting of A390 billet by Hot Top process, bosses were formed on the surface of cast bar. The formation of boss is assumed due to a large amount of latent heat released during the formation of primary Si in A390 alloy. The low melting point elements around primary Si are locally remelted to liquid and interdendrite offers a path by which the liquid can pass through to the surface. Addition of Sr decreases the amount of latent heat by preventing the formation of primary Si near the surface and thus suppresses the formation of boss on the surface of cast bar. Therefore, the formation of boss could be reduced remarkably when the casting condition was selected to extract the latent heat outward easily.

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Design of very fast acting fuse element using the Ag-Cu alloy (Ag-Cu 합금을 이용한 매우 빠른 동작 특성의 퓨즈 엘리멘트 설계)

  • Kim, Eun-Min;Lee, Seung-Hwan;Cho, Dae-Kweon;Kim, Shin-Hyo
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.8
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    • pp.1070-1074
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    • 2014
  • With the development of the electronics industry and widespread supply of many different electrical appliances, the factors of the electrical fires are also diversified. For this reason, the fuse, safety-critical component, needs accurate and stable operating characteristics for preventing various fire factor, and also needs various operating characteristics. Especially when the all electrical resistance are dropped by internal short of circuit, high current inrushes and makes the fire. In order to prevent this, very fast acting fuses should be applied. However, existing very fast acting characteristics fuse has less wire dimension of element Ag100% metal than that of fast acting fuse, and it is made of plating with low melting point metals, so it satisfy very fast acting but it can't satisfy durability and safety. For this reason, in this study, through the analyzing fusing characteristics of Ag-Cu alloy composition, the new alloy composition, which implement to very fast acting fuse without decrease of fuse elements dimension, is suggested. And this study classify the operating characteristics changes, a resistance change, and the rated current of the fuse in the overall composition change of Ag-Cu alloying. and it can be utilized for designing fuse.

Corrosion Behavior of As-Cast and Solution-Treated AZ91-4%RE Magnesium Alloy (주조 상태 및 용체화처리한 AZ91-4%RE 마그네슘 합금의 부식 거동)

  • Han, Jin-Gu;Hyun, Soong-Keun;Jun, Joong-Hwan
    • Journal of the Korean Society for Heat Treatment
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    • v.31 no.5
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    • pp.220-230
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    • 2018
  • The objective of this study is to investigate the effect of solution treatment on the microstructure and corrosion behavior of cast AZ91-4%RE magnesium alloy. In the as-cast state, microstructure of the AZ91-4%RE alloy was characterized by intermetallic ${\beta}(Mg_{17}Al_{12})$, $Al_{11}RE_3$ and $Al_2RE$ phase particles distributed in ${\alpha}-(Mg)$ matrix. After solution treatment, the ${\beta}$ particles with low melting point dissolved into the matrix, but Al-RE phases still remained due to their high thermal stabilities. It was found from the immersion and potentiodynamic polarization tests that corrosion rate of the AZ91-4%RE alloy increased after the solution treatment. On the contrary, EIS tests and EDS compositional analyses on the surface corrosion products indicated that the stability of the corrosion product was improved after the solution treatment. Examinations on the corroded microstructures for the ascast and solution-treated samples revealed that dissolution of the ${\beta}$ particles which play a beneficial role in suppressing corrosion propagation, would be responsible for the deterioration of corrosion resistance after the solution treatment. This result implies that the microstructural features such as amount, size and distribution of secondary phases that determine corrosion mechanism, are more influential on the corrosion rate in comparison with the stability of surface corrosion product.

Rapidly and Accurately Processing of Low Melting Block for Shielding of Radiotherapy (방사선(放射線) 치료(治療)의 신속정확(迅速正確)을 위한 저온용융(低溫熔融) 차폐물(遮蔽物)의 제작(製作)과 응용(應用))

  • Chu, S.S.;Lee, D.H.;Park, C.Y.
    • Journal of Radiation Protection and Research
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    • v.4 no.1
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    • pp.14-20
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    • 1979
  • For accurate and easily shielding irregular shaped organ, its minimized penumbra region and a low melting point alloy 'Lead Y' and synchronizing instrument have been developed. The 'Lead Y' is the quaternary eutectic alloy and it is composed of Lead 30.0% Tin 11.5% Bismuth 48 5% Cadmium 10.0% The density of its at $22^{\circ}C$ is $9.8g/cm^3$ and the melting temperature has $40^{\circ}C\;to\;68^{\circ}C$. The thickness of 'Lead Y' for perfect shielding of Co-60 gamma ray and LINAC 10MeV x-ray is 6cm and 7cm respectively. The 'Lead Y' shielding block is casted directly on the styrofoam from which is cut with hot wire of synchronizer device. The special features and advantages of the Lead Y shielding block could be summarized as follows; 1. The shielding block for radiotherapy is rapidly processed only with boiling water and styrofoam. 2. It is not injure one's health and not danger of a fire, because of not generating of any metals vapor and evil smelling. 3. It is very effective to minimize secondary penumbra for the protection of healthy tissue from unnecessary ionizing radiation regardless of the magnification source to skin distance. 4. The HVL of the Lead Y is 1.2cm for Co-60 gamma ray and it's shielding effect is almost same as the pure lead block. 5. The hardness of Lead Y is 1.5 times higher than lead block. 6. It's reavailability is higher than lead block and then one block of Lead Y is reavailable about 30 to 40 times. 7. It is usefull for shielding of x-ray, gamma ray, beta-ray, electron and neutron radiation. 8. The materials for Lead Y are easy to acquire with reasonable price and tractable.

