• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• 한국자동차공학회논문집
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• 제21권4호
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• pp.113-119
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• 2013

The transient liquid phase (TLP) bonding was used to fabricate autogenous joints in a magnesium alloy AZ31 with the aid of a pure Ni interlayer. A $13{\mu}m$ thick pure Ni foil was used in order to form a Mg-Ni eutectic liquid at the joint interface. The interface of reaction and composition profiles were investigated as a function of bonding time using a pressure of 0.16 MPa and a bonding temperature of $515^{\circ}C$. The quality of the joints produced was examined by metallurgical characterization and the joint microstructure developed across the diffusion bonds was related to changes in mechanical properties as a function of the bonding time.

• 한국분말재료학회지
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• 제10권1호
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• pp.40-45
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• 2003

Sintering behavior of 2xxx series Al alloy was investigated to obtain full densification and sound microstructure. The commercial 2xxx series Al alloy powder. AMB2712, was used as a starting powder. The mixing powder was characterized by using particle size analyzer, SEM and XRD. The optimum compacting pressure was 200 MPa, which was the starting point of the "homogeneous deformation" stage. The powder compacts were sintered at $550~630^{\circ}C$ after burn-off process at $400^{\circ}C$. Swelling phenomenon caused by transient liquid phase sintering was observed below $590^{\circ}C$ of sintering temperature. At $610^{\circ}C$, sintering density was increased by effect of remained liquid phase. Further densification was not observed above $610^{\circ}C$. Therefore, it was determined that the optimum sintering temperature of AMB2712 powder was $610^{\circ}C$.}C$.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 춘계학술대회논문집
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• pp.236-239
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• 2008

In the present study, a transient glass particle distribution in a stirred solid/liquid mixer was investigated using computational fluid dynamics(CFD). The flow patterns and solid concentaration distriburion in a solid/liquid mixer formed by pitched paddle and baffles were predicted. The numerical results were compared to experimental data from the available literature. Eulerian multi-phase model was used to investigate the influence of the density of solid particle on the same impeller speed. A good agreement was obtained between the experimental data and simulation results.

• 대한기계학회논문집B
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• 제24권6호
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• pp.792-801
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• 2000

The problem of phase change from liquid to solid in the inviscid plane-stagnation flow is theoretically investigated. The solution at the initial stage of freezing is obtained by expanding it in powers of time, and the final equilibrium state is determined from the steady-state governing equations. The transient solution is dependent on the three dimensionless parameters, but the equilibrium state is determined by one parameter of (temperature ratio/conductivity ratio). The effect of the fluid flow on the growth rate of the solid in the pure conduction problem can be clearly seen from the solution of the initial stage and the final equilibrium state. The characteristics of the transient heat transfer at the surface of the solid and the liquid side of the solid-liquid interface for all the dimensionless parameters are elucidated.

• 항공우주시스템공학회지
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• 제4권1호
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• pp.1-9
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• 2010

As the rocket KSLV-1 called NARO was launched lately, development of domestic rocket technology has been accelerated elastically. Since the rocket technology needs a lot of empirical data, a variety of experiments should be done and lots of time have to be spent for accumulating the foundation of technology. However using a computer can be the solution to close a gap of technique because the simulation can be executed in short time against real experiments and calculate a multiplicity of cases easily. In this research, the transient analysis of turbopump-fed liquid rocket system was worked by the one dimensional modeling. The rocket system consists of the modulized components that are engine, turbopump and so on. For 70 ton class system, the rocket transient process of starting was studied and the performance analysis in steady condition was achieved. In addition, the estimation of nozzle internal flow was investigated by using a nozzle coefficient.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2010년도 제34회 춘계학술대회논문집
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• pp.34-37
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• 2010

터보펌프식 액체 로켓 엔진에 대해 AMESim을 이용하여 1-D 시스템을 구성하고 시동 과도 특성을 해석하였다. 액체산소와 RP-1을 추진제로 사용하는 개방형 사이클에 대해 해석을 수행하였으며, 초기 시동시 가스발생기의 연료 밸브 개방 및 가스발생기 점화 타이밍과 시동 안정성의 관계에 관한 결과를 얻었다. 이러한 연구를 바탕으로 터보펌프식 액체 로켓 엔진 시스템의 최적 설계를 위해 시동시 특성 및 시동 절차를 고려해야 함을 확인 하였다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.557-558
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• 2006

In all conventional sintered PM products, the pores present are of two types, primary and secondary. Primary pores forming during compaction and latter during sintering, due to penetration of formed liquid through the matrix grain boundary. Effect of carbon addition on diffusion of Cu in SH737-2Cu system was investigated. After compaction and transient liquid phase sintering at $1120^{\circ}C$ and $1180^{\circ}C$, samples were characterized for densification, showing rise in sintering density and reduction in swelling on carbon addition. Quantitative microstructural characterization (shape factor and pore size) revealed bimodal distribution for 0% carbon, more rounded pores for 0.9% carbon and higher sintering temperature, and pore coarsening at higher sintering temperature.

• 한국분말재료학회지
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• 제9권3호
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• pp.189-198
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• 2002

In this work, transient liquid phase (TLP) bonding of Ni-Cr heat resisted cast alloy (HP) was investigated. And also the behaviors of the solid particles distributed in the interlayer during TLP bonding were investigated. The MBF-60 and solid particles (Ni, Fe, and $Al_2O_3$ powders respectively) added MBF-60 which will be a liquid phase coexisting with solid particles at the bonding temperature were used as insert metal. The effective and sound bonding was possible by spark plasma sinter-bonding due to the differences of electric resistance between base metal and liquid insert layer which creates high temperature region. During the isothermal solidification, $Al_2O_3$ particles and solid particles of liquid phase sintered insert metal have shown no growth, while Ni and Fe particles grow rapidly. In this TLP bonding using the MBF-60 and distributed Fe, Ni particles as insert materials, the whole isothermal solidification process was dominated by the growth rate of the solid particles distributed in the interlayer.