• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.53-61
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• 2017

Magnesium alloys are of emerging interest in the automotive, aerospace and electronic industries due to their light weight, high specific strength, damping capacity, etc. However, practical applications are limited because magnesium alloys have poor formability at room temperature due to the lack of slip systems and the formation of basal texture, both of which characteristics are attributed to the hcp crystal structure. Fortunately, many magnesium alloys, even commercialized AZ or ZK series alloys, exhibit superplastic behavior and show very large tensile ductility, which means that these materials have potential application to superplastic forming (SPF) of magnesium alloy sheets. The SPF technique offers many advantages such as near net shaping, design flexibility, simple process and low die cost. Superplasticity occurs in materials having very small grain sizes of less than $10{\mu}m$ and these small grains in magnesium alloys can be achieved by thermomechanical treatment in conventional rolling or extrusion processes. Moreover, some coarse-grained magnesium alloys are reported to have superplasticity when grain refinement occurs through recrystallization during deformation in the initial stage. This report reviews the characteristics of superplastic magnesium alloys with high-strain rate and coarse grains. Finally, some examples of SPF application are suggested.

• Journal of Welding and Joining
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• v.9 no.4
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• pp.28-39
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• 1991

The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.22-27
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• 2014

In the past, cold crack was commonly observed in the HAZ(heat affected zone) of high-strength steels. Applying to TMCP(thermo-mechanical controlled process) and HSLA(high strength low alloy) steels, cold crack tends to increase the occurrence in the weld metal. It is generally understood that cold crack occurs when the following factors are present simultaneously : diffusible hydrogen in the weld metal, a susceptible microstructure and residual stress. In particular, many studies investigated the microstructural effect on the cold crack in HAZ and the cold crack in weld metals starts to receive the special attendance in modern times. The purpose of the study is to review the effect of weld microstructures (grain boundary ferrite, Widm$\ddot{a}$nstatten ferrite, acicular ferrite, bainite and martensite) on cold crack in the weld metals. Among various microstructures of weld metals, acicular ferrite produced the greatest resistance to the cold crack due to the fine interlocking nature and high-angle grain boundary of the microstructure.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.13 no.1
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• pp.75-83
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• 2017

This study investigated deformation behavior of major nuclear structural materials under cyclic loading conditions via cyclic stress-strain test. The cyclic stress-strain tests were conducted on SA312 TP316 stainless steel and SA508 Gr.3 Cl.1 low-alloy steel, which are used as materials for primary piping and reactor pressure vessel nozzle respectively, under cyclic load with constant strain amplitude and constant load amplitude at room temperature (RT) and $316^{\circ}C$. From the results of tests, the cyclic hardening and softening behavior, stabilized cyclic stress-strain behavior, and ratcheting behavior of both materials were investigated at both RT and $316^{\circ}C$. In addition, appropriate considerations for cyclic deformation behavior in the structural integrity evaluation of major nuclear components under excessive seismic condition were discussed.

• Restorative Dentistry and Endodontics
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• v.10 no.1
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• pp.63-70
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• 1984

It was the purpose of this study to determine the galvanic current between a gold alloy inlay and four types of amalgam using the circuit through pulp chambers when the freshly extracted teeth with those restorations were brought into contact in a physiologic saline solution, and to investigate the effectiveness of cavity varnish or ammonated silver-nitrate on the surface of amalgam restoration in reducing galvanic current. The current was measured with current-to-voltage converter and recored on a physiograph 6630-257. The following results were obtained. 1. Generally, galvanic current decreased as the time elapsed. 2. Galvainc current decreased significantly in the first day and after then minimal change was observed until 30th day. 3. Initial galvanic current was 29.6 ${\mu}A$ in the cut amalgam and 24.5 ${\mu}A$ in Dispersalloy amalgam and after then the current was significantly decreased. 4. Initial galvanic current was 12.6 ${\mu}A$ in spherical amalgam (low copper amalgam) and 13.8 ${\mu}A$ in Tytin amalgam and the amount of change was lower in sperical amalgam and Tytin amalgam than that in lathe cut amalgam and Dispersalloy amalgam. 5. Painting ammoniated silver-nitrate or Copalite on the surface of amalgam resotration decreased initial galvanic current and ammoniated silver-nitrate is more effective in decreasing galvanic current than Copalite. 6. Galvanic current by contact between amalgam restoration and gold restoration increased abruptly and dropped rapidly becoming almost.

• Journal of Surface Science and Engineering
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• v.24 no.4
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• pp.179-186
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• 1991

The effects of silicone contents and flow rates(agitation rates) of electrolyte on the formation and mechanical properties of hard anodized film of Al-Si alloy have been studied in 12% H2SO4 + 1% Oxalic acid with varying the silicone contents in the rance of 0 to 11.6% and the flow rates of electrolyte in the range of 0 to 90cm/sec. The film forming voltage required to maintain an equivalent current density significantly increase with the silicone content of Al-Si alloys due to a low conductivity of silicone. Hardness and wear resistance of the anodized film of Al-Si alloys decreases wit increasing the silicone content. The increase in the flow rate of electrolyte has a similar influence on the formation and mechanical properties of anodized film as does the decrease in bath temperature. Hardness of anodized film is rapidly increased with the flow rate being increased from 10cm/sec. It is observed that the increase in the flow rate from 11cm/sec. It is observed that the increase in the flow from 11cm/sec to 48cm/sec is more effective in enhancing the hardness of film than is the decrease in bath temperature from 1$0^{\circ}C$ to $0^{\circ}C$.

• Journal of Surface Science and Engineering
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• v.40 no.6
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• pp.262-270
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• 2007

Recently, there has been a new appreciation of aluminum alloys as materials that are capable of reducing the environment load. This is because aluminum alloys are lightweight, easy to recycle, permit miniaturization, and have environmental friendly properties. In this study, we investigated the mechanical and electrochemical properties of 5083F aluminum alloys using slow strain rate test(SSRT) and potentiostatic tests under various potential conditions. In the potentiostatic tests, the current density in the potential range from -0.7 to -1.4V after 1,200 s was low. After considering the results of the potentiostatic tests, maximum tensile strength, yield strength, elongation, time-to-fracture, observation of fractured specimen and fractography analysis, the optimum protection potential range was between -1.3 and -0.7V(Ag/AgCl).

• Journal of Surface Science and Engineering
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• v.44 no.2
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• pp.68-73
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• 2011

A Ni-W thin-film was synthesized by electrodeposition, and its corrosion resistance and electrical surface conductivity were investigated. Amount of tungsten in the Ni-W thin-film increased linearly with current density during the electrodeposition, and crack-free and low-crystalline Ni-21 at.%W coating layer was obtained. Corrosion resistances of the Ni-W thin-films were examined with an anodic polarization method and a storage test in a strong sulfuric acid solution. As a result, the Ni-21 at.%W thin-film exhibited the greatest corrosion resistance, and maintained the electrical surface conductivity even after the severe corrosion test, which could be applicable as a surface treatment for advanced metallic bipolar plates in fuel cell or redox flow battery systems.