• Title/Summary/Keyword: Low emissivity

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Flame Characteristics on Wall Recess Type Ceramic Combustor for Low Pollutants (Wall Recess형 저공해 세라믹 연소기의 화염특성)

  • 전영남;채재우
    • Journal of Korean Society for Atmospheric Environment
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    • v.12 no.2
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    • pp.131-139
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    • 1996
  • The developent of ceramic combustor is being increased beca- use of the excellent physical properties of ceramic material, that is, high-resistant strength, high emissivity power and high corrosin-resistance. Ceramic combustor has been interested in the application of ultra-lean combustion for low NO$_{x}$ emission and gaseuos waste incineration with good combustion. This experimental study was conducted to investigate the combustion and emission characteristics of wall recess type ceramic combustor with equivalence ratio, mixture flow velocity and wall recess depth as parameters. The results in this study are as follows: 1. Wall recess played a important role to extend flame stability region. 2. The peak temperature of gas was peoportional to equivalence ratio, mixture flow velocity and wall recess depth. 3. The static pressure of mixing chamber and inlet temperature depended on the position of flame zone. 4. NO reduction was achieved by lean mixture without lower combustibility.y.

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Retrieval of Relative Surface Temperature from Single-channel Middle-infrared (MIR) Images (단일밴드 중적외선 영상으로부터 표면온도 추정을 위한 상대온도추정알고리즘의 연구)

  • Wook, Park;Won, Joong-Sun;Jung, Hyung-Sup
    • Korean Journal of Remote Sensing
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    • v.29 no.1
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    • pp.95-104
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    • 2013
  • In this study, a novel method is proposed for retrieving relative surface temperature from single-channel middle infra-red (MIR, 3-5 ${\mu}m$) remotely sensed data. In order to retrieve absolute temperature from MIR data, it is necessary to accommodate at least atmospheric effects, surface emissivity and reflected solar radiance. Instead of retrieving kinematic temperature of each target, we propose an alternative to retrieve the relative temperature between two targets. The core idea is to minimize atmospheric effects by assuming that the differential at-sensor radiance between two targets experiences the same atmospheric effects. To reduce effective simplify atmospheric parameters, each atmospheric parameter was examined by MODTRAN and MIR emissivity derived from ASTER spectral libraries. Simulation results provided a required accuracy of 2 K for materials with a temperature of 300 K within 0.1 emissivity errors. The algorithm was tested using MODIS band 23 MIR day time images for validation. The accuracy of retrieved relative temperature was $0.485{\pm}1.552$ K. The results demonstrated that the proposed algorithm was able to produce relative temperature with a required accuracy from only single-channel radiance data. However, this method has limitations when applied to materials having very low temperatures using day time MIR images.

The Study on Physical and Mechanical Properties of Composite Board, Using Byproduct of Plywood for Core Layer (합판 정재단 부산물을 중층 Core로 이용한 복합보드의 물리·기계적 성질에 관한 고찰)

  • Choe, Song-Kyu;Pi, Duck Won;Kang, Seog Goo
    • Journal of the Korean Wood Science and Technology
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    • v.41 no.6
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    • pp.490-496
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    • 2013
  • The board using recycled wood waste chip tends to decrease in terms of physical and mechanical properties. The reasons are notably different shape of chips, components of used adhesive and impurity content, which bring the irregular quality and downgrading of board. More over, the board has higher emissivity of formaldehyde than regular board, because recycled chip contains adhesives that were used to make previous products. This low quality of products weakens the price and quality competitiveness, and it led to bringing the issue of problem in Korean board industry. For these reason, in this study, boards using byproducts of plywood were made to evaluate physical and mechanical properties according to manufacturing conditions. As a result, The board was consists of 4~16 mesh chips for core layer and veneer on both face and they were combined using EMDI, and its' bending strength was 57.7 $N/mm^2$ which is 215% higher than that of OSB (26.8 $N/mm^2$). Moreover, the emissivity of formaldehyde was 0.7 ppm, this board seems to substitute OSB for rated sheathing.

Design and characterization of conductive transparent filter using [TiO2|Ti|Ag|TiO2] multilayer ([TiO2|Ti|Ag|TiO2] 다층구조를 이용한 전도성 투과필터의 설계 및 특성분석)

  • Lee, Seung-Hyu;Lee, Jang-Hoon;Hwangbo, Chang-Kwon
    • Korean Journal of Optics and Photonics
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    • v.13 no.4
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    • pp.363-369
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    • 2002
  • We have designed conductive transparent filters using a low-emissivity coating such as [dielectric|Ag|dielectric] for display applications. The design is the repetition of [$TiO_{2}$|Ti|Ag |$TiO_{2}$] to increase the transmittance in the visible and decrease the transmittance in the near IR. The conductive transparent filters are deposited by a radio frequency(RF) magnetron sputtering system. The optical, structural and electrical properties of the filters were investigated and the optical spectra are compared with simulated spectra. The thickness of the deposited Ag films is above 13 ㎚ to increase the conductivity and that of $TiO_{2}$ films is 24 ㎚ to increase the transmittance in the visible range. Ti blockers are employed to prevent the Ag films from being oxidized by an oxygen gas during the reactive sputtering process. Also, it is shown that the thicker Ti film is necessary as the period increases. Finally, a filter with repetition of the basic structure three times shows the better cut-off near infrared(NIR) and the sheet resistance as low as 2Ω/□ which is enough to shield an unnecessary electromagnetic waves for a display panel.

