• Journal of Powder Materials
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• v.28 no.4
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• pp.301-309
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• 2021

In this study, an AISI 316 L alloy was manufactured using a selective laser melting (SLM) process. The tensile and impact toughness properties of the SLM AISI 316 L alloy were examined. In addition, stress relieving heat treatment (650℃ / 2 h) was performed on the as-built SLM alloy to investigate the effects of heat treatment on the mechanical properties. In the as-built SLM AISI 316 L alloy, cellular dendrite and molten pool structures were observed. Although the molten pool did not disappear following heat treatment, EBSD KAM analytical results confirmed that the fractions of the low- and high-angle boundaries decreased and increased, respectively. As the heat treatment was performed, the yield strength decreased, but the tensile strength and elongation increased only slightly. Impact toughness results revealed that the impact energy increased by 33.5% when heat treatment was applied. The deformation behavior of the SLM AISI 316 L alloy was also examined in relation to the microstructure through analyses of the tensile and impact fracture surfaces.

• Journal of Korea Foundry Society
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• v.15 no.3
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• pp.235-241
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• 1995

In order to improve the production process of low cost and high purity Vanadium, this study was done to reduce $V_2O_5$ into V-Al master alloy by Aluminothermic Reduction, followed by refining of V-Al master alloy electron beam melting. As melting time was increased in electron beam melting of V, the contents of interstitial impurities and Al, Fe were decreased but the contents of Si, Mo and W were increased due to lower vapor pressure of these elements than that of matrix V. Consequently, it was profitable that melting of V was done for 180 seconds. In addition, with number of melting, the purity of V did not significantly vary, because volatile impurities in V were removed mostly during the first step of melting. As a result of V refining by electron beam melting, high purity Vanadium of 3N(99.91wt%) was acquired including interstitial impurities total contents of which were maximum 400ppm.

• Journal of the Korean Society for Heat Treatment
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• v.8 no.4
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• pp.245-254
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• 1995

The purpose of this study was to examine the effects of low melting point phase(LMPP) on mechanical properties in the Al-Cu-Li-X(In, Be) alloys. This study was performed by the differential scanning calorimetry(DSC), the transmission electron microscope(TEM), hardness test, tensile test and notch tensile test. The shape of LMPP in the specimens homogenized at $570^{\circ}C$ was film type due to remelting at grain boundary during homogenization. Low melting point phases had no effects on mechanical properties in the aging treated materials, because the density of LMPPs was low. Mechanical properties of the aging treated materials were affected by the density of matrix precipitation phases and grain sizes. For the In or In, Be added Al-Cu-Li alloys, the optimum solution treatment temperature was $550^{\circ}C$. The strength of Al-Cu-Li-In-Be $T_6$ treated alloy was higher than that of 2090-$T_8$ alloy.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.510-515
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• 2017

In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of $138^{\circ}C$, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and $300^{\circ}C$ for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.65-71
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• 2005

Experimental Ti-13%Zr and Ti-13%Zr-5%Cu alloys were made in an argon-arc melting furnace. The grade 2 CP Ti was used to control. The alloys were cast into phosphate bonded $SiO_2$ investment molds using an argon-arc casting machine, and The hardness and microstructures of the castings were investigated in order to reveal their possible use for new dental casting materials and to collect useful data for alloy design. The hardness of the Ti-13%Zr-5%Cu alloy(379Hv) became higher than that of Ti-13%Zr(317Hv) alloy, and the hardness of this alloys became higher than that of CP Ti(247Hv). Increasing in the hardness of the Ti-13%Zr-5%Cu alloy was considered to be solid solution hardening as the Ti-Zr system shows a completely solid solution for both high temperature $\beta$phase and low temperature $\alpha$ phase and also the inclusion of the eutectoid structure($\alpha Ti+Ti_{2}Cu$). No martensitic structures are observed in the specimen made of CP Ti, but Ti-13%Zr and Ti-13%Zr-5%Cu alloys show a kind of martensitic structure. Ti-13%Zr-5%Cu shows the finest microstructure. From these results, it was concluded that new alloys for dental casting materials should be designed as Ti-Zr-Cu based alloys.

• Journal of Biomedical Engineering Research
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• v.6 no.1
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• pp.37-46
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• 1985

Development of a dental Ni-Cr alloy system for porcelain veneering crown and bridge was studied in this research. The principles of alloy design were a) It should not contain toxic beryllium. b) It should have low melting Point. c) It should be easily ground and polished. d) It should possess an adequate strength to resist the deformational force In the mouth. e) It should be bondable Ivith porcelain by chemically. After investigating the effect of minor elements such as boron and rare earth metals on the mechanical properties of the Ni-Cr alloy system, the compromised ideal composition for dental use was determined. The composition was l9.6%, Cr, 5.6% Mo, 3.4% Si, 1, 0% Fe, 0.01% Ti, 0.5-1.0% B, 0.2-0.6% misch metal, balance Ni. To compare the performance of experimental alloy with commercially available alloys, the properties such as strength, melting point, and bond strength were measured. The results Ivere as follows: a) Boron increases the strength of the alloy but reduces the elongation. b) Misch metal increases the strength when the boron content is low, but does not increase the strength when boron content is high. And it reduces the elongation drastically, c) Mechanical strength of the experimental alloy was not superior to commercially available Be containing alloy, but handling performance such as castability, ease of granting and polishing, and cuttability were superior to the Be containing alloy.

• Journal of the Korea Furniture Society
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• v.22 no.1
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• pp.54-62
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• 2011

The metalized wood composites with natural grain of imported Juglans nigra, which was impregnated with low melting alloy were manufactured and evaluated in this study. And the proper manufacturing conditions was also investigated in this study. The low melting alloy with bismuth (Bi) and tin (Sn) which are harmless to humans, was applied to this new composites. The composites showed not only no defects of discoloration, delamination, swelling, and cracking, because of high dimensional stability and low thickness swelling, but also much improved performance such as high bending strength, high hardness, abrasion resistance, high thermal conductivity as floor materials. This study also suggested the proper impregnating condition, such as 10 minutes of the preliminary vacuum time, $186^{\circ}C$ of the heating temperature and 10 minutes of the maintaining pressure time at the pressure of $30kgf/cm^2$. This metalized wood composites showed 7 times higher density than control, great increase in bending strength from $131.8N/mm^2$ to $192.3N/mm^2$, and great increase in hardness from $18.2N/mm^2$ to $90.4N/mm^2$. The composites demonstrated not only high emissivity of 91%, high shilding effectiveness of 92.59∼99.99%, high fire resistance but also great decrease in abrasion depth, water absorption and thickness swelling.