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The Formation Behavior of Non-metallic Inclusion in the Ce-added Hyper Duplex STS (Hyper Duplex STS 중 Ce 첨가 시 비금속개재물 생성거동)

  • Hong, S.H.;Jang, P.Y.;Park, Y.M.;Byun, S.M.;Kim, K.T.;You, B.D.
    • Transactions of Materials Processing
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    • v.19 no.5
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    • pp.311-319
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    • 2010
  • Rare earth metal Ce has a relatively low melting point and high specific gravity. Because of its significantly high affinity to oxygen, nitrogen and sulfur, it is highly usable as a steel refining agent. However, because Ce compound has relatively high specific gravity, it is difficult to be separated from molten steel through floatation, and it degrades the purity of molten steel, or may clog the nozzle in continuous casting. Such problem may be solved by using an appropriate deoxidation agent together with Ce and settling molten steel sufficiently after refining. Thus a fundamental study in the formation behavior of non-metallic inclusion in Ce added Hyper Duplex STS melts was investigated. The addition amount of Ce, melt temperature were considered as experimental variables. A main non-metallic inclusion in mother alloy is 51(wt%MnO) - 27.6(wt%SiO$_2$)- 10.9(wt%$Cr_2O_3$). Non-metallic inclusion was dramatically decreased and the particle size was fined as the amount of Ce increased. Moreover (%MnO) and (%SiO$_2$) of non-metallic inclusion were decreased. But (%$Al_2O_3$)were relatively increased. The number of non-metallic inclusion were decreased and the large particle size were increased by increasing the temperature of molten steel.

Electrical and Mechanical Properties of CNT-filled Solderable Electrically Conductive Adhesive (탄소나노튜브 함유 Solderable 도전성 접착제의 전기적/기계적 접합특성 평가)

  • Yim, Byung-Seung;Jeong, Jin-Sik;Lee, Jeong-Il;Oh, Seung-Hoon;Kim, Jong-Min
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.37-42
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    • 2011
  • In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

Study on the Optimization Field Welding Conditions of Low Heat-Input Pluse MIG Welding Process for 5052 Aluminum Alloy Sheets (Al 5052 합금의 저입열 Pulse MIG 최적 현장 용접조건 산정에 관한 실험적 연구)

  • Kim, Jae-Seong;Lee, Young-Gi;An, Ju-Sun;Lee, Bo-Young
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.80-84
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    • 2011
  • The weight reduction of the transportations has become an important technical subject Al and Al alloys, especially Al 5052 alloys have been being applied as door materials for automobile. One of the most widely known car weight-reduction methods is to use light and corrosion-resistant aluminum alloys. However, because of high electrical and thermal conductivity and a low melting point, it is difficult to obtain good weld quality when working with the aluminum alloys. Also, Pulse MIG welding is the typical aluminum welding process, but it is difficult to apply to the thin plate, because of melt-through and humping-bead. In order to enhance weld quality, welding parameters should be considered in optimizing the welding process. In this experiment, Al 5052 sheets were used as specimens, and these materials were welded by adopting new Cold Metal Transfer (CMT) pulse process. The proper welding conditions such as welding current, welding speed, torch angle $50^{\circ}$ and gap 0~1mm are determined by tensile test and bead shape. Through this study, range of welding current are confirmed from 100A to 120A. And, the range of welding speed is confirmed from 1.2m/min to 1.5m/min.

Junction of Porous SiC Semiconductor and Ag Alloy (다공질 SiC 반도체와 Ag계 합금의 접합)

  • Pai, Chul-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.3
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    • pp.576-583
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    • 2018
  • Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints (OSP 표면처리된 FR-4 PCB기판과 Sn58%Bi 복합솔더 접합부의 미세조직 및 접합강도에 미치는 Sn-MWCNT의 영향)

  • Park, Hyun-Joon;Lee, Choong-Jae;Min, Kyung Deuk;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.163-169
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    • 2019
  • Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

A Study on Dose Distribution of Small Irradiation Field in the Electron Therapy (전자선 치료에 있어서 작은 조사면적의 선량분포에 관한 고찰)

  • Kim, Sung-Kyu;Shin, Sei-One;Kim, Myung-Se
    • Journal of Yeungnam Medical Science
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    • v.8 no.2
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    • pp.114-120
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    • 1991
  • In electron therapy, low melting point alloy is used for shaping of the field. Electron field shaping material affect the output factor as well as the collimator system. The output factors of electron beams for shaped fields from NELAC-1018 were measured using ionization chamber of Farmer type in water phantom. The output factors of electron beams depend on the incident energy, inherent collimator system and the size of shaped field. Obtained results were followings. 1. In the smaller applicator, output varied extremely according to extent of collimator opening. 2. The higher energy, the output is less varied according to treatment field at small field.

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