The Analysis of Heat Transfer through the Multi-layered Wall of the Insulating Package

  • Choi, Seung-Jin
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.12 no.1
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    • pp.45-53
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    • 2006
  • Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

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Thermal stability of low-emissivity glasses consisting of $SnO_2/AI/Ag/AI/SnO_2$films deposited by D.C. planar magnetron sputtering (직류 스퍼터링법에 의해 제막된 $SnO_2/AI/Ag/AI/SnO_2$ 구조 열선반사유리의 열적안전성)

  • 김의수;유병석
    • Journal of the Korean Vacuum Society
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    • v.4 no.1
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    • pp.32-39
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    • 1995
  • SnO2/AI/Ag/AI/SnO2층 구조로 이루어진 열처리 가능한 열선반사막을 직류 스퍼터링법에 의해 soda-lime silicate 유리위에 형성시켰다. 이 코팅유리를 $650^{\circ}C$에서 열처리하면 가시광선 투과율 85%이상, plasma wavelength 970nm 이하를 얻을 수 있었다. 따라서 이 구조의 막은 유리 곡가공에 견디는 열적 안정성을 나타내었으며, 코팅유리의 열처리에 따른 전기적 특성 및 열적 안정성은 각각 Ag와 AI층의 두께에 의존하였다.

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Identification of Chip Form Using Pyrometer (방사온도계에 의한 칩 형태 인식)

  • Kweon, H.J.;Paik, I.H.;Sim, J.H.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.7
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    • pp.59-65
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    • 1996
  • A major problem in automation of turning operations is the difficulty in obtaining a sufficient and reliable chip control. Therefore it becomes desirable to find a method which can detect the chip form. Newly born chips in usual metal cutting radiate infrared rays. When such chips run out of cutting point quickly, the radiated energy from the zone around the tool is low compared with that of the case when long tangled chips are staying around the tool. The difference in chip pattern can be detected from the output of pyrometer. But, strictly speaking, only the output of pyrometer does not identify the chip form because that is the removal of chip. Therefore, in this paper, a method of the identification of chip form using output of pyrometer and fuzzy inference is developed.

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A Study on Numerical Analysis of Overall Heat Transmission Coefficient of Vacuum Glazing with Emissivity (방사율에 따른 진공유리 열관류율 수치해석 연구)

  • Hwang, Il-Sun;Lee, Young-Lim
    • Proceedings of the KAIS Fall Conference
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    • 2012.05b
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    • pp.756-758
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    • 2012
  • 인구증가와 지속적인 산업발전으로 인하여 건축이 매우 활발해지고 냉난방으로 인한 에너지 소비가 급증하게 되면서 효율적인 에너지 사용의 필요성이 크게 대두되었다. 건물에서 손실되는 에너지의 약 20~40%가 창문을 통해 손실이 일어나며 이를 해결하고자 현재 Low-E 유리, 복층유리등 다양한 방법들이 개발되어 사용하고 있으며 에너지 손실을 더욱 낮추기 위하여 진공유리가 개발 중이나 아직 보급은 이루어지지 않고 있다. 본 논문에서는 진공유리의 열관류율 측정 장치와 진공에서의 중요한 열전달 요인인 복사열전달이 진공유리 성능에 미치는 영향을 3차원 수치해석을 통하여 알아보았다.

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A Study on 3-dimensional Numerical Analysis of Adiabatic Performance for Vacuum Glazing (진공유리 단열 성능 3차원 수치해석에 대한 연구)

  • Park, Sang-Jun;Lee, Young-Lim
    • Proceedings of the KAIS Fall Conference
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    • 2011.12b
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    • pp.511-513
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    • 2011
  • 인구증가와 지속적인 산업발전으로 인하여 에너지 소비가 급증하게 되면서 효율적인 에너지 사용의 필요성이 크게 대두되었다. 특히 건물의 창문을 통해 많을 에너지 손실이 일어나 이를 해결하고자 현재 로우이(low-emissivity)유리를 사용하고 있으나 이는 태양광의 유입을 줄이는 단순한 방법으로 여전히 상대적으로 높은 열관류율을 갖고 있다. 이를 해결하고자 현재 단열성능이 좋은 고효율 진공유리가 개발 중이나 아직 가격 및 성능 등의 문제로 본격적인 보급은 이루어지지 않고 있다. 본 논문에서는 내부압력, 지지기둥(spacer)의 길이 및 지름 등이 진공유리 성능에 미치는 영향을 3차원 수치해석을 통하여 알아보았다.

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Laser Lock-in Thermal Wave Imaging for Nondestructive Evaluation

  • An, Yun-Kyu;Sohn, Hoon;Kim, Ji Min
    • Journal of the Korean Society for Nondestructive Testing
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    • v.33 no.4
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    • pp.317-322
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    • 2013
  • This paper presents a new laser lock-in thermography (LLT) technique for nondestructive evaluation. LLT utilizes a modulated continuous wave laser beam as a heat source to obtain high fidelity thermal wave images even at the presence of background heat disturbances. The thermal waves propagating along the surface and through-the-thickness directions of a structure are visualized using newly developed laser lock-in amplitude and phase images, enhancing the detectability of surface and subsurface defects. The LLT technique is numerically investigated and experimentally validated using thermal images obtained from a steel specimen with low emissivity.