• Korean Journal of Food Science and Technology
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• v.34 no.6
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• pp.1140-1144
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• 2002

Molecular relaxation behaviors of crystalline glucose anhydrous, crystalline glucose monohydrate, and amorphous glucose with different particle sizes were observed by measuring spin-spin relaxation time constant $(T_2)$ at the temperature range of $-20\;to\;110^{\circ}C$ using temperature-controlled low field nuclear magnetic resonance spectroscopy. No change in $T_2$ values of crystalline glucose anhydrous was observed throughout the temperature range, whereas $T_2$ values of crystalline glucose monohydrate and amorphous glucose increased from around $45\;and\;65^{\circ}C$, respectively. These results indicate that molecular mobility of crystalline glucose anhydrous does not change even at temperature higher than $100^{\circ}C$ and that the stability of powdered glucose could be improved by increasing the particle size of materials.

• Applied Chemistry for Engineering
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• v.4 no.3
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• pp.616-626
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• 1993

Polyurethane(PU) have an excellent flexibility and toughness so that it has been widely used as an elastomer. PMMA was blended with PU to improve the impact property. Five types of PU, having different molecular weight and different polyol types, were prepared and blended with PMMA in order to investigate the effect of molecular weight and polyol type of PU on property of PU-PMMA blend. Tensile strength of PU-PMMA blend was determined by Inston. Differential Scanning Calorymetry(DSC) and Scanning. Elctron Microscopy(SEM) were used to observe morphology change and glass transition temperature changes of PU-PMMA blends. Transparency of PU-PMMA blends was determined by haze meter. But, owing to intrinsic incompatability of PU-PMMA, Low impact strength of PMMA wasn't improved through PU-PMMA blend. therefore, polyurethane dimethacrylate(PUD), having similiar chemical structure to PU and two vinyl group at both ends, was prepared and reacted with methyl methacrylate(MMA) to form crosslinked copolymer Mechanical property of this crosslinked polymer, such as impact strength and transparency, was investigated by Instron, Izod type (Cantilever beam) impact tester and haze meter. Results of these measurements showed that crosslinked copolymer of PUD-MMA was better impact resistance than PMMA and maintained similar transparency to PMMA.

• Journal of the Korean Wood Science and Technology
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• v.44 no.3
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• pp.406-414
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• 2016

The lignin-based carbon nanofiber reinforced epoxy composite has been prepared by immersing carbon nanofiber mat in epoxy resin solution in order to evaluate the physical and mechanical properties. The thermal and mechanical properties of the carbon nanofiber reinforced epoxy composite were analyzed using thermogravimetric analysis (TGA), differential scanning calorimeter (DSC) and tensile tester. It was found that the thermal properties of the carbon nanofiber reinforced epoxy composite improved, with its glass-transition temperature ($T_g$) increased from $90.7^{\circ}C$ ($T_g$ of epoxy resin itself) to $106.9^{\circ}C$. The tensile strengths of carbon nanofiber mats made from both lignin-g-PAN copolymer and PAN were 7.2 MPa and 9.4 MPa, respectively. The resulting tensile strength of lignin-based carbon nanofiber reinforced epoxy composite became 43.0 MPa, the six times higher than that of lignin-based carbon nanofiber mats. The carbon nanofibers were pulled out after the tensile test of the carbon nanofiber reinforced epoxy composite due to high tensile strength (478.8 MPa) of an individual carbon nanofiber itself as well as low interfacial adhesion between fibers and matrices, confirmed by the SEM analysis.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Polymer(Korea)
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• v.24 no.6
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• pp.737-743
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• 2000

Polyquinonediimines (PQDI) which have stable structure on heat and contains mono-azobenzene in the side chain were synthesized by means of condensation polymerization under TiCl$_4$. The synthesized monomers and polymers were identified by FT-IR, $^1$H-NMR, and elementary analysis. Especially, PQDI was comfirmed by the double-bonding peak of >C=N appeared near 1625 $cm^{-1}$ / by means of FT-IR spectrum. PQDI containing mono-azobenzene group in both side chains wat not soluble in non-polar solvents at all but partially soluble in the polar solvents having small dielectric constant, and dissolved in the strong acid such as sulfuric acid and $CH_3$SO$_3$H. Molecular weight distribution of PQDI measured by GPC showed 1.74. It was confirmed through X-ray diffraction analysis that the polymer was partially crystalline at the low angle region, but amorphous after heat treatment at 1$25^{\circ}C$. The glass transition temperature (T$_{g}$ ) of synthesized polymer was measured as 1$25^{\circ}C$ by differential scanning calorimetry. The SHG value for $\chi$$^{(2)}$ after poling at 1$25^{\circ}C$ was 8.6 pm/V (λ=1.542 ${\mu}{\textrm}{m}$). The SHG value slowly decreased with time from the start but appeared temporal stability after 100 hours.

• Polymer(Korea)
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• v.25 no.4
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• pp.521-527
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• 2001

The miscibility, molecular interaction and tensile properties of the blends of poly (${\varepsilon}$-caprolactone) (PCL) with poly(vinyl chloride) (PVC) have been studied. The measured glass transition temperature values of PCL/PVC blends were found to be well fitted by Fox equation. We found that PCL/PVC blends are amorphous up to 23% PCL content. The blends showed the highest Young's modulus and yield strength at 5% PCL content and the highest tensile strength at 11% PCL content. The blends with low contents of PCL(up to 13%) show increased tensile strength and decreased elongation of PCL/PVC blends. Consequently, the antiplasticization phenomenon is observed in the PCL/PVC blends.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.49-55
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• 2016

In this study, we designed an environment friendly, water-based adhesive using the acrylic emulsion method as a replacement for solvent-based adhesives, which are most commonly used in layered laminates for flexible food packaging. We designed adhesives with different combinations of anionic, non-ionic, and phosphoric ester surfactants, and with different concentrations of chain transfer agent (CTA). We also examined the effect of the degree of cross-linking by synthesizing and comparing 8 test group adhesives with different types of functional monomers. Additionally, we synthesized 2 other test group pressure-sensitive adhesives (PSA) using styrene/alpha-methyl styrene/acrylic acid (SAA) semipolymer dispersing agents (with molecular weights of 13,000 g/mol and 8,600 g/mol, respectively) to replace the conventional surfactants. We evaluated whether the 10 test group pressure-sensitive adhesives met the basic physical property criteria required for flexible food packaging by carrying out a physical analysis of their glass transition temperature (Tg), particle size, adhesion, and molecular weight. In our test, 2 test group adhesives manufactured with the combination of anionic and non-ionic surfactants, CTA concentration of 0.2%, and functional monomers of hydroxyethyl acrylate (HEA) and glycidyl methacrylate (GMA) demonstrated molecular weight and flexibility suitable for flexible packaging, with low adhesiveness and small particle